Bostik 7229

Bostik 7229 Datasheet

  • Description for Bostik 7229

    Medium viscosity; good adhesion to many varying substrates.

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    Application Type Adhesive
    1 Part or 2 Part 1 Part
    Material Form Bulk
    Manufacturer Bostik
    Chemistry Hot melt
    Cure Method Hot melt
    Cure Time (min) 1,440
    Viscosity (cPs) 17,000, Medium
    High Temperature Resistance (°C) 121
    Low Temperature Resistance (°C) -33

  • Technical Data for Bostik 7229

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    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Bulk
    • Chemistry
    • Cure Method
      • Hotmelt - Hot melt
    Specifications
    Cure Specs
    Cure Time (min) 1,440
    Viscosity (cPs) 17,000, Medium Test Method
    Bond Strength
    General Bond Strength (psi) Good
    Material Resistance
    High Temperature Resistance (°C) 121
    Low Temperature Resistance (°C) -33

  • Best Practices for Bostik 7229

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  • Comparable Materials for Bostik 7229

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    Spec Engine® Results

    • Bostik
      7116(Bostik)

      A high performance polyester hot melt adhesive designed to bond wood, textiles, and vinyl film. This product has a moderate open time, low application viscosity, and good temperature resistance.

    • Bostik
      4252(Bostik)

      Polyamid, high heat resistance and Low operating viscosity.

    • Bostik
      7239(Bostik)

      Amber, Polyamide, long open time, for vinyl bonding.

    • Compare All
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Viscosity Test Methods
Viscosity Temperature
17,000 cPs 176°C
Medium