Bostik 7435 Maximum Gap Filler Datasheet Bostik 7435 Maximum Gap Filler

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  • Description for Bostik 7435 Maximum Gap Filler

    One-component; bonds instantly; easily dispensed; very high viscosity; slow fixturing.

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

    *See Terms of Use Below

    Application Type Bond, Fixture
    1 Part or 2 Part 1-Part
    Material Form Liquid
    Substrate Porous substrates
    Manufacturer Bostik
    Chemistry Cyanoacrylate, Ethyl
    Cure Method Moisture
    Cure Temperature (°C) 20 to 25
    Cure Time (min) 1,440, 0.42 to 0.75
    Viscosity (cPs) Very high, 2,300 to 2,700
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -73
    Light Refractive Index (RI) 1.4200 to 1.4800
    Key Specifications Mil-Spec (United States Military Standard): MIL Spec A46050-C Type II

  • Technical Data for Bostik 7435 Maximum Gap Filler

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Liquid
    • Substrate
      • Porous Substrates
    • Chemistry
    • Cure Method
      • Moisture / Condensation Cure - Moisture
    • Key Specifications
      • Mil-Spec (United States Military Standard) : A-46050C - MIL Spec A46050-C Type II
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25 Test Method
    Cure Time (min) 1,440, 0.42 to 0.75 Test Method
    Viscosity (cPs) Very high, 2,300 to 2,700
    Fixture or Handling Strength Time (min) Slow
    Bond Strength
    Shear Strength (psi) High
    Impact Strength (psi) 4 to 6 (lbs/in)
    Tensile Strength (psi) High, 4000 (piw)
    Material Resistance
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -73
    Conductivity
    Dissipation Factor 2.02000 Test Method
    Dielectric Constant 3.34 Test Method
    Hardness
    Shore D Hardness 65(Barcol)
    Elongation (%) 0
    Other Properties
    Light Refractive Index (RI) 1.4200 to 1.4800 Test Method
    Specific Gravity 1.110
    Outgassing No outgassing Test Method
    Flash Point (°F) 200.0
    Business Information
    Shelf Life Details Keep unopened adhesively refrigerated until needed.
    Shelf Life (mon) >12
    Not Good For
    Don't Use With some plastics

  • Best Practices for Bostik 7435 Maximum Gap Filler

    *See Terms of Use Below

    1. Surface Preparation

      Parts to be bonded with cyanoacrylates must be clean and free of oil, silicone and mold release agents.

    2. Application

      Do not over apply adhesive, especially high viscosity types. This could increase bond line gap and cause “squeeze out” of adhesive which creates handling and odor problems.

      Best results are obtained on very close fitting surfaces, the thinner the gap between parts the better the bond strength.

    3. Curing

      In low humidity conditions, the use of Cyanoacrylate Accelerator is recommended for rapid fixturing of parts.

    4. Testing

      Because cyanoacrylate may damage some plastics, testing on scrap material is suggested.

  • Comparable Materials for Bostik 7435 Maximum Gap Filler

    *See Terms of Use Below

    Spec Engine® Results

    • Henkel
      Loctite 4310(Henkel)

      Designed for bonding applications that require very rapid fixturing, fillet cure or surface cure, one part - requires no mixing, UV light cure, ultraviolet (UV) / Visible light.

    • Henkel
      Loctite 4306(Henkel)

      A One part component designed for bonding applications, Cyanoacrylate/UV Technology, ultraviolet (UV) / visible light cure, secondary humidity cure, Suitable for assembly of disposable medical devices.

    • Hernon
      Instantbond 109(Hernon)

      A low viscosity, state-of-the-art, single component, solventless, room temperature curing Modified ethyl cyanoacrylate adhesive. It can bond a wide variety of surfaces including thermoplastics, elastomers, ceramics, leather, cork, and paper, but is particularly suited for bonding metal substrates.

    • Compare All

    Closest Results from this Manufacturer

    • Bostik
      Born2Bond Light Lock HV(Bostik)

      A low-odor, low-blooming, dual curing, cyanoacrylate adhesives. They are designed for bonding applications, conformal coating, encapsulation, electronics assembly, glass to metal bonding for jewelry and watches and long open time.

    • Compare All
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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C
Cure Time Test Methods
Cure Time Test Method
1,440 min
0.42 to 0.75 min Cure time is related ot bod thickness. These values are typical but are dependent on bond line. Note: All bostik cyanacrylates are non-corrosive to copper.
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.34 1mc (ASTM D-150-54T)
Dissipation Factor Test Methods
Dissipation Factor Test Method
2.02000 @ 1mc, %
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) Test Method
1.4200 to 1.4800 in (20 C/D)
Outgassing Test Methods
Outgassing Temperature (°C) Test Method
No outgassing 22°C 10.6mm Hg 72°F