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Description for 3M Thermal Bonding Film AF42 (4 mil)
It is a thermosetting epoxy film adhesive, Its flexibility provides excellent drop and impact resistance as well as stress relief for joints encountering coefficient of thermal expansion (CTE) mismatch, Structural bond strength to metals and glass.Chemical Resistance Chemical Resistance: Fluid Resistance: Tap Water resistance, Excellent chemical resistance, Chemical Resistance: Methyl Ethyl Ketone, Ethyl Gasoline, Isopropyl Alcohol, 3M™ Citrus Base Cleaner, Heptane Application Type Bond 1 Part or 2 Part 1-Part Material Form Film Substrate Aluminum, Copper, Glass, Metal, PEN Plastic, Polyester Film, Steel, Phenolic Board, Stainless Steel (solvent wiped), Polyimide Film, Phenolic Board, Etched aluminum, CRS (cold rolled steel), Al (sanded), CRS (scour pad abraded, solvent wiped), Al (scour pad abraded), Al (solvent wiped), FPL Etched Aluminum Industry Electronics, Joints encountering Manufacturer 3M Chemistry Epoxy, Low halogen content Cure Method Heat cure Cure Temperature (°C) 177, 204, 232 Cure Time (min) 60, 15, 10 Viscosity (cPs) Low flow Color Translucent Total Thickness (mm) 0.102 Arc Resistance (sec) Arc Resistance High Temperature Resistance (°C) 121 Low Temperature Resistance (°C) -55 Other Resistance Excellent Drop resistance Volume Resistivity (O) 1.2e15 (ohm/cm) Durability Tough Stress Relief Stress relief Key Specifications Mil-Spec (United States Military Standard): MIL-A-5090D or ASTM D 1002). -
Technical Data for 3M Thermal Bonding Film AF42 (4 mil)
Overview
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Chemical Resistance
- Chemical Resistance : Fluid Resistance : Water Resistance - Tap Water resistance
- Chemical Resistance - Ethyl Gasoline, Isopropyl Alcohol, Heptane, 3M™ Citrus Base Cleaner, Excellent chemical resistance
- Chemical Resistance : Relative Solvent Resistance - Methyl Ethyl Ketone
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Application Type
- Adhesive - Bond
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1 Part or 2 Part
- 1-Part
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Material Form
- Film
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Substrate
- Glass
- Metal
- Aluminum - Etched aluminum, Al (solvent wiped), Al (scour pad abraded), Al (sanded), FPL Etched Aluminum
- Copper
- Steel - CRS (cold rolled steel), CRS (scour pad abraded, solvent wiped)
- Plastic - PEN Plastic
- Polyimide (PI) - Polyimide Film
- Phenolic - Phenolic Board
- Wood - Phenolic Board
- Polyester - Polyester Film
- Stainless Steel - Stainless Steel (solvent wiped)
- Other - FR-4 (solvent wiped), LCP (solvent wiped), Black E-coat, Ultem® 1000, Borosilicate Glass
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Industry
- Electronics
- Joints - Joints encountering
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Chemistry
- Epoxy
- Other - Low halogen content
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Cure Method
- Heat - Heat cure
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Color
- Translucent
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Key Specifications
- Mil-Spec (United States Military Standard) : A-5090D or (ASTM D 1002) - MIL-A-5090D or ASTM D 1002).
