• Description for Bostik 7229

    Medium viscosity; good adhesion to many varying substrates.

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    Application Type Adhesive
    1 Part or 2 Part 1-Part
    Material Form Bulk
    Manufacturer Bostik
    Chemistry Hot melt
    Cure Method Hot melt
    Cure Time (min) 1,440
    Viscosity (cPs) 17,000, Medium
    High Temperature Resistance (°C) 121
    Low Temperature Resistance (°C) -33
  • Technical Data for Bostik 7229

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Bulk
    • Chemistry
    • Cure Method
      • Hotmelt - Hot melt
    Specifications
    Cure Specs
    Cure Time (min) 1,440
    Viscosity (cPs) 17,000, Medium Test Method
    Bond Strength
    General Bond Strength (psi) Good
    Material Resistance
    High Temperature Resistance (°C) 121
    Low Temperature Resistance (°C) -33
  • Best Practices for Bostik 7229

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  • Comparable Materials for Bostik 7229

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    Spec Engine® Results

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Viscosity Test Methods
Viscosity Temperature
17,000 cPs 176°C
Medium