3M Thermal Bonding Film AF42 (4 mil)

3M Thermal Bonding Film AF42 (4 mil) Datasheet
  • Description for 3M Thermal Bonding Film AF42 (4 mil)

    It is a thermosetting epoxy film adhesive, Its flexibility provides excellent drop and impact resistance as well as stress relief for joints encountering coefficient of thermal expansion (CTE) mismatch, Structural bond strength to metals and glass.

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Film
    Substrate Aluminum, Copper, Glass, Metal, Steel, Stainless Steel (solvent wiped), Polyester Film, Polyimide Film, Phenolic Board, PEN Plastic, Phenolic Board, Etched aluminum, CRS (cold rolled steel), Al (sanded), CRS (scour pad abraded, solvent wiped), Al (scour pad abraded), Al (solvent wiped), FPL Etched Aluminum
    Industry Electronics
    Manufacturer 3M
    Chemistry Epoxy, Low halogen content
    Cure Method Heat cure
    Cure Temperature (°C) 177, 204, 232
    Cure Time (min) 60, 15, 10
    Viscosity (cPs) Low flow
    Color Translucent
    Arc Resistance (sec) Arc Resistance
    Chemical Resistance Excellent chemical resistance, Ethyl Gasoline, Isopropyl Alcohol, Methyl Ethyl Ketone, Heptane, 3M™ Citrus Base Cleaner, Tap Water
    High Temperature Resistance (°C) 121
    Low Temperature Resistance (°C) -55
    Other Resistance Excellent Drop resistance
    Durability Tough
    Stress Relief Stress relief
    Key Specifications Mil-Spec (United States Military Standard): MIL-A-5090D or ASTM D 1002).
  • Technical Data for 3M Thermal Bonding Film AF42 (4 mil)

