3M SB95 Rite-Lok Cyanoacrylate

Surface Preparation

For optimum strength structural bonds, paint, oxide films, oils, dust, mold release agents, and all other surface contaminants must be completely removed. However, the amount of surface preparation depends on the required bond strength and the environmental aging resistance desired by the user. Typical quick surface preparation would include wiping with a clean solvent (such as isopropyl alcohol), abrading the surface with a clean fine abrasive, and then wiping again with a clean solvent to remove loose particles. Note: When using solvents, extinguish all ignition sources, including pilot lights, and follow the manufacturer’s precautions and directions for use.

Ensure that parts are clean, dry, and free from oil and grease.

A instant adhesive activator may be required if there are bonding gaps or porous substrate surfaces, if substrates are low surface energy plastics (e.g., polyethylene, polypropylene ) or if substrates have acidic surfaces (e.g., paper, leather ).

Application

Bond speed is typically very fast so ensure that parts are properly aligned before dispensing.

Product is normally hand applied from the bottle. Apply sparingly to one surface and press parts firmly together until handling strength is achieved. As a general rule, as little cyanoacrylate as possible should be used. Over application will result in slower cure speed and lower bond strength.

Curing

Full bond strength will typically be achieved within a 24 hour cure time.

After curing, 3M™ Scotch-Weld™ Surface Insensitive Instant Adhesive bonds are suitable for use up to about 180°F (82°C). At 180°F (82°C) the bonds will be approximately 70% of the strength at room temperature and at 212°F (100°C) about 50% of full strength.

Cyanoacrylate bond resistance to most oils and solvents is excellent. Long term humidity, moisture, or water immersion may affect the strength of a cured cyanoacrylate bond depending on the substrates and the bond gap. Testing is recommended to evaluate the effect.