Specifications
Cure Specs
Cure Temperature (°C) 177, 204, 232 Cure Time (min) 60, 15, 10 Viscosity (cPs) Low flow Work / Pot Time (min) 40,320 Test Method Bond Strength
Structural/Load-Bearing Structural bond strength General Bond Strength (psi) No Tack Peel Strength (piw) High, 55, 48, 45, 52, 58, 11, 58, 1, 8, 3, 49, 36, 50, 14, 60, 63, 68, 58, 55, 63, 66, 56, 54, 36, 51 Test Method Shear Strength (psi) 4,600, 3,700, 3,750, 500, 1,350, 600, 2,500, 400, 650, 350, 350, 1,000, 1,500, 250, 1,200, 1,450, 200, 300, 900, 1,500, 1,300, 350, 175, 33 (Mpa) Test Method Cleavage Strength (psi) High, 1,300, 720, 400 Test Method Tensile Strength (psi) 4,800, 1.9 (J), 59 (Mpa) Test Method Tape Properties
Total Thickness (mm) 0.102 Material Resistance
Arc Resistance (sec) Arc Resistance High Temperature Resistance (°C) 121 Low Temperature Resistance (°C) -55 Impact Resistance Excellent impact resistance Other Resistance Excellent Drop resistance Conductivity
Dissipation Factor 0.00400, 0.00600, 0.00800 Test Method Dielectric Strength (V/mil) 900 Test Method Dielectric Constant 4.60, 4.20, 3.80 Test Method Thermal Conductivity (W/m°K) 0.21 Test Method Surface Resistivity (O) 4.1e13 (ohm/square) Test Method Volume Resistivity (O) 1.2e15 (ohm/cm) Test Method Hardness
Durability Tough Stress Relief Stress relief Shore D Hardness 76 Test Method Elongation (%) 350 Test Method Flexibility flexible Modulus (psi) 100 ( MPa) Test Method Other Properties
Glass Transition Temp (Tg) (°C) 55, 50, 45 Test Method Coefficient of Thermal Expansion (CTE) 63e-6 (units / unit /°C @ 10°C/min.), 13e-6 (units / unit /°C @ 10°C/min.), 266e-6 (units / unit /°C @ 10°C/min.) Test Method Business Information
Shelf Life Details 3M™ Thermal Bonding Film AF42 has a work life of 4 weeks. Work life is defined as the time the product can be at room temperature, and will yield the performance data summarized in this data sheet if bonds are made and tested per instructions. Usage above 70°F (21°C) prior to bonding can reduce bonding performance. While not in use, 3M film AF42 should be stored at or below 40°F (4°C); The shelf life of 3M film AF42 is 15 months when stored at or below 40°F (4°C) in the original packaging materials., 3M™ Thermal Bonding Film AF42 has a work life of 4 weeks. Work life is defined as the time the product can be at room temperature, and will yield the performance data summarized in this data sheet if bonds are made and tested per instructions. Usage above 70°F (21°C) prior to bonding can reduce bonding performance. While not in use, 3M film AF42 should be stored at or below 40°F (4°C); The shelf life of 3M film AF42 is 15 months when stored at or below 40°F (4°C) in the original packaging materials. Shelf Life Temperature (°F) 40, 70 Shelf Life Type From the date of manufacture, Shelf Life Type Shelf Life (mon) 15, 1 -
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Best Practices for 3M Thermal Bonding Film AF42 (4 mil)
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Surface Preparation
A thoroughly cleaned, dry, grease-free surface is essential for maximum performance. Cleaning methods which will produce a break-free water film on metal surfaces are generally satisfactory.
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Application
Cut a portion of film sufficient for the assembly from the stock roll with protective liner(s) in place. Note earlier comment to bring adhesive to room temperature before use.
Place the adhesive against the substrate using the liner as a protective cover.
Position film and remove liner.
Complete assembly and cure, be careful to avoid trapping air
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Clean-Up
Uncured 3M™ Thermal Bonding Film AF42 can be removed using acetone, MEK or 3M™ Citrus Base Cleaner.
Note: When using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use.