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Film
    • Substrate
      • Glass
      • Metal
      • Aluminum - Etched aluminum, Al (solvent wiped), Al (scour pad abraded), Al (sanded), FPL Etched Aluminum
      • Copper
      • Steel - CRS (cold rolled steel), CRS (scour pad abraded, solvent wiped)
      • Plastic - PEN Plastic
      • Polyimide (PI) - Polyimide Film
      • Phenolic - Phenolic Board
      • Wood - Phenolic Board
      • Polyester - Polyester Film
      • Stainless Steel - Stainless Steel (solvent wiped)
      • Other - FR-4 (solvent wiped), LCP (solvent wiped), Black E-coat, Ultem® 1000, Borosilicate Glass
    • Industry
    • Chemistry
      • Epoxy
      • Other - Low halogen content
    • Cure Method
      • Heat - Heat cure
    • Color
      • Translucent
    • Key Specifications
      • Mil-Spec (United States Military Standard): A-5090D or (ASTM D 1002) - MIL-A-5090D or ASTM D 1002).
    Specifications
    Cure Specs
    Cure Temperature (°C) 177, 204, 232
    Cure Time (min) 60, 15, 10
    Viscosity (cPs) Low flow
    Work / Pot Time (min) 40,320 Test Method
    Bond Strength
    Structural/Load-Bearing Structural bond strength
    General Bond Strength (psi) No Tack
    Peel Strength (piw) High, 55, 48, 45, 52, 58, 11, 58, 1, 8, 3, 49, 36, 50, 14, 60, 63, 68, 58, 55, 63, 66, 56, 54, 36, 51 Test Method
    Shear Strength (psi) 4,600, 3,700, 3,750, 500, 1,350, 600, 2,500, 400, 650, 350, 350, 1,000, 1,500, 250, 1,200, 1,450, 200, 300, 900, 1,500, 1,300, 350, 175, 33 (Mpa) Test Method
    Cleavage Strength (psi) High, 1,300, 720, 400 Test Method
    Tensile Strength (psi) 4,800, 1.9 (J), 59 (Mpa) Test Method
    Tape Properties
    Total Thickness (mil) 4
    Material Resistance
    Arc Resistance (sec) Arc Resistance
    Chemical Resistance Excellent chemical resistance, Ethyl Gasoline, Isopropyl Alcohol, Methyl Ethyl Ketone, Heptane, 3M™ Citrus Base Cleaner, Tap Water
    High Temperature Resistance (°C) 121
    Low Temperature Resistance (°C) -55
    Impact Resistance Excellent impact resistance
    Other Resistance Excellent Drop resistance
    Conductivity
    Dissipation Factor 0.00400, 0.00600, 0.00800 Test Method
    Dielectric Strength (V/mil) 900 Test Method
    Dielectric Constant 4.60, 4.20, 3.80 Test Method
    Thermal Conductivity (W/m°K) 0.21 Test Method
    Surface Resistivity (O) 4.1e13 (ohm/square) Test Method
    Volume Resistivity (O) 1.2e15 (ohm/cm) Test Method
    Hardness
    Durability Tough
    Stress Relief Stress relief
    Shore D Hardness 76 Test Method
    Elongation (%) 350 Test Method
    Flexibility flexible
    Modulus (psi) 100 ( MPa) Test Method
    Other Properties
    Glass Transition Temp (Tg) (°C) 55, 50, 45 Test Method
    Coefficient of Thermal Expansion (CTE) 63e-6 (units / unit /°C @ 10°C/min.), 13e-6 (units / unit /°C @ 10°C/min.), 266e-6 (units / unit /°C @ 10°C/min.) Test Method
    Business Information
    Shelf Life Details 3M™ Thermal Bonding Film AF42 has a work life of 4 weeks. Work life is defined as the time the product can be at room temperature, and will yield the performance data summarized in this data sheet if bonds are made and tested per instructions. Usage above 70°F (21°C) prior to bonding can reduce bonding performance. While not in use, 3M film AF42 should be stored at or below 40°F (4°C); The shelf life of 3M film AF42 is 15 months when stored at or below 40°F (4°C) in the original packaging materials., 3M™ Thermal Bonding Film AF42 has a work life of 4 weeks. Work life is defined as the time the product can be at room temperature, and will yield the performance data summarized in this data sheet if bonds are made and tested per instructions. Usage above 70°F (21°C) prior to bonding can reduce bonding performance. While not in use, 3M film AF42 should be stored at or below 40°F (4°C); The shelf life of 3M film AF42 is 15 months when stored at or below 40°F (4°C) in the original packaging materials.
    Shelf Life Temperature (°F) 40, 70
    Shelf Life Type From the date of manufacture, Shelf Life Type
    Shelf Life (mon) 15, 1
  • Best Practices for 3M Thermal Bonding Film AF42 (4 mil)

    *See Terms of Use Below

    1. Surface Preparation

      A thoroughly cleaned, dry, grease-free surface is essential for maximum performance. Cleaning methods which will produce a break-free water film on metal surfaces are generally satisfactory.

    2. Application

      Cut a portion of film sufficient for the assembly from the stock roll with protective liner(s) in place. Note earlier comment to bring adhesive to room temperature before use.

      Place the adhesive against the substrate using the liner as a protective cover.

      Position film and remove liner.

      Complete assembly and cure, be careful to avoid trapping air

    3. Clean-Up

      Uncured 3M™ Thermal Bonding Film AF42 can be removed using acetone, MEK or 3M™ Citrus Base Cleaner.

      Note: When using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use.

