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Description for 3M Electrically Conductive Adhesive Transfer Tape 9703
A pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. It offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films.Application Type Bond Material Form Transfer tape Substrate Aluminum, Copper, DuPont™ Kapton Polyester films, Stainless steel, Gold, DuPont™ Kapton Polyimide films, FR-4 epoxy, Metal Industry Medium pitch flexible circuits, Polyester flex circuit splicing, Ideal for interconnection of flexible circuits with rigid printed circuit boards (PCB), Keyboard manufacturing, Ideal for interconnection of flexible circuits with LCD screens, LCD assembly, Ideal for interconnection of flexible circuits with other flexible circuits (flex), Also ideal for EMI/RFI shield applications Manufacturer 3M Chemistry Acrylic Cure Method Pressure Sensitive, Heat Application Temperature (°F) 60 to 158 Carrier Thickness (mm) 0.051 Adhesive Thickness (Liner Side) - Double Sided Tapes (mm) 0.051 Liner Thickness (mm) 0.102 Kraft Liner Type: Silicone Treated Polycoated Kraft Paper High Temperature Resistance (°C) 85 Low Temperature Resistance (°C) -40 Other Resistance Low contact resistance Tape Backing/Carrier PET backing -
Technical Data for 3M Electrically Conductive Adhesive Transfer Tape 9703
Overview
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Application Type
- Adhesive - Bond
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Material Form
- Tape - Transfer tape
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Substrate
- Metal
- Aluminum
- Copper
- Gold
- Polyimide (PI) - DuPont™ Kapton Polyimide films
- Epoxy - FR-4 epoxy
- Polyester - DuPont™ Kapton Polyester films
- Stainless Steel
- Other - EMI substrates, Smooth gasket materials, Common PCB substrates, RFI substrates
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Industry
- Keyboards - Keyboard manufacturing
- Electronics - Medium pitch flexible circuits, Ideal for interconnection of flexible circuits with LCD screens, LCD assembly, Ideal for interconnection of flexible circuits with other flexible circuits (flex), Also ideal for EMI/RFI shield applications
- Printed Circuit Board (PCB) - Ideal for interconnection of flexible circuits with rigid printed circuit boards (PCB)
- Industrial - Easy to use in assembly operations
- Splicing - Polyester flex circuit splicing
- Other - Also ideal for gasket attachment applications
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Chemistry
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Application Method
- Contact
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Cure Method
- Pressure Sensitive (min) - Pressure Sensitive
- Heat
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Tape Backing/Carrier
- Polyester (PET) - PET backing
Specifications
Cure Specs
Application Temperature (°F) 60 to 158 Bond Strength
General Bond Strength (psi) Good adhesion Peel Strength (piw) > 35 (oz./in.), 50 (oz./in.), 55 (oz./in.), 50 (oz./in.), 60 (oz./in.), 65 (oz./in.), 29 (oz./in.), 32 (oz./in.) Test Method Tape Properties
Carrier Thickness (mm) 0.051 Adhesive Thickness (Liner Side) - Double Sided Tapes (mm) 0.051 Liner Thickness (mm) 0.102 Material Resistance
High Temperature Resistance (°C) 85 Low Temperature Resistance (°C) -40 Other Resistance Low contact resistance Conductivity
Filler Filled Insulation Resistance (O) 3.4e14 (ohms/square) Test Method Electrical Conductivity (mhos/cm) Anisotropic electrical conductivity Other Properties
Outgassing 0.7%, 0.01% Test Method Business Information
Shelf Life Details 24 months from the shipment date from the manufacturing location when stored in original packaging at 21°C (70°F) and 50% relative humidity. Shelf Life Temperature (°F) 70 Shelf Life (mon) 24 -
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Best Practices for 3M Electrically Conductive Adhesive Transfer Tape 9703
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Surface Preparation
To obtain maximum adhesion, the bonding surfaces must be clean and dry.
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Application
Pressure must be applied to the bond line after assembly to wet the substrates with 3M™ Electrically Conductive Adhesive Transfer Tape (ECATT) 9703 and to engage the conductive particles with the substrates to make electrical connection. Mechanical pressure (roller, metal bar) or finger pressure at 15 psi (0.10 Mpa) or greater is suggested. Heat may be applied simultaneously to improve wetting and final bond strength.
3M ECATT 9703 should be applied between 60°F - 158°F (15°C - 70°C). Tape application below 50°F (10°C) is not recommended because the adhesive will be too firm to wet the surface of the substrate, resulting in low adhesion.
Adhesion builds with time, up to 24 hours may be required to reach final adhesion values.
Temperature Performance: The electrical performance of 3M™ Electrically Conductive Adhesive Transfer Tape (ECATT) 9703 is more sensitive to temperature than the peel performance. 3M ECATT 9703 is not recommended for high or low temperature excursions where the electrical performance might be compromised, even if holding power is not affected. The user is responsible for the temperature performance qualification of 3M ECATT 9703 in their design. Contact your 3M Technical Service Representative for further information about the temperature performance of 3M ECATT 9703.
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Removal
Mechanically separate the parts using torque for rigid parts and peel for flexible ones. Remove the adhesive by rubbing it off with a Scotch-Brite® Hand Pad, clean up the site and apply new adhesive. The force needed to separate the parts and/or remove the adhesive can be reduced by softening the adhesive by heating 158°F - 212°F (70°C - 100°C) or using solvents.
Note: When using solvents, be sure to follow the manufacturer’s precautions and directions for use when handling such materials.
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Comparable Materials for 3M Electrically Conductive Adhesive Transfer Tape 9703
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Peel Strength Test Methods
Peel Strength | Substrate | Test Time | Test Temperature | Test Method |
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> 35 (oz./in.) | Stainless steel | 15 min | 23°C | ASTM D3330, 2 mil Aluminum foil used as backing. |
50 (oz./in.) | Stainless steel | 60 min | 23°C | ASTM D3330, 2 mil Aluminum foil used as backing. |
55 (oz./in.) | Stainless steel | 1,440 min | 23°C | ASTM D3330, 2 mil Aluminum foil used as backing. |
50 (oz./in.) | Stainless steel | 15 min | 70°C | ASTM D3330, 2 mil Aluminum foil used as backing. |
60 (oz./in.) | Stainless steel | 60 min | 70°C | ASTM D3330, 2 mil Aluminum foil used as backing. |
65 (oz./in.) | Stainless steel | 1,440 min | 70°C | ASTM D3330, 2 mil Aluminum foil used as backing. |
29 (oz./in.) | Stainless steel | 60 min Dwell Time | 23°C Room Temperature | Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing, 180 degree |
32 (oz./in.) | Stainless steel | 1,440 min Dwell Time | 23°C Room Temperature | Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing, 180 degree |
Insulation Resistance Test Methods
Insulation Resistance | Test Method |
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3.4e14 (ohms/square) | Tested in accordance with ASTM D-257 test method., Estimate based on 3M™ Electrically Conductive Adhesive Transfer Tape 9703 test data. |
Outgassing Test Methods
Outgassing | Temperature (°C) | Test Method |
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0.7% | 125°C | NASA SP-R-0022 or ASTM E595, 24 hrs, 2 x 10-6 Torr vacuum, Total Mass Loss (TML) |
0.01% | 125°C | NASA SP-R-0022 or ASTM E595, 24 hrs, 2 x 10-6 Torr vacuum, Collected Volatile Condensable Materials (CVCM) |

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