3M Rite-Lok Low Odor Instant Adhesive LO5

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Description for 3M Rite-Lok Low Odor Instant Adhesive LO5

A very low viscosity low odor cyanoacrylate that is recommended for close-fitting parts. It can be used as a wicking adhesive to provide bonding of pre-assembled parts.

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Application Type	Bond, Adhesive: Instant Adhesives
1 Part or 2 Part	1 Part
Material Form	Liquid
Substrate	Porous substrate surfaces, Polyethylene, Paper, Low surface energy plastics, Polypropylene, Low surface energy plastics
Manufacturer	3M
Chemistry	Cyanoacrylate, Methoxyethyl
Cure Method	Moisture
Viscosity (cPs)	Very low, 3 to 8
Color	Clear
Chemical Resistance	Most oils
Relative Solvent Resistance	Chemical Resistance: Solvent resistance
High Temperature Resistance (°C)	71
Low Temperature Resistance (°C)	-54

Best Practices for 3M Rite-Lok Low Odor Instant Adhesive LO5

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Technical Data for 3M Rite-Lok Low Odor Instant Adhesive LO5

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Overview

Application Type
- Adhesive - Bond
- Adhesive: Instant Adhesives
1 Part or 2 Part
- 1 Part or 2 Part - 1 Part
Material Form
- Liquid
Substrate
- Porous Substrates - Porous substrate surfaces
- Low Surface Energy - Low surface energy plastics
- Plastic - Low surface energy plastics
- Polyethylene (LDPE, HDPE) - Polyethylene
- Polypropylene
- Paper
- Other - Leather, Acidic surfaces
Industry
- Other - close-fitting parts, pre-assembled parts.
Chemistry
- Cyanoacrylate (CA) - Cyanoacrylate
- Other - Methoxyethyl
Application Method
- Other - Hand applied
Cure Method
- Moisture / Condensation Cure - Moisture
Color
- Clear / Transparent - Clear

Specifications

Cure Specs

Viscosity (cPs)	Very low, 3 to 8	Test Method
Fixture or Handling Strength Time (min)	0.08 to 1.00
Set Time (min)	very fast

Bond Strength

Tensile Strength (psi)	1,900	Test Method

Material Resistance

Chemical Resistance	Most oils
Relative Solvent Resistance	Chemical Resistance: Solvent resistance
High Temperature Resistance (°C)	71
Low Temperature Resistance (°C)	-54

Other Properties

Specific Gravity	1.050

Business Information

Shelf Life Details	Storage: For short term storage (<30 days), keep adhesive in a cool (60°F to 80°F [16°C to 27°C]), dry place out of direct sunlight. Keep containers tightly covered and free of moisture. Refrigeration (40°F [4°C]) gives optimum long term storage stability.;Rite-Lok™ Low Odor Instant Adhesives can be expected to have a shelf life of 6 months from the date of shipment from 3M when stored under refrigerated conditions.
Shelf Life Temperature (°F)	140 to 176, 39
Shelf Life Type	From the date of shipment
Shelf Life (mon)	6

Best Practices for 3M Rite-Lok Low Odor Instant Adhesive LO5

*See Terms of Use Below
1. Surface Preparation
  
  For optimum strength structural bonds, paint, oxide films, oils, dust, mold release agents, and all other surface contaminants must be completely removed. However, the amount of surface preparation depends on the required bond strength and the environmental aging resistance desired by the user. Typical quick surface preparation would include wiping with a clean solvent (such as isopropyl alcohol), abrading the surface with a clean fine abrasive, and then wiping again with a clean solvent to remove loose particles.
  
  Note: When using solvents, extinguish all ignition sources, including pilot lights, and follow the manufacturer’s precautions and directions for use.
  
  Ensure that parts are clean, dry, and free from oil and grease.
  
  A Rite-Lok™ Instant Adhesive Activator may be required if there are bonding gaps or porous substrate surfaces, if substrates are low surface energy plastics (e.g., polyethylene, polypropylene) or if substrates have acidic surfaces (e.g., paper, leather).
2. Application
  
  Bond speed is typically very fast so ensure that parts are properly aligned before dispensing.
  
  Product is normally hand applied from the bottle. Apply sparingly to one surface and press parts firmly together until handling strength is achieved. As a general rule, as little cyanoacrylate as possible should be used. Over application will result in slower cure speed and lower bond strength.
3. Curing
  
  Low humidity or low temperature conditions will slow down the cure rate.
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