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Description for Bostik 7435 Maximum Gap Filler
One-component; bonds instantly; easily dispensed; very high viscosity; slow fixturing.Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.
Application Type Bond, Fixture 1 Part or 2 Part 1-Part Material Form Liquid Substrate Porous substrates Manufacturer Bostik Chemistry Cyanoacrylate, Ethyl Cure Method Moisture Cure Temperature (°C) 20 to 25 Cure Time (min) 1,440, 0.42 to 0.75 Viscosity (cPs) Very high, 2,300 to 2,700 High Temperature Resistance (°C) 82 Low Temperature Resistance (°C) -73 Light Refractive Index (RI) 1.4200 to 1.4800 Key Specifications Mil-Spec (United States Military Standard): MIL Spec A46050-C Type II -
Technical Data for Bostik 7435 Maximum Gap Filler
Overview
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Application Type
- Adhesive - Bond, Fixture
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1 Part or 2 Part
- 1-Part
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Material Form
- Liquid
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Substrate
- Porous Substrates
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Chemistry
- Cyanoacrylate (CA) - Cyanoacrylate
- Other - Ethyl
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Cure Method
- Moisture / Condensation Cure - Moisture
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Key Specifications
- Mil-Spec (United States Military Standard) : A-46050C - MIL Spec A46050-C Type II
Specifications
Cure Specs
Cure Temperature (°C) 20 to 25 Test Method Cure Time (min) 1,440, 0.42 to 0.75 Test Method Viscosity (cPs) Very high, 2,