• Description for Bostik 7430 General Purpose

    One-component; bonds instantly; easily dispensed; versatile; low viscosity; fast cure time.

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

    *See Terms of Use Below

    Application Type Bond, Repair, Fixture
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate Metals
    Manufacturer Bostik
    Chemistry Cyanoacrylate, Ethyl
    Cure Method Moisture
    Cure Temperature (°C) 20 to 25
    Cure Time (min) Fast, 0.03 to 0.05
    Viscosity (cPs) Low, 40 to 50
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -73
    Light Refractive Index (RI) 1.4200 to 1.4800
    Key Specifications Mil-Spec (United States Military Standard): MIL Spec A46050-C Type II
  • Technical Data

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  • Best Practices

    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C
Cure Time Test Methods
Cure Time Test Method
0.03 to 0.05 min Cure time is related to bond thickness. These values are typical but are dependent on bond line. Note: All Bostik cyanoacrylates are non-corrosive to copper.
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.34 1mc (ASTM D-150-54T)
Dissipation Factor Test Methods
Dissipation Factor Test Method
2.02000 @ 1mc, %
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) Test Method
1.4200 to 1.4800 in (20 C/D)
Outgassing Test Methods
Outgassing Temperature (°C) Test Method
No outgassing 22°C 10.6mm Hg 72°F