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Description for 3M Scotch-Weld Urethane Adhesive DP605NS Off-White
It is a two-part, non-sag urethane adhesive. It provides tough, flexible bonds with good adhesion to a wide variety of substrates, especially wood and many properly abraded and cleaned plastics.Chemical Resistance 1, 1, 1-Trichlorethane, Chemical Resistance: Solvent, Acetone, Freon TF, Freon TMC, Isopropyl Alcohol, RMA Flux Application Type Bond 1 Part or 2 Part 2-Part Material Form Liquid Substrate Acrylic, Etched Aluminum, Ceramic, FRP, Glass, Painted metals, Nylon, Plastic, Polycarbonate, PVC, Rubber, Cold rolled Steel, Wood, EPDM, SBR, ABS, Primed Aluminum, Properly cleaned plastic, Rigid PVC , Steel, Aluminum, Properly abraded plastic Manufacturer 3M Chemistry Low halogen, Urethane Cure Method 2-Part Cure Cure Temperature (°C) 23, 73 Cure Time (min) 2,880, 420 Viscosity (cPs) Non-sag Color Off White Aging Resistance Aging resistance Volume Resistivity (O) 1.0e14 (ohms/cm) Durability Tough -
Technical Data for 3M Scotch-Weld Urethane Adhesive DP605NS Off-White
Overview
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Chemical Resistance
- Chemical Resistance - 1, 1, 1-Trichlorethane, Acetone, Freon TF, Freon TMC, Isopropyl Alcohol, RMA Flux
- Chemical Resistance : Relative Solvent Resistance - Solvent
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Application Type
- Adhesive - Bond
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1 Part or 2 Part
- 2-Part
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Material Form
- Liquid
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Substrate
- Ceramic
- Glass
- Metal - Painted metals
- Aluminum - Etched Aluminum, Primed Aluminum
- Steel - Cold rolled Steel
- Plastic - Properly cleaned plastic, Properly abraded plastic
- Acrylic (PMMA) - Acrylic
- Nylon
- Polycarbonate
- Polyvinyl chloride (PVC) - PVC, Rigid PVC
- ABS
- Rubber
- EPM/EPDM - EPDM
- Styrene Butadiene Rubber (SBR) - SBR
- Wood
- Composites - FRP
- Other - HIPS , SMC , A wide variety of substrates
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Chemistry
- Other - Low halogen
- Polyurethane - Urethane
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Application Method
- Dispenser - Static mixer
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Cure Method
- 2-Part Cure
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Color
- Off-White - Off White
Specifications
Cure Specs
Cure Temperature (°C) 23, 73 Test Method Cure Time (min) 2,880, 420 Test Method Viscosity (cPs) Non-sag Test Method Fixture or Handling Strength Time (min) 15 to 20 Test Method Set Time (min) Fast Work / Pot Time (min) Long, 5.00 Test Method Thixotropic Thixotropic Mix Ratio 1:1 (by volume), 1:1 (by weight) Bond Strength
General Bond Strength (psi) Good Peel Strength (piw) 33 Test Method Shear Strength (psi) 1,340, 650, 340, 650, 660, 470, 720, 700, 640, 620, 640, 550 Test Method Material Resistance
Aging Resistance Aging resistance Environmental Resistance Environmental Resistance Conductivity
Dissipation Factor 0.02100 Test Method Dielectric Strength (V/mil) 640 Test Method Dielectric Constant 3.10 Test Method Thermal Conductivity (W/m°K) 0.10 Test Method Volume Resistivity (O) 1.0e14 (ohms/cm) Test Method Hardness
Durability Tough Shore D Hardness 60 to 65 Test Method Elongation (%) 100 Test Method Flexibility Flexible Other Properties
Glass Transition Temp (Tg) (°C) 41 Test Method Outgassing 5% Test Method Coefficient of Thermal Expansion (CTE) 121e-6 (in./ in/°C), 219e-6 (in./ in/°C) Test Method Business Information
Shelf Life Details These products have a shelf life of 12 months in original duo-pak containers at room temperature.Store products at 60-80°F (15-27°C) for maximum shelf life. Shelf Life Temperature (°F) 140 to 176 Shelf Life Type From date of shipment Shelf Life (mon) 12 -
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Best Practices for 3M Scotch-Weld Urethane Adhesive DP605NS Off-White
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Surface Preparation
To prepare 1 liter of this solution, dissolve sodium dichromate in 700 ml of distilled water. Add sulfuric acid and mix well. Add additional distilled water to fill to 1 liter. Heat mixed solution to 66 to 71°C (150 to 160°F).