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Comparable Materials for 3M Thermal Bonding Film AF42 (4 mil)
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Work / Pot Time Test Methods
Work / Pot Time | Test Method | Temperature |
---|---|---|
40,320 min | Work life is defined as the time the product can be at room temperature, and will yield the performance data summarized in this data sheet if bonds are made and tested per instructions. | 25°C |
Cleavage Strength Test Methods
Cleavage Strength | Test Temperature | Test Method |
---|---|---|
High | -40°C | ASTM D1205 |
1,300 psi | 24°C | ASTM D1205 |
720 psi | 93°C | ASTM D1205 |
400 psi |
Peel Strength Test Methods
Peel Strength | Type | Cure Time | Cure Temperature | Substrate | Test Time | Test Temperature | Test Method |
---|---|---|---|---|---|---|---|
High | |||||||
55 piw | 90° Peel strength | 60 min | 121°C | Al (etched) | 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
48 piw | 90° Peel strength | 60 min | 121°C | Al (sanded, solvent wiped) | 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
45 piw | 90° Peel strength | 60 min | 121°C | Al (scour pad abraded, solvent wiped) | 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
52 piw | 90° Peel strength | 60 min | 121°C | Al (solvent wiped) | 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
58 piw | 90° Peel strength | 60 min | 121°C | CRS (scour pad abraded, solvent wiped) | 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
11 piw | 90° Peel strength | 60 min | 121°C | Stainless Steel (solvent wiped) | 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
58 piw | 90° Peel strength | 60 min | 121°C | FR-4 (solvent wiped) | 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
1 piw | 90° Peel strength | 60 min | 121°C | LCP (solvent wiped) | 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
8 piw | 90° Peel strength | 60 min | 121°C | Polyimide Film | 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
3 piw | 90° Peel strength | 60 min | 121°C | Polyester Film | 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
49 piw | 90° Peel strength | 60 min | 121°C | Black E-coat | 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
36 piw | 90° Peel strength | 60 min | 121°C | Phenolic Board | 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
50 piw | 90° Peel strength | 60 min | 121°C | Ultem® 1000 | 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
14 piw | 90° Peel strength | 60 min | 121°C | PEN Plastic | 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
60 piw | 90° Peel strength | 60 min | 121°C | Borosilicate Glass | 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
63 piw | 60 min | 121°C | Etched aluminum | 43,200 min | 20 to 25°C | (control) Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and peeled at 2"/minute speed. | |
68 piw | 60 min | 121°C | Etched aluminum | 43,200 min | 71°C | Oven, Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and peeled at 2"/minute speed. | |
58 piw | 60 min | 121°C | Etched aluminum | 43,200 min | 49°C | 100% RH, Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and peeled at 2"/minute speed. | |
55 piw | 60 min | 121°C | Etched aluminum | 43,200 min | immersion in distilled water, Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and peeled at 2"/minute speed. | ||
63 piw | Etched aluminum | 1,020 min | 49°C | Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and peeled at 2"/minute speed., Hot/cold cycle was 17 hours at 49°C (120°F) and 5 hours at -21°C (-5°F) with one hour at room temperature between temperature changes. | |||
66 piw | Etched aluminum | -55°C | Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board., tested in similar fashion described in previous sections. | ||||
56 piw | Etched aluminum | 24°C | Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board., tested in similar fashion described in previous sections. | ||||
54 piw | Etched aluminum | 82°C | Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board., tested in similar fashion described in previous sections. | ||||
36 piw | Etched aluminum | 121°C | Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board., tested in similar fashion described in previous sections. | ||||
51 piw | T-Peel | FPL Etched Aluminum | ASTM D1876 |
Tensile Strength Test Methods
Tensile Strength | Type | Substrate | Test Time | Test Temperature | Test Method |
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4,800 psi | |||||
1.9 (J) | Tensile Impact Resistance | FPL Etched Aluminum | 60 min | 65°C | Deviation in specimen geometry. Gauge length 20 mm, width 3 mm. Samples degassed (-90 KPa, 1 hour, 65°C). |
59 (Mpa) | Ultimate Tensile Strength | 60 min | 65°C | ASTM D638d |
Shear Strength Test Methods
Shear Strength | Type | Cure Time | Cure Temperature | Substrate | Test Time | Test Temperature | Test Method |
---|---|---|---|---|---|---|---|
4,600 psi | Overlap shear strength | 60 min | 121°C | Al (etched) | ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
3,700 psi | Overlap shear strength | 60 min | 121°C | Al (sanded, solvent wiped) | ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
3,750 psi | Overlap shear strength | 60 min | 121°C | Al (scour pad abraded, solvent wiped) | ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