  • Comparable Materials for 3M Thermal Bonding Film AF42 (4 mil)

    *See Terms of Use Below

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Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
40,320 min Work life is defined as the time the product can be at room temperature, and will yield the performance data summarized in this data sheet if bonds are made and tested per instructions. 25°C
Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Substrate Test Time Test Temperature Test Method
4,600 psi Overlap shear strength 60 min 121°C Al (etched) ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
3,700 psi Overlap shear strength 60 min 121°C Al (sanded, solvent wiped) ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
3,750 psi Overlap shear strength 60 min 121°C Al (scour pad abraded, solvent wiped) ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
500 psi Overlap shear strength 60 min 121°C Al (solvent wiped) ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
1,350 psi Overlap shear strength 60 min 121°C CRS (scour pad abraded, solvent wiped) ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
600 psi Overlap shear strength 60 min 121°C Stainless Steel (solvent wiped) ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
2,500 psi Overlap shear strength 60 min 121°C FR-4 (solvent wiped) ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
400 psi Overlap shear strength 60 min 121°C LCP (solvent wiped) ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
650 psi Overlap shear strength 60 min 121°C Polyimide Film ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
350 psi Overlap shear strength 60 min 121°C Polyester Film ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
350 psi Overlap shear strength 60 min 121°C Black E-coat ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
1,000 psi Overlap shear strength 60 min 121°C Phenolic Board ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
1,500 psi Overlap shear strength 60 min 121°C Ultem® 1000 ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
250 psi Overlap shear strength 60 min 121°C PEN Plastic ASTM D1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
1,200 psi Overlap shear strength 60 min 121°C CRS to CRS 2,592,000 sec 20 to 25°C (control), OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and tested at 0.2"/minute speed.
1,450 psi Overlap shear strength 60 min 121°C CRS to CRS 2,592,000 sec 71°C Oven, OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and tested at 0.2"/minute speed.
200 psi Overlap shear strength 60 min 121°C CRS to CRS 2,592,000 sec 49°C 100% RH, OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and tested at 0.2"/minute speed.
300 psi Overlap shear strength 60 min 121°C CRS to CRS 2,592,000 sec immersion in distilled water, OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and tested at 0.2"/minute speed.
900 psi Overlap shear strength 60 min 121°C CRS to CRS 61,200 sec 49°C OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and tested at 0.2"/minute speed., Hot/cold cycle was 17 hours at 49°C (120°F) and 5 hours at -21°C (-5°F) with one hour at room temperature between temperature changes.
1,500 psi Overlap shear strength CRS -55°C OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped)., tested in similar fashion described in previous sections.
1,300 psi Overlap shear strength CRS 24°C OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped)., tested in similar fashion described in previous sections.
350 psi Overlap shear strength CRS 82°C OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped)., tested in similar fashion described in previous sections.
175 psi Overlap shear strength 121°C OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped)., tested in similar fashion described in previous sections.
33 (Mpa) Overlap Shear Strength CRS 60 min + 10 min, ramp time 180°C ASTM D1002,Samples cured for 60 min + 10 min ramp time at 180°C.
Tensile Strength Test Methods
Tensile Strength Type Substrate Test Time Test Temperature Test Method
4,800 psi
1.9 (J) Tensile Impact Resistance FPL Etched Aluminum 60 min 65°C Deviation in specimen geometry. Gauge length 20 mm, width 3 mm. Samples degassed (-90 KPa, 1 hour, 65°C).
59 (Mpa) Ultimate Tensile Strength 60 min 65°C ASTM D638d
Peel Strength Test Methods
Peel Strength Type Cure Time Cure Temperature Substrate Test Time Test Temperature Test Method
High
55 piw 90° Peel strength 60 min 121°C Al (etched) 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
48 piw 90° Peel strength 60 min 121°C Al (sanded, solvent wiped) 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
