3M Splicing Tape 9497 Datasheet 3M Splicing Tape 9497

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  • Description for 3M Splicing Tape 9497

    Splicing Tapes utilize an acrylic pressure sensitive adhesive system that offers a balance of initial adhesion and good holding power. It is designed for resistance to high temperatures and is ideal for splicing many paper medians used by corrugators.

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    Chemical Resistance Chemical Resistance: Good Solvent Resistance
    Application Type Bond
    Material Form Tape
    Substrate Paper, Steel
    Manufacturer 3M
    Chemistry Acrylic
    Cure Method Pressure Sensitive
    Application Temperature (°F) 70 to 100
    Single Sided Single sided
    High Temperature Resistance (°C) Good high temperature resistance, 121, 177
  • Technical Data for 3M Splicing Tape 9497

    Overview
    • Chemical Resistance
      • Chemical Resistance : Relative Solvent Resistance - Good Solvent Resistance
    • Application Type
    • Material Form
      • Tape
    • Substrate
    • Industry
      • Other - Splicing many paper medians used by corrugators
    • Chemistry
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
    Specifications
    Cure Specs
    Application Temperature (°F) 70 to 100
    Bond Strength
    General Bond Strength (psi) 45 (oz./in.) Test Method
    Peel Strength (piw) 45 oz/in Test Method
    Tape Properties
    Single Sided Single sided
    Material Resistance
    UV Resistance Excellent UV Resistance
    High Temperature Resistance (°C) Good high temperature resistance, 121, 177
    Business Information
    Shelf Life Details Storage: Store in original cartons at 70°F (21°C) and 50% relative humidity., 24 months from date of manufacture
    Shelf Life Temperature (°F) 70
    Shelf Life Type From date of manufacture.
    Shelf Life (mon) 24
  • Best Practices for 3M Splicing Tape 9497

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    1. Surface Preparation

      To obtain optimum adhesion, the bonding surfaces must be clean, dry, and well unified.

    2. Application

      Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure helps develop better adhesive contact and improve bond strength.

      Ideal tape application temperature range is 70°F to 100°F (21°C to 38°C). Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.

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General Bond Strength Test Methods
General Bond Strength Substrate Test Method
45 (oz./in.) Steel ASTM D-3330, 50 N/100 mm
Peel Strength Test Methods
Peel Strength Test Method
45 oz/in ASTM D3330, 180° Peel Adhesion, Notes: 12 in/min (300 mm/min)