| Application Type | Bond |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Liquid |
| Substrate | select plastics, Wood, maple |
| Manufacturer | 3M |
| Chemistry | Urethane |
| Cure Method | Moisture |
| Viscosity (cPs) | low, 7,000 |
| Color | Off-White, White |
| Density (g/cm³) | 8.8 (Lbs/Gallon) |
Apply to clean, dry surfaces. Remove oil, grease and other contaminants by wiping with isopropyl alcohol. For fiber reinforced plastics and other materials that are often contaminated with mold release agents, it is recommended that the surface be solvent wiped, abraded and solvent wiped. For additional information, see section on surface preparation. After heating to recommended application temperature, apply adequate amount of 3M™ Scotch-Weld™ Polyurethane Reactive (PUR) Easy 250 Plastic Adhesive to one of the substrates to be bonded. Join the substrates within the adhesives specified open time and hold/fixture the bonded part until the adhesive has adequately set. Do not use to bond metal or glass to itself or each other or cure will not occur due to low moisture vapor transmission of the substrate.
Note: When using solvents, extinguish all ignition sources, including pilot lights, and follow the manufacturer’s precautions and directions for use.
All wood should be dry and free of contaminants such as sawdust, dirt or other substances that may interfere with the adhesive bonding process. If the surface to be bonded contains a coating or finish, bonds should be made and evaluated to ensure proper adhesion. It may be necessary to evaluate other 3M™ Scotch-Weld™ Polyurethane Reactive (PUR) Easy 250 Plastic Adhesive products that are better suited to bond plastic surfaces.
Apply to clean, dry surfaces. Remove oil, grease and other contaminants by wiping with isopropyl alcohol. For fiber reinforced plastics and other materials that are often contaminated with mold release agents, it is recommended that the surface be solvent wiped, abraded and solvent wiped. For additional information, see section on surface preparation. After heating to recommended application temperature, apply adequate amount of 3M™ Scotch-Weld™ Polyurethane Reactive (PUR) Easy 250 Plastic Adhesive to one of the substrates to be bonded. Join the substrates within the adhesives specified open time and hold/fixture the bonded part until the adhesive has adequately set.
Do not use to bond metal or glass to itself or each other or cure will not occur due to low moisture vapor transmission of the substrate.
(Important: Adhesive heated at application temperature for more than 16 hours should be discarded.)
The cure rate will vary depending on air temperature, relative humidity, substrate type and bond line thickness. Cure rate is more rapid on wood (moisture rich substrate) than on plastic.
With the exception of rate of strength build-up, all bonds, unless otherwise noted, were cured for a minimum period of 7 days at 77°F (25°C)/50% RH before testing or subjecting to further conditioning or environmental aging. Bonds were prepared using the suggested procedure for the particular substrate tested
Allow products to solidify. Remove uncured waxy material (usually within the first 20 minutes after application) by scraping with a putty knife or similar tool. For cured material, remove by cutting or sanding. Do not use heat or flame to remove adhesive.
With the exception of rate of strength build-up, all bonds, unless otherwise noted, were cured for a minimum period of 7 days at 77°F (25°C)/50% RH before testing or subjecting to further conditioning or environmental aging. Bonds were prepared using the suggested procedure for the particular substrate tested.