45 piw 90° Peel strength 60 min 121°C Al (scour pad abraded, solvent wiped) 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
52 piw 90° Peel strength 60 min 121°C Al (solvent wiped) 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
58 piw 90° Peel strength 60 min 121°C CRS (scour pad abraded, solvent wiped) 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
11 piw 90° Peel strength 60 min 121°C Stainless Steel (solvent wiped) 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
58 piw 90° Peel strength 60 min 121°C FR-4 (solvent wiped) 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
1 piw 90° Peel strength 60 min 121°C LCP (solvent wiped) 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
8 piw 90° Peel strength 60 min 121°C Polyimide Film 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
3 piw 90° Peel strength 60 min 121°C Polyester Film 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
49 piw 90° Peel strength 60 min 121°C Black E-coat 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
36 piw 90° Peel strength 60 min 121°C Phenolic Board 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
50 piw 90° Peel strength 60 min 121°C Ultem® 1000 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
14 piw 90° Peel strength 60 min 121°C PEN Plastic 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
60 piw 90° Peel strength 60 min 121°C Borosilicate Glass 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute., ASTM D1876., Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
63 piw 60 min 121°C Etched aluminum 43,200 min 20 to 25°C (control) Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and peeled at 2"/minute speed.
68 piw 60 min 121°C Etched aluminum 43,200 min 71°C Oven, Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and peeled at 2"/minute speed.
58 piw 60 min 121°C Etched aluminum 43,200 min 49°C 100% RH, Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and peeled at 2"/minute speed.
55 piw 60 min 121°C Etched aluminum 43,200 min immersion in distilled water, Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and peeled at 2"/minute speed.
63 piw Etched aluminum 1,020 min 49°C Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and peeled at 2"/minute speed., Hot/cold cycle was 17 hours at 49°C (120°F) and 5 hours at -21°C (-5°F) with one hour at room temperature between temperature changes.
66 piw Etched aluminum -55°C Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board., tested in similar fashion described in previous sections.
56 piw Etched aluminum 24°C Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board., tested in similar fashion described in previous sections.
54 piw Etched aluminum 82°C Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board., tested in similar fashion described in previous sections.
36 piw Etched aluminum 121°C Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board., tested in similar fashion described in previous sections.
51 piw T-Peel FPL Etched Aluminum ASTM D1876
Cleavage Strength Test Methods
Cleavage Strength Test Temperature Test Method
High -40°C ASTM D1205
1,300 psi 24°C ASTM D1205
720 psi 93°C ASTM D1205
400 psi
Dielectric Constant Test Methods
Dielectric Constant Test Method
4.60 ASTM D-150, 1 kilohertz
4.20 ASTM D-150, 10 kilohertz
3.80 ASTM D-150, 100 kilohertz
Dielectric Strength Test Methods
Dielectric Strength Test Method
900 V/mil ASTM D149, Breakdown
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00400 ASTM D-150, 1 kilohertz
0.00600 ASTM D-150, 10 kilohertz
0.00800 ASTM D-150, 100 kilohertz
Surface Resistivity Test Methods
Surface Resistivity Test Method
4.1e13 (ohm/square) 500 (Volts - DC)
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
0.21 W/m°K ASTM C177
Volume Resistivity Test Methods
Volume Resistivity Test Method
1.2e15 (ohm/cm) ASTM D-257 (3 mil)
Elongation Test Methods
Elongation Test Method
350 % Deviation in specimen geometry. Gauge length 20 mm, width 3 mm. Samples degassed (-90 KPa, 1 hour, 65°C).
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
76 ASTM D2240
Modulus Test Methods
Modulus Test Method
100 ( MPa) Deviation in specimen geometry. Gauge length 20 mm, width 3 mm. Samples degassed (-90 KPa, 1 hour, 65°C).
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C) CTE Test Method
63e-6 (units / unit /°C @ 10°C/min.) -60 to 40°C by TMA, 1st heat values
13e-6 (units / unit /°C @ 10°C/min.) -60 to 40°C by TMA, 2nd heat values
266e-6 (units / unit /°C @ 10°C/min.) 65 to 125°C by TMA, 2nd heat values
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
55°C By TMA @ 10°C/min., onset, 2nd heat values
50°C DSC @ 5°C/min., midpoint, 1st heat values
45°C DSC @ 5°C/min., midpoint, 2nd heat values