• Description for Bostik 4252

    Polyamid, high heat resistance and Low operating viscosity.<br/>

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    Application Type Bond
    1 Part or 2 Part 1-Part
    Material Form Bulk
    Substrate Glass, Metal, Hard to bond plastics, Wood, Polyamide, Vinyl
    Manufacturer Bostik
    Chemistry Hot melt
    Cure Method Hotmelt
    Application Temperature (°F) 350 to 425
    Viscosity (cPs) Low, 2,200
    Color Light Amber
    High Temperature Resistance (°C) High heat resistance, 121, 149
    Low Temperature Resistance (°C) -29, -46
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): In compositional compliance with FDA regulation 21 C.R.F 175.105 adhesives.
  • Technical Data for Bostik 4252

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Bulk
    • Substrate
    • Chemistry
    • Cure Method
      • Hotmelt
    • Color
      • Red - Light Amber
    • Key Specifications
      • FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency) : 175.105 - In compositional compliance with FDA regulation 21 C.R.F 175.105 adhesives.
    Specifications
    Cure Specs
    Application Temperature (°F) 350 to 425
    Viscosity (cPs) Low, 2,200 Test Method
    Softening Point (°C) 122 to 133
    Open Time (min) 0.03 to 1.00, <0.17
    Bond Strength
    Peel Strength (piw) High
    Cleavage Strength (psi) High
    Material Resistance
    High Temperature Resistance (°C) High heat resistance, 121, 149
    Low Temperature Resistance (°C) -29, -46
  • Best Practices for Bostik 4252

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  • Comparable Materials for Bostik 4252

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    Spec Engine® Results

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Viscosity Test Methods
Viscosity Temperature
Low
2,200 cPs 204°C