• Description for 3M F9459 PC

    Excellent long term holding power with much higher adhesion strength.

    *See Terms of Use Below

    Chemical Resistance Acetone, Chemical Resistance: Solvent, Ammonia cleaner, Chemical Resistance: Methyl ethyl ketone, Fluid, Gasoline, JP-4 fuel, Motor oil, Mineral spirits
    Application Type Bond, Hold
    1 Part or 2 Part 1-Part
    Material Form Adhesive Transfer Tape
    Substrate Ceramic, Glass, ThermoPlastic, Polycarbonate, UnPlasticized PVC, Enameled Steel, Stainless Steel, Phenolic, Galvanized Steel, Epoxy, Galvanized Steel, ABS, Nickel Plated Steel
    Industry Rivets
    Manufacturer 3M
    Chemistry Isopropyl alcohol
    Cure Method Pressure sensitive
    Application Temperature (°F) 70 to 100
    Color Clear
    High Temperature Resistance (°C) 149, 260
    Density (g/cm³) 0.980, 1.107
    Key Specifications UL 746C
  • Technical Data for 3M F9459 PC

    • Chemical Resistance
      • Chemical Resistance - Acetone, Ammonia cleaner, Fluid, Gasoline, JP-4 fuel, Mineral spirits, Motor oil
      • Chemical Resistance : Relative Solvent Resistance - Methyl ethyl ketone, Solvent
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Tape - Adhesive Transfer Tape
    • Substrate
    • Industry
      • Rivet - Rivets
      • Industrial - Fasteners, Foils, Spot Welds
    • Chemistry
      • Other - Isopropyl alcohol
    • Application Method
      • Dispenser - Application equipment, Pump
      • Roll - Roller
      • Contact
      • Screen Print - Filter
    • Cure Method
      • Pressure Sensitive (min) - Pressure sensitive
    • Color
      • Clear / Transparent - Clear
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL 746C
    Cure Specs
    Application Temperature (°F) 70 to 100
    Bond Strength
    General Bond Strength (psi) Higher
    Peel Strength (piw) 8.0 (Ib/in) Test Method
    Shear Strength (psi) 80, 1000 (grams) Test Method
    Tensile Strength (psi) 100 Test Method
    Material Resistance
    UV Resistance Excellent
    High Temperature Resistance (°C) 149, 260
    Insulation Resistance (O) > 1e6 (megaohms/in2), Insulation resistance Test Method
    Dielectric Strength (V/mil) 118,110,236, 102,362,205, 74,803,150 Test Method
    Thermal Conductivity (W/m°K) 0.16 Test Method
    Other Properties
    Outgassing 1.29 (%TML), 0.02 (%VCM) Test Method
    Coefficient of Thermal Expansion (CTE) 770e-6 (mm/mm /°C)
    Density (g/cm³) 0.980, 1.107
    Business Information
    Shelf Life Details Store in original cartons at 70°F (21°C) and 50% relative humidity.;If stored under proper conditions, products retain their performance and properties for 24 months from date of manufacture. If the products have been exposed to severe weather conditions, we suggest to precondition the products at the above storage conditions for at least 24 hours before using them.
    Shelf Life Temperature (°F) 70
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 24
  • Best Practices for 3M F9459 PC

    *See Terms of Use Below

    1. Surface Preparation

      To obtain optimum adhesion, the bonding surfaces must be clean, dry, and well unified. Some typical surface cleaning solvents are isopropyl alcohol/water mixture or heptane.*

      *Note: Be sure to follow the manufacturer’s precautions and directions for use when using solvents.

    2. Application

      Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure helps develop better adhesive contact and improve bond strength.

      Ideal tape application temperature range is 70°F to 100°F (21°C to 38°C). Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.

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    *See Terms of Use Below

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Peel Strength Test Methods
Peel Strength Substrate Test Method
8.0 (Ib/in) Stainless steel Peel Adhesion to Stainless Steel (ASTM D3330)
Tensile Strength Test Methods
Tensile Strength Substrate Test Method
100 psi Aluminum Normal Tensile to Aluminum (T-Block) (ASTM D-897)
Shear Strength Test Methods
Shear Strength Type Substrate Test Time Test Temperature Test Method
80 psi Dynamic shear strength Stainless steel Dynamic Shear to Stainless Steel (ASTM D-1002)
1000 (grams) Static shear strength Stainless steel <=148.888888888889 (C) Static Shear or Shear Holding Powerto Stainless Steel (ASTM D-3654)
Dielectric Strength Test Methods
Dielectric Strength Temperature Test Method
118,110,236 V/mil 23°C ASTM D-149-97A
102,362,205 V/mil 23°C ASTM D-149-97A
74,803,150 V/mil 23°C ASTM D-149-97A
Insulation Resistance Test Methods
Insulation Resistance Test Method
> 1e6 (megaohms/in2) ASTM D-1000
Insulation resistance
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
0.16 W/m°K ASTM C-177
Outgassing Test Methods
Outgassing Test Method
1.29 (%TML) ASTM E595-77/84/90
0.02 (%VCM) ASTM E595-77/84/90