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Description for Bostik 7229
Medium viscosity; good adhesion to many varying substrates.Application Type Adhesive 1 Part or 2 Part 1-Part Material Form Bulk Manufacturer Bostik Chemistry Hot melt Cure Method Hot melt Cure Time (min) 1,440 Viscosity (cPs) 17,000, Medium High Temperature Resistance (°C) 121 Low Temperature Resistance (°C) -33 -
Technical Data for Bostik 7229
Overview
Specifications
Cure Specs
Cure Time (min) 1,440 Viscosity (cPs) 17,000, Medium Test Method Bond Strength
General Bond Strength (psi) Good Material Resistance
High Temperature Resistance (°C) 121 Low Temperature Resistance (°C) -33 -
Best Practices for Bostik 7229
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Comparable Materials for Bostik 7229
Spec Engine® Results
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