Dissolve1.5 grams of 2024 bare aluminum chips per liter of mixed solution. Gentleagitation will help aluminum dissolve in about 24 hours.
To FPL etch panels, place them in the above solution at 150 to 160°F (66 to 71°C) for 12 to 15 minutes.
Note: Review and follow precautionary information provided by chemical suppliers prior to preparation of this etch solution.
Rinse immediately in large quantities of clear running tap water.
Dry – air dry approximately 15 minutes followed by force dry at 140°F (60°C) maximum for 10 minutes (minimum).Both surface structure and chemistry play a significant role in determining the strength and permanence of bonded structures. It is therefore advisable to bond or prime freshly primed clean surfaces as soon as possible after surface preparation in order to avoid contamination and/or mechanical damage. Please contact your 3M sales representative for primer recommendations.
Oakite Degrease: Oakite 164 solutions (9-11 oz./gallon of water) at 190°F ± 10°F (88°C ± 5°C) for 2 minutes. Rinse immediately in large quantities of cold running water.
MEK/Abrade/MEK: Wipe surface with a methyl ethyl ketone (MEK) soaked swab, abrade and wipe with a MEK soaked swab.* Allow solvent to evaporate before applying adhesive. *Note: When using solvents, extinguish all ignition sources, including pilot lights, and follow the manufacturer’s precautions and directions for use.
Isopropyl Alcohol Wipe Only Surface Preparation: Wipe surface with an isopropyl alcohol soaked swab.* Allow solvent to evaporate before applying adhesive.
*Note: When using solvents, extinguish all ignition sources, including pilot lights, and follow the manufacturer’s precautions and directions for use.
Isopropyl Alcohol/Abrade/Isopropyl Alcohol Surface Preparation: Wipe surface with an isopropyl alcohol soaked swab, abrade using clean fine grit abrasives, and wipe with an isopropyl alcohol soaked swab.* Then allow solvent to evaporate before applying adhesive.
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Application
3M™ Scotch-Weld™ Urethane Adhesive DP605NS is supplied in dual syringe plastic duo- pak cartridges as part of the 3M™ EPX™ Applicator System. The duo-pak cartridges are supplied in 50 ml and 200 ml configurations. To use the EPX cartridge system simply insert the duo-pak cartridge into the EPX applicator. Next, remove the duo-pak cartridge cap and expel a small amount of adhesive to be sure both sides of the duo-pak cartridge are flowing evenly and freely. If simultaneous mixing of Part A and Part B is desired, attach the EPX mixing nozzle to the duo-pak cartridge and begin dispensing the adhesive.
Apply adhesive to clean, dry surfaces, joint parts and secure until adhesive sets.
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Mixing
When mixing Part A and Part B manually the components must be mixed in the ratio indicated in the typical uncured properties section of this data sheet. Complete mixing of the two components is required to obtain optimum properties.
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Clean-Up
Excess uncured adhesive can be cleaned up with ketone type solvents.*
*Note: When using solvents, extinguish all ignition sources, including pilot lights, and follow the manufacturer’s precautions and directions for use.
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
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23°C | The cure time is defined as that time required for the adhesive to achieve a minimum of 80% of the ultimate strength as measured by aluminum - aluminum OLS. |
73°C | 50% RH before testing or subjected to further conditioning or environmental aging. |
Cure Time Test Methods
Cure Time | Test Method |
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2,880 min | The cure time is defined as that time required for the adhesive to achieve a minimum of 80% of the ultimate strength as measured by aluminum - aluminum OLS. |
420 min | 50% RH before testing or subjected to further conditioning or environmental aging. |
Fixture or Handling Strength Time Test Methods
Fixture or Handling Strength Time | Fixture-Handling Strength Test Method | Fixture-Handling Strength Time Temperature |
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15 to 20 min | Handling strength determined per 3M test method C-3179. Time to handling strength taken to be that time required to achieve 50 psi OLS strength using aluminum substrates. | 23°C |
Viscosity Test Methods
Viscosity | Test Method |
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Non-sag |
Work / Pot Time Test Methods
Work / Pot Time | Test Method | Temperature |
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Long | ||
5.00 min | Uncured, Work Life, 10 g, 1/4" thick | 23°C |
Peel Strength Test Methods
