• Description for Appli-Tec 5200 Epoxy

    Appli-Tec 5200 Epoxy is a 1 Part Elevated temperatures Epoxy Paste used to Adhere 2024T3 Clad

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Paste
    Substrate 2024T3 Clad
    Industry Electrical bonding, EMI shielding
    Manufacturer Appli-Tec
    Chemistry Epoxy
    Cure Method Elevated temperatures, 2-Part Cure
    Cure Temperature (°C) 100, 25, 65
    Cure Time (min) 30, 1,440, 120
    Color Silver
    High Temperature Resistance (°C) 300, 120
    Low Temperature Resistance (°C) -60
    Key Specifications Listed on NASA’s Low Outgassing website
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
30 min Pot Life, uncured 25°C
Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Substrate
1,200 psi Lap Shear 120 min 65°C 2024T3 Clad
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
120°C Operating Temp. Range, Based on cure of 2 hours @ 65°C
300°C Degradation Temp., Based on cure of 2 hours @ 65°C
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-60°C Operating Temp. Range, Based on cure of 2 hours @ 65°C
Volume Resistivity Test Methods
Volume Resistivity Test Method
Low
2.0E-3 (ohm-cm) Based on cure of 2 hours @ 65°C
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
High
2.50 W/m°K Based on cure of 2 hours @ 65°C
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
90 Cured, Based on cure of 2 hours @ 65°C
Specific Gravity Test Methods
Specific Gravity Test Method
2.750 Cured, Based on cure of 2 hours @ 65°C
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
85°C Cured, Based on cure of 2 hours @ 65°C