3M Electrically Conductive Adhesive Transfer Tape 9703 Datasheet 3M Electrically Conductive Adhesive Transfer Tape 9703

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  • Description for 3M Electrically Conductive Adhesive Transfer Tape 9703

    A pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. It offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films.

    *See Terms of Use Below

    Application Type Bond
    Material Form Transfer tape
    Substrate Aluminum, Copper, DuPont™ Kapton Polyester films, Stainless steel, Gold, DuPont™ Kapton Polyimide films, FR-4 epoxy, Metal
    Industry Medium pitch flexible circuits, Polyester flex circuit splicing, Ideal for interconnection of flexible circuits with rigid printed circuit boards (PCB), Keyboard manufacturing, Ideal for interconnection of flexible circuits with LCD screens, LCD assembly, Ideal for interconnection of flexible circuits with other flexible circuits (flex), Also ideal for EMI/RFI shield applications
    Manufacturer 3M
    Chemistry Acrylic
    Cure Method Pressure Sensitive, Heat
    Application Temperature (°F) 60 to 158
    Carrier Thickness (mm) 0.051
    Adhesive Thickness (Liner Side) - Double Sided Tapes (mm) 0.051
    Liner Thickness (mm) 0.102
    Kraft Liner Type: Silicone Treated Polycoated Kraft Paper
    High Temperature Resistance (°C) 85
    Low Temperature Resistance (°C) -40
    Other Resistance Low contact resistance
    Tape Backing/Carrier PET backing

  • Technical Data for 3M Electrically Conductive Adhesive Transfer Tape 9703

    *See Terms of Use Below

    Overview
    • Application Type
    • Material Form
      • Tape - Transfer tape
    • Substrate
      • Metal
      • Aluminum
      • Copper
      • Gold
      • Polyimide (PI) - DuPont™ Kapton Polyimide films
      • Epoxy - FR-4 epoxy
      • Polyester - DuPont™ Kapton Polyester films
      • Stainless Steel
      • Other - EMI substrates, Smooth gasket materials, Common PCB substrates, RFI substrates
    • Industry
      • Keyboards - Keyboard manufacturing
      • Electronics - Medium pitch flexible circuits, Ideal for interconnection of flexible circuits with LCD screens, LCD assembly, Ideal for interconnection of flexible circuits with other flexible circuits (flex), Also ideal for EMI/RFI shield applications
      • Printed Circuit Board (PCB) - Ideal for interconnection of flexible circuits with rigid printed circuit boards (PCB)
      • Industrial - Easy to use in assembly operations
      • Splicing - Polyester flex circuit splicing
      • Other - Also ideal for gasket attachment applications
    • Chemistry
    • Application Method
      • Contact
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
      • Heat
    • Tape Backing/Carrier
      • Polyester (PET) - PET backing
    Specifications
    Cure Specs
    Application Temperature (°F) 60 to 158
    Bond Strength
    General Bond Strength (psi) Good adhesion
    Peel Strength (piw) > 35 (oz./in.), 50 (oz./in.), 55 (oz./in.), 50 (oz./in.), 60 (oz./in.), 65 (oz./in.), 29 (oz./in.), 32 (oz./in.) Test Method
    Tape Properties
    Carrier Thickness (mm) 0.051
    Adhesive Thickness (Liner Side) - Double Sided Tapes (mm) 0.051
    Liner Thickness (mm) 0.102
    Material Resistance
    High Temperature Resistance (°C) 85
    Low Temperature Resistance (°C) -40
    Other Resistance Low contact resistance
    Conductivity
    Filler Filled
    Insulation Resistance (O) 3.4e14 (ohms/square) Test Method
    Electrical Conductivity (mhos/cm) Anisotropic electrical conductivity
    Other Properties
    Outgassing 0.7%, 0.01% Test Method
    Business Information
    Shelf Life Details 24 months from the shipment date from the manufacturing location when stored in original packaging at 21°C (70°F) and 50% relative humidity.
    Shelf Life Temperature (°F) 70
    Shelf Life (mon) 24

  • Best Practices for 3M Electrically Conductive Adhesive Transfer Tape 9703

    *See Terms of Use Below

    1. Surface Preparation

      To obtain maximum adhesion, the bonding surfaces must be clean and dry.

