

-
Description for 3M Splicing Tape 9499
Splicing Tapes utilize an acrylic pressure sensitive adhesive system that offers a balance of initial adhesion and good holding power. It is ideal for printers who require especially high drying temperatures or who utilize long ovens.Chemical Resistance Chemical Resistance: Good Solvent Resistance Application Type Bond Material Form Tape Substrate Steel Industry For printers who require especially high drying temperatures, Ideal for zero speed automatic splicing, For printers who utilize long ovens Manufacturer 3M Chemistry Acrylic Cure Method Pressure Sensitive Application Temperature (°F) 70 to 100 Single Sided Single sided High Temperature Resistance (°C) Good high temperature resistance, High air heat (oven) resistance, 149, 260 -
Technical Data for 3M Splicing Tape 9499
Overview
-
Chemical Resistance
- Chemical Resistance : Relative Solvent Resistance - Good Solvent Resistance
-
Application Type
- Adhesive - Bond
-
Material Form
- Tape
-
Substrate
-
Industry
- Splicing - Ideal for zero speed automatic splicing
- Printing and Graphics - For printers who require especially high drying temperatures, For printers who utilize long ovens
-
Chemistry
-
Cure Method
- Pressure Sensitive (min) - Pressure Sensitive
Specifications
Cure Specs
Application Temperature (°F) 70 to 100 Bond Strength
General Bond Strength (psi) 45 oz./in. Test Method Peel Strength (piw) 45 oz/in Test Method Tape Properties
Single Sided Single sided Material Resistance
UV Resistance Excellent UV Resistance High Temperature Resistance (°C) Good high temperature resistance, High air heat (oven) resistance, 149, 260 Business Information
Shelf Life Details Storage: Store in original cartons at 70°F (21°C) and 50% relative humidity., 24 months from date of manufacture Shelf Life Temperature (°F) 70 Shelf Life Type From date of manufacture. Shelf Life (mon) 24 -
-
Best Practices for 3M Splicing Tape 9499
-
Surface Preparation
To obtain optimum adhesion, the bonding surfaces must be clean, dry, and well unified.
-
Application
Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure helps develop better adhesive contact and improve bond strength.
• Ideal tape application temperature range is 70°F to 100°F (21°C to 38°C). Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.
-
-
Comparable Materials for 3M Splicing Tape 9499
Spec Engine® Results
Popular Articles
Plastic Bonding with Adhesives - Considerations Q&A
Read ArticleInfographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation
Read ArticleTesting the effectiveness of surface treatments
Read ArticleWhat Projects Require Custom Adhesive Formulations and Why?
Read ArticleSponsored Articles
Unique Advantages of Contact Adhesives
Read ArticleUsing LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials
Read ArticleSylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:
Read ArticleCase Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive
Read ArticleFeatured Ads
