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Description for Bostik 7430 General Purpose
One-component; bonds instantly; easily dispensed; versatile; low viscosity; fast cure time.Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.
Application Type Bond, Repair, Fixture 1 Part or 2 Part 1-Part Material Form Liquid Substrate Metals Manufacturer Bostik Chemistry Cyanoacrylate, Ethyl Cure Method Moisture Cure Temperature (°C) 20 to 25 Cure Time (min) Fast, 0.03 to 0.05 Viscosity (cPs) Low, 40 to 50 High Temperature Resistance (°C) 82 Low Temperature Resistance (°C) -73 Light Refractive Index (RI) 1.4200 to 1.4800 Key Specifications Mil-Spec (United States Military Standard): MIL Spec A46050-C Type II -
Technical Data for Bostik 7430 General Purpose
Overview
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Application Type
- Adhesive - Bond, Fixture
- Repair & Maintenance - Repair
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1 Part or 2 Part
- 1-Part
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Material Form
- Liquid
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Substrate
- Metal - Metals
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Chemistry
- Cyanoacrylate (CA) - Cyanoacrylate
- Other - Ethyl
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Cure Method
- Moisture / Condensation Cure - Moisture
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Key Specifications
- Mil-Spec (United States Military Standard) : A-46050C - MIL Spec A46050-C Type II
Specifications
Cure Specs
Cure Temperature (°C) 20 to 25 Test Method Cure Time (min) Fast, 0.03 to 0.05 Test Method Viscosity (cPs) Low, 40 to 50 Fixture or Handling Strength Time (min) Fast Bond Strength
Shear Strength (psi) High Impact Strength (psi) 7 to 10 (lbs/in) Tensile Strength (psi) High, 4700 (piw) Material Resistance
High Temperature Resistance (°C) 82 Low Temperature Resistance (°C) -73 Conductivity
Dissipation Factor 2.02000 Test Method Dielectric Constant 3.34 Test Method Hardness
Shore D Hardness 65(Barcol) Elongation (%) 0 Other Properties
Light Refractive Index (RI) 1.4200 to 1.4800 Test Method Specific Gravity 1.060 Outgassing No outgassing Test Method Flash Point (°F) 200.0 Business Information
Shelf Life (mon) 12 Not Good For
Don't Use With some plastics -
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Best Practices for Bostik 7430 General Purpose
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Surface Preparation
Parts to be bonded with cyanoacrylates must be clean and free of oil, silicone and mold release agents.
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
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20 to 25°C |
Cure Time Test Methods
Cure Time | Test Method |
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Fast | |
0.03 to 0.05 min | Cure time is related to bond thickness. These values are typical but are dependent on bond line. Note: All Bostik cyanoacrylates are non-corrosive to copper. |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
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3.34 | 1mc (ASTM D-150-54T) |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
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2.02000 | @ 1mc, % |
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) | Test Method |
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1.4200 to 1.4800 | in (20 C/D) |
Outgassing Test Methods
Outgassing | Temperature (°C) | Test Method |
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No outgassing | 22°C | 10.6mm Hg 72°F |