    2. Application

      Pressure must be applied to the bond line after assembly to wet the substrates with 3M™ Electrically Conductive Adhesive Transfer Tape (ECATT) 9703 and to engage the conductive particles with the substrates to make electrical connection. Mechanical pressure (roller, metal bar) or finger pressure at 15 psi (0.10 Mpa) or greater is suggested. Heat may be applied simultaneously to improve wetting and final bond strength.

      3M ECATT 9703 should be applied between 60°F - 158°F (15°C - 70°C). Tape application below 50°F (10°C) is not recommended because the adhesive will be too firm to wet the surface of the substrate, resulting in low adhesion.

      Adhesion builds with time, up to 24 hours may be required to reach final adhesion values.

      Temperature Performance: The electrical performance of 3M™ Electrically Conductive Adhesive Transfer Tape (ECATT) 9703 is more sensitive to temperature than the peel performance. 3M ECATT 9703 is not recommended for high or low temperature excursions where the electrical performance might be compromised, even if holding power is not affected. The user is responsible for the temperature performance qualification of 3M ECATT 9703 in their design. Contact your 3M Technical Service Representative for further information about the temperature performance of 3M ECATT 9703.

    3. Removal

      Mechanically separate the parts using torque for rigid parts and peel for flexible ones. Remove the adhesive by rubbing it off with a Scotch-Brite® Hand Pad, clean up the site and apply new adhesive. The force needed to separate the parts and/or remove the adhesive can be reduced by softening the adhesive by heating 158°F - 212°F (70°C - 100°C) or using solvents.

      Note: When using solvents, be sure to follow the manufacturer’s precautions and directions for use when handling such materials.

  • Comparable Materials for 3M Electrically Conductive Adhesive Transfer Tape 9703

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Peel Strength Test Methods
Peel Strength Substrate Test Time Test Temperature Test Method
> 35 (oz./in.) Stainless steel 15 min 23°C ASTM D3330, 2 mil Aluminum foil used as backing.
50 (oz./in.) Stainless steel 60 min 23°C ASTM D3330, 2 mil Aluminum foil used as backing.
55 (oz./in.) Stainless steel 1,440 min 23°C ASTM D3330, 2 mil Aluminum foil used as backing.
50 (oz./in.) Stainless steel 15 min 70°C ASTM D3330, 2 mil Aluminum foil used as backing.
60 (oz./in.) Stainless steel 60 min 70°C ASTM D3330, 2 mil Aluminum foil used as backing.
65 (oz./in.) Stainless steel 1,440 min 70°C ASTM D3330, 2 mil Aluminum foil used as backing.
29 (oz./in.) Stainless steel 60 min Dwell Time 23°C Room Temperature Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing, 180 degree
32 (oz./in.) Stainless steel 1,440 min Dwell Time 23°C Room Temperature Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing, 180 degree
Insulation Resistance Test Methods
Insulation Resistance Test Method
3.4e14 (ohms/square) Tested in accordance with ASTM D-257 test method., Estimate based on 3M™ Electrically Conductive Adhesive Transfer Tape 9703 test data.
Outgassing Test Methods
Outgassing Temperature (°C) Test Method
0.7% 125°C NASA SP-R-0022 or ASTM E595, 24 hrs, 2 x 10-6 Torr vacuum, Total Mass Loss (TML)
0.01% 125°C NASA SP-R-0022 or ASTM E595, 24 hrs, 2 x 10-6 Torr vacuum, Collected Volatile Condensable Materials (CVCM)