3M Splicing Tape 9499

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Description for 3M Splicing Tape 9499

Splicing Tapes utilize an acrylic pressure sensitive adhesive system that offers a balance of initial adhesion and good holding power. It is ideal for printers who require especially high drying temperatures or who utilize long ovens.

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Chemical Resistance	Chemical Resistance: Good Solvent Resistance
Application Type	Bond
Material Form	Tape
Substrate	Steel
Industry	For printers who require especially high drying temperatures, Ideal for zero speed automatic splicing, For printers who utilize long ovens
Manufacturer	3M
Chemistry	Acrylic
Cure Method	Pressure Sensitive
Application Temperature (°F)	70 to 100
Single Sided	Single sided
High Temperature Resistance (°C)	Good high temperature resistance, High air heat (oven) resistance, 149, 260

Best Practices for 3M Splicing Tape 9499

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Technical Data for 3M Splicing Tape 9499

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Overview

Chemical Resistance
- Chemical Resistance : Relative Solvent Resistance - Good Solvent Resistance
Application Type
- Adhesive - Bond
Material Form
- Tape
Substrate
- Steel
Industry
- Splicing - Ideal for zero speed automatic splicing
- Printing and Graphics - For printers who require especially high drying temperatures, For printers who utilize long ovens
Chemistry
- Acrylic
Cure Method
- Pressure Sensitive (min) - Pressure Sensitive

Specifications

Cure Specs

Application Temperature (°F)	70 to 100

Bond Strength

General Bond Strength (psi)	45 oz./in.	Test Method
Peel Strength (piw)	45 oz/in	Test Method

Tape Properties

Single Sided	Single sided

Material Resistance

UV Resistance	Excellent UV Resistance
High Temperature Resistance (°C)	Good high temperature resistance, High air heat (oven) resistance, 149, 260

Business Information

Shelf Life Details	Storage: Store in original cartons at 70°F (21°C) and 50% relative humidity., 24 months from date of manufacture
Shelf Life Temperature (°F)	70
Shelf Life Type	From date of manufacture.
Shelf Life (mon)	24

Best Practices for 3M Splicing Tape 9499

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1. Surface Preparation
  
  To obtain optimum adhesion, the bonding surfaces must be clean, dry, and well unified.
2. Application
  
  Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure helps develop better adhesive contact and improve bond strength.
  
  • Ideal tape application temperature range is 70°F to 100°F (21°C to 38°C). Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.
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