• Description for Bostik 4252

    Polyamid, high heat resistance and Low operating viscosity.<br/>

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Bulk
    Substrate Vinyl, Glass, Metal, Polyamide, Hard to bond plastics, Wood
    Manufacturer Bostik
    Chemistry Hot melt
    Cure Method Hotmelt
    Viscosity (cPs) Low, 2,200
    Color Light Amber
    High Temperature Resistance (°C) High heat resistance, 121, 149
    Low Temperature Resistance (°C) -29, -46
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): In compositional compliance with FDA regulation 21 C.R.F 175.105 adhesives.
  • Technical Data for Bostik 4252

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Bulk
    • Substrate
    • Chemistry
    • Cure Method
      • Hotmelt
    • Color
      • Red - Light Amber
    • Key Specifications
      • FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): 175.105 - In compositional compliance with FDA regulation 21 C.R.F 175.105 adhesives.
    Specifications
    Cure Specs
    Application Temperature (°F) 350 to 425
    Viscosity (cPs) Low, 2,200 Test Method
    Softening Point (°C) 122 to 133
    Open Time (min) 0.03 to 1.00, <0.17
    Bond Strength
    Peel Strength (piw) High
    Cleavage Strength (psi) High
    Material Resistance
    High Temperature Resistance (°C) High heat resistance, 121, 149
    Low Temperature Resistance (°C) -29, -46
  • Best Practices for Bostik 4252

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  • Comparable Materials for Bostik 4252

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Viscosity Test Methods
Viscosity Temperature
Low
2,200 cPs 204°C