500 psi | Overlap shear strength | 60 min | 121°C | Al (solvent wiped) | ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
1,350 psi | Overlap shear strength | 60 min | 121°C | CRS (scour pad abraded, solvent wiped) | ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
600 psi | Overlap shear strength | 60 min | 121°C | Stainless Steel (solvent wiped) | ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
2,500 psi | Overlap shear strength | 60 min | 121°C | FR-4 (solvent wiped) | ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
400 psi | Overlap shear strength | 60 min | 121°C | LCP (solvent wiped) | ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
650 psi | Overlap shear strength | 60 min | 121°C | Polyimide Film | ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
350 psi | Overlap shear strength | 60 min | 121°C | Polyester Film | ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
350 psi | Overlap shear strength | 60 min | 121°C | Black E-coat | ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
1,000 psi | Overlap shear strength | 60 min | 121°C | Phenolic Board | ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
1,500 psi | Overlap shear strength | 60 min | 121°C | Ultem® 1000 | ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
250 psi | Overlap shear strength | 60 min | 121°C | PEN Plastic | ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). | ||
1,200 psi | Overlap shear strength | 60 min | 121°C | CRS to CRS | 2,592,000 sec | 20 to 25°C | (control), OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and tested at 0.2"/minute speed. |
1,450 psi | Overlap shear strength | 60 min | 121°C | CRS to CRS | 2,592,000 sec | 71°C | Oven, OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and tested at 0.2"/minute speed. |
200 psi | Overlap shear strength | 60 min | 121°C | CRS to CRS | 2,592,000 sec | 49°C | 100% RH, OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and tested at 0.2"/minute speed. |
300 psi | Overlap shear strength | 60 min | 121°C | CRS to CRS | 2,592,000 sec | immersion in distilled water, OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and tested at 0.2"/minute speed. | |
900 psi | Overlap shear strength | 60 min | 121°C | CRS to CRS | 61,200 sec | 49°C | OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and tested at 0.2"/minute speed., Hot/cold cycle was 17 hours at 49°C (120°F) and 5 hours at -21°C (-5°F) with one hour at room temperature between temperature changes. |
1,500 psi | Overlap shear strength | CRS | -55°C | OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped)., tested in similar fashion described in previous sections. | |||
1,300 psi | Overlap shear strength | CRS | 24°C | OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped)., tested in similar fashion described in previous sections. | |||
350 psi | Overlap shear strength | CRS | 82°C | OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped)., tested in similar fashion described in previous sections. | |||
175 psi | Overlap shear strength | 121°C | OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped)., tested in similar fashion described in previous sections. | ||||
33 (Mpa) | Overlap Shear Strength | CRS | 60 min + 10 min, ramp time | 180°C | ASTM D1002,Samples cured for 60 min + 10 min ramp time at 180°C. |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
---|---|
4.60 | ASTM D-150, 1 kilohertz |
4.20 | ASTM D-150, 10 kilohertz |
3.80 | ASTM D-150, 100 kilohertz |
Dielectric Strength Test Methods
Dielectric Strength | Test Method |
---|---|
900 V/mil | ASTM D149, Breakdown |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
---|---|
0.00400 | ASTM D-150, 1 kilohertz |
0.00600 | ASTM D-150, 10 kilohertz |
0.00800 | ASTM D-150, 100 kilohertz |
Surface Resistivity Test Methods
Surface Resistivity | Test Method |
---|---|
4.1e13 (ohm/square) | 500 (Volts - DC) |
Thermal Conductivity Test Methods
Thermal Conductivity | Test Method |
---|---|
0.21 W/m°K | ASTM C177 |
Volume Resistivity Test Methods
Volume Resistivity | Test Method |
---|---|
1.2e15 (ohm/cm) | ASTM D-257 (3 mil) |
Elongation Test Methods
Elongation | Test Method |
---|---|
350 % | Deviation in specimen geometry. Gauge length 20 mm, width 3 mm. Samples degassed (-90 KPa, 1 hour, 65°C). |
Shore D Hardness Test Methods
Shore D Hardness | Shore Hardness Test Method |
---|---|
76 | ASTM D2240 |
Modulus Test Methods
Modulus | Test Method |
---|---|
100 ( MPa) | Deviation in specimen geometry. Gauge length 20 mm, width 3 mm. Samples degassed (-90 KPa, 1 hour, 65°C). |
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) | CTE Temperature (°C) | CTE Test Method |
---|---|---|
63e-6 (units / unit /°C @ 10°C/min.) | -60 to 40°C | by TMA, 1st heat values |
13e-6 (units / unit /°C @ 10°C/min.) | -60 to 40°C | by TMA, 2nd heat values |
266e-6 (units / unit /°C @ 10°C/min.) | 65 to 125°C | by TMA, 2nd heat values |
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) | Glass Transition Temperature (Tg) Test Method |
---|---|
55°C | By TMA @ 10°C/min., onset, 2nd heat values |
50°C | DSC @ 5°C/min., midpoint, 1st heat values |
45°C | DSC @ 5°C/min., midpoint, 2nd heat values |

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