Peel Strength | Type | Substrate | Test Temperature | Test Method |
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33 piw | Floating Roller Peel | Aluminum | 73°C | (ASTM D3167), Bell peel strengths were measured on 1 in. wide bonds at the temperatures noted. The testing jaw separation rate was 6 in. per minute. The bonds were made with 0.064 in. bonded to 0.025 in. thick adherends. |
Shear Strength Test Methods
Shear Strength | Type | Cure Time | Cure Temperature | Substrate | Test Time | Test Temperature | Test Method |
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1,340 psi | Overlap shear strength | 10,080 min | 23°C | Aluminum | -40°C | ASTM D1002, cure at 75°F (24°C) and approximately 50% RH for 1 week before tested. | |
650 psi | Overlap shear strength | 10,080 min | 23°C | Aluminum | 23°C | ASTM D1002, cure at 75°F (24°C) and approximately 50% RH for 1 week before tested. | |
340 psi | Overlap shear strength | 10,080 min | 23°C | Aluminum | 900 sec | 82°C | ASTM D1002, cure at 75°F (24°C) and approximately 50% RH for 1 week before tested. |
650 psi | Overlap shear strength | 10,080 min | 23°C | Aluminum | 23°C | ASTM D1002, MEK/abrade/MEK, cure at 75°F (24°C) and approximately 50% RH for 1 week before tested. | |
660 psi | Overlap shear strength | 10,080 min | 23°C | Cold Rolled Steel | 23°C | ASTM D1002, MEK/abrade/MEK, cure at 75°F (24°C) and approximately 50% RH for 1 week before tested. | |
470 psi | Overlap shear strength | 10,080 min | 23°C | Nylon | 23°C | ASTM D1002, IPA/abrade/IPA, cure at 75°F (24°C) and approximately 50% RH for 1 week before tested. | |
720 psi | Overlap shear strength | 10,080 min | 23°C | Polycarbonate | 23°C | ASTM D1002, IPA/abrade/IPA | |
700 psi | Overlap shear strength | 10,080 min | 23°C | Acrylic | 23°C | ASTM D1002, IPA/abrade/IPA, cure at 75°F (24°C) and approximately 50% RH for 1 week before tested. | |
640 psi | Overlap shear strength | 10,080 min | 23°C | SMC | 23°C | ASTM D1002, IPA/abrade/IPA, cure at 75°F (24°C) and approximately 50% RH for 1 week before tested. | |
620 psi | Overlap shear strength | 10,080 min | 23°C | Rigid PVC | 23°C | ASTM D1002, IPA/abrade/IPA | |
640 psi | Overlap shear strength | 10,080 min | 23°C | ABS | 23°C | ASTM D1002, IPA/abrade/IPA, cure at 75°F (24°C) and approximately 50% RH for 1 week before tested. | |
550 psi | Overlap shear strength | -4°C | HIPS | 23°C | ASTM D1002, IPA/abrade/IPA, cure at 75°F (24°C) and approximately 50% RH for 1 week before tested. |
Dielectric Constant Test Methods
Dielectric Constant | Temperature | Test Method |
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3.10 | 23°C | Cured, ASTM D 150, @ 1 KHz |
Dielectric Strength Test Methods
Dielectric Strength | Test Method |
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640 V/mil | Cured, ASTM D 149 |
Dissipation Factor Test Methods
Dissipation Factor | Temperature | Test Method |
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0.02100 | 23°C | Cured, ASTM D 150, @ 1 KHz |
Thermal Conductivity Test Methods
Thermal Conductivity | Temperature | Test Method |
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0.10 W/m°K | 45°C | Cured, Thermal conductivity determined using ASTM C177 and C-matic Instrument with 2" diameter samples. |
Volume Resistivity Test Methods
Volume Resistivity | Test Method |
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1.0e14 (ohms/cm) | Cured, ASTM D 257 |
Elongation Test Methods
Elongation | Test Method |
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100 % | Elongation is determined using 3M test method C-3094/ASTM D 882., cured |
Shore D Hardness Test Methods
Shore D Hardness | Shore Hardness Test Method |
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60 to 65 | Cured, ASTM D 2240 |
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) | CTE Temperature (°C) | CTE Test Method |
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121e-6 (in./ in/°C) | >41°C | TCE determined with TMA Analyzer using a heating rate of 50°F (10°C) per minute. Second heat values given. |
219e-6 (in./ in/°C) | <41°C | TCE determined with TMA Analyzer using a heating rate of 50°F (10°C) per minute. Second heat values given. |
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) | Glass Transition Temperature (Tg) Test Method |
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41°C | Glass transition temperature (Tg) determined using DSC Analyzer with a heating rate of 68°F (20°C) per minute. Second heat values given. |
Outgassing Test Methods
Outgassing | Temperature (°C) | Test Method |
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5% | 300°C | Weight loss by TGA reported as that temperature at which 5% weight loss occurs by TGA in air at 5°C rise per minute per ASTM 1131-86. |

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