| elit euismod consectetuer dolor. | dolor. | laoreet erat. |
|---|---|---|
| nonummy adipiscing sed. | consectetuer. | dolor. |
| ut euismod sit. | aliquam. | aliquam. |
| laoreet. | diam nonummy amet. | laoreet amet. |
| dolore magna. | elit aliquam. | euismod dolore. |
| elit nonummy. | aliquam. | aliquam elit. |
| lorem amet sit magna. | sit erat erat. | nibh diam. |
|---|---|---|
| consectetuer magna nonummy adipiscing. | lorem tincidunt dolor. | ut ipsum. |
| sit. | diam. | lorem. |
| adipiscing. | euismod. | tincidunt elit. |
| ut. | sit. | elit. |
| erat sed laoreet dolore. | nibh nibh. | laoreet. |
| laoreet. | nibh dolor. | consectetuer magna. |
| euismod. | nibh euismod tincidunt. | euismod amet. |
|---|---|---|
| adipiscing adipiscing. | elit. | magna dolore. |
| nonummy magna tincidunt. | laoreet tincidunt. | laoreet. |
| amet ut erat ut. | aliquam amet elit. | nibh lorem. |
| dolor lorem ipsum erat. | nibh tincidunt diam. | euismod. |
| sit magna sit. | aliquam sed sed. | dolor. |
| aliquam euismod nonummy. | amet. | amet laoreet. |
| dolore diam adipiscing erat. | lorem aliquam. | euismod ipsum. |
|---|---|---|
| laoreet amet diam aliquam. | sit euismod sit. | dolor amet. |
| ipsum euismod. | ut amet. | elit. |
| euismod consectetuer. | aliquam. | dolore. |
| nibh. | consectetuer. | dolore adipiscing. |
| amet dolore. | erat ipsum. | dolore. |
|---|---|---|
| tincidunt erat ipsum. | magna euismod laoreet. | nonummy amet. |
| erat euismod nonummy dolore. | ut consectetuer. | ut diam. |
| lorem. | ut lorem euismod. | sit. |
| sit nibh consectetuer magna. | magna erat nibh. | ipsum. |
| nonummy laoreet. | ipsum ipsum. | amet ut. |
| magna. | sed. | adipiscing. |
| euismod magna nonummy. | aliquam tincidunt dolore. | diam amet. |
| lorem. | elit tincidunt. | ipsum dolor. |
|---|---|---|
| elit ipsum. | tincidunt euismod consectetuer. | dolore amet. |
| ut. | euismod. | nonummy. |
| consectetuer aliquam diam euismod. | sed. | tincidunt. |
diam elit sit erat consectetuer laoreet diam consectetuer consectetuer dolore diam. nibh dolore erat aliquam nibh amet magna elit dolore tincidunt elit. nonummy nibh elit tincidunt magna laoreet ipsum sed erat magna consectetuer. ipsum dolore nibh adipiscing euismod tincidunt lorem ut sit diam elit. magna dolor laoreet laoreet amet ipsum sed tincidunt ipsum lorem lorem.
euismod nibh magna ut sit magna magna euismod consectetuer ut. sit elit consectetuer nibh sit adipiscing dolor nonummy aliquam dolor. tincidunt consectetuer aliquam dolor nibh erat erat consectetuer laoreet consectetuer. ipsum ut ut ut lorem dolor sit erat erat nibh. diam consectetuer magna lorem nibh dolore dolore dolore diam ut.
sit magna euismod dolore erat tincidunt sed. euismod nonummy nonummy lorem sit dolor nonummy. adipiscing tincidunt sed elit aliquam nibh ut. sit sit laoreet ipsum elit nibh nibh.
diam sed dolore dolore ut magna sed magna adipiscing sit. amet adipiscing consectetuer sed nonummy laoreet erat dolore lorem diam. erat ut sit diam lorem ut dolore laoreet euismod ipsum. magna euismod tincidunt magna nibh laoreet adipiscing ut euismod laoreet. lorem nonummy nibh elit nonummy dolore magna adipiscing nonummy nibh.
amet amet adipiscing euismod tincidunt sed magna laoreet sed amet. amet amet sed sed dolor laoreet aliquam sit magna diam.
dolor euismod consectetuer dolor laoreet nonummy erat aliquam euismod. laoreet elit consectetuer elit ipsum magna sit sed sed.
nibh dolor nonummy sed sit laoreet sit lorem. sed consectetuer dolor amet diam adipiscing euismod diam. ipsum dolor laoreet ut ipsum lorem sed ipsum.
nibh adipiscing diam amet aliquam dolor. nibh aliquam magna laoreet sit adipiscing.
magna consectetuer magna dolor magna ut. elit nibh ut diam erat consectetuer. tincidunt nibh sit dolor sed erat. dolor magna erat dolor amet sit.
