3M EZ250060

Surface Preparation

Apply to clean, dry surfaces. Remove oil, grease and other contaminants by wiping with isopropyl alcohol. For fiber reinforced plastics and other materials that are often contaminated with mold release agents, it is recommended that the surface be solvent wiped, abraded and solvent wiped. For additional information, see section on surface preparation. After heating to recommended application temperature, apply adequate amount of 3M™ Scotch-Weld™ Polyurethane Reactive (PUR) Easy 250 Plastic Adhesive to one of the substrates to be bonded. Join the substrates within the adhesives specified open time and hold/fixture the bonded part until the adhesive has adequately set. Do not use to bond metal or glass to itself or each other or cure will not occur due to low moisture vapor transmission of the substrate.

Note: When using solvents, extinguish all ignition sources, including pilot lights, and follow the manufacturer’s precautions and directions for use.

All wood should be dry and free of contaminants such as sawdust, dirt or other substances that may interfere with the adhesive bonding process. If the surface to be bonded contains a coating or finish, bonds should be made and evaluated to ensure proper adhesion. It may be necessary to evaluate other 3M™ Scotch-Weld™ Polyurethane Reactive (PUR) Easy 250 Plastic Adhesive products that are better suited to bond plastic surfaces.

Application

Apply to clean, dry surfaces. Remove oil, grease and other contaminants by wiping with isopropyl alcohol. For fiber reinforced plastics and other materials that are often contaminated with mold release agents, it is recommended that the surface be solvent wiped, abraded and solvent wiped. For additional information, see section on surface preparation. After heating to recommended application temperature, apply adequate amount of 3M™ Scotch-Weld™ Polyurethane Reactive (PUR) Easy 250 Plastic Adhesive to one of the substrates to be bonded. Join the substrates within the adhesives specified open time and hold/fixture the bonded part until the adhesive has adequately set.

Do not use to bond metal or glass to itself or each other or cure will not occur due to low moisture vapor transmission of the substrate.

(Important: Adhesive heated at application temperature for more than 16 hours should be discarded.)

Curing

The cure rate will vary depending on air temperature, relative humidity, substrate type and bond line thickness. Cure rate is more rapid on wood (moisture rich substrate) than on plastic.

With the exception of rate of strength build-up, all bonds, unless otherwise noted, were cured for a minimum period of 7 days at 77°F (25°C)/50% RH before testing or subjecting to further conditioning or environmental aging. Bonds were prepared using the suggested procedure for the particular substrate tested

Clean-Up

Allow products to solidify. Remove uncured waxy material (usually within the first 20 minutes after application) by scraping with a putty knife or similar tool. For cured material, remove by cutting or sanding. Do not use heat or flame to remove adhesive.

Testing

With the exception of rate of strength build-up, all bonds, unless otherwise noted, were cured for a minimum period of 7 days at 77°F (25°C)/50% RH before testing or subjecting to further conditioning or environmental aging. Bonds were prepared using the suggested procedure for the particular substrate tested.