• Description for Bostik 4252

    Polyamid, high heat resistance and Low operating viscosity.<br/>

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Bulk
    Substrate Vinyl, Glass, Metal, Polyamide, Hard to bond plastics, Wood
    Manufacturer Bostik
    Chemistry Hot melt
    Cure Method Hotmelt
    Viscosity (cPs) Low, 2,200
    Color Light Amber
    High Temperature Resistance (°C) High heat resistance, 121, 149
    Low Temperature Resistance (°C) -29, -46
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): In compositional compliance with FDA regulation 21 C.R.F 175.105 adhesives.
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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Viscosity Test Methods
Viscosity Temperature
Low
2,200 cPs 204°C