| Set Time | Test Method |
|---|---|
| medium | |
| 1.00 min | The minimum amount of time required between when the bond is made and when it will support a 5 psi tensile load |
| Viscosity | Test Method | Temperature |
|---|---|---|
| low | ||
| 7,000 cPs | Measured on Brookfield viscometer with Thermosel using spindle #27. | 121°C |
| Work / Pot Time | Test Method |
|---|---|
| 2.00 min | The bonding range of a 1/8" bead of molten adhesive on a non-metallic substrate |
| Shear Strength | Type | Substrate | Test Temperature | Test Method |
|---|---|---|---|---|
| 1,910 psi | Overlap shear Strength | Maple | 23°C | Overlap shear (OLS) strengths were measured on 1" wide 1/2" overlap specimens. These bonds were made individually using 1" x 4" sample coupons. The thickness of the bond line was .003-.006". The thickness of the Maple, .375". The separation rate of the testing jaws was 2" per minute |
| 380 psi | Overlap shear Strength | Maple | 82°C | Overlap shear (OLS) strengths were measured on 1" wide 1/2" overlap specimens. These bonds were made individually using 1" x 4" sample coupons. The thickness of the bond line was .003-.006". The thickness of the Maple, .375". The separation rate of the testing jaws was 2" per minute |
| Tensile Strength | Cure Time | Cure Temperature | Cure Humidity | Test Method |
|---|---|---|---|---|
| 4,200 psi | 10,080 min | 25°C | 1 % | ASTM D638, Die C, measured on .011" - .012" thick films cured for a minmum of 7 days at 77°F (25°C)/50% relative humidity (RH), @ Break(2). |
| General Bond Strength | Cure Time | Cure Temperature | Cure Humidity | Substrate | Test Time | Test Temperature | Test Method |
|---|---|---|---|---|---|---|---|
| Rapid | |||||||
| 1,210 psi | 10,080 min | 25°C | 50 % | Maple | 10 min | 23°C | Maple Overlap Shear Strength (psi) tested @ 73°F (23°C) at various times after bonding. The Maple was conditioned for 7 days at 77°F (25°C)/50% RH prior to bonding |
| 1,725 psi | 10,080 min | 25°C | 50 % | Maple | 60 min | 23°C | Maple Overlap Shear Strength (psi) tested @ 73°F (23°C) at various times after bonding. The Maple was conditioned for 7 days at 77°F (25°C)/50% RH prior to bonding |
| 1,845 psi | 10,080 min | 25°C | 50 % | Maple | 1,440 min | 23°C | Maple Overlap Shear Strength (psi) tested @ 73°F (23°C) at various times after bonding. The Maple was conditioned for 7 days at 77°F (25°C)/50% RH prior to bonding |
| 1,830 psi | 10,080 min | 25°C | 50 % | Maple | 4,320 min | 23°C | Maple Overlap Shear Strength (psi) tested @ 73°F (23°C) at various times after bonding. The Maple was conditioned for 7 days at 77°F (25°C)/50% RH prior to bonding |
| 1,910 psi | 10,080 min | 25°C | 50 % | Maple | 10,080 min | 23°C | Maple Overlap Shear Strength (psi) tested @ 73°F (23°C) at various times after bonding. The Maple was conditioned for 7 days at 77°F (25°C)/50% RH prior to bonding |
| Elongation | Test Method |
|---|---|
| 675 % | ASTM D638, Die C, measured on .011" - .012" thick films cured for a minmum of 7 days at 77°F (25°C)/50% relative humidity (RH)., at Break |
| Shore D Hardness | Shore Hardness Test Method |
|---|---|
| 60 | Measured on .090" - .110" thick bars |
Message sent - We'll get back shortly
Message sent - We'll get back shortly! Please consider registering for free to unlock the entire Gluespec database.
Great! Contact us if you have any additional questions.
You will lose your saved materials unless you register. Please register.
| Manufacturer | Material | Remove |
|---|
Things you can do with checked materials:
| Name | Save Date | View |
|---|
Need help? Our knowledgeable experts help you achieve your goals by giving you application insights. They are available personally to help you before, during or after your search.
