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| Application Type | Bond, Repair, Fixture |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Liquid |
| Substrate | Metals |
| Manufacturer | Bostik |
| Chemistry | Cyanoacrylate, Ethyl |
| Cure Method | Moisture |
| Cure Temperature (°C) | 20 to 25 |
| Cure Time (min) | Fast, 0.03 to 0.05 |
| Viscosity (cPs) | Low, 40 to 50 |
| High Temperature Resistance (°C) | 82 |
| Low Temperature Resistance (°C) | -73 |
| Light Refractive Index (RI) | 1.4200 to 1.4800 |
| Key Specifications | Mil-Spec (United States Military Standard): MIL Spec A46050-C Type II |
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| Cure Temperature | Cure Time Test Method |
|---|---|
| 20 to 25°C |
| Cure Time | Test Method |
|---|---|
| Fast | |
| 0.03 to 0.05 min | Cure time is related to bond thickness. These values are typical but are dependent on bond line. Note: All Bostik cyanoacrylates are non-corrosive to copper. |
| Dielectric Constant | Test Method |
|---|---|
| 3.34 | 1mc (ASTM D-150-54T) |
| Dissipation Factor | Test Method |
|---|---|
| 2.02000 | @ 1mc, % |
| Light Refractive Index (RI) | Test Method |
|---|---|
| 1.4200 to 1.4800 | in (20 C/D) |
| Outgassing | Temperature (°C) | Test Method |
|---|---|---|
| No outgassing | 22°C | 10.6mm Hg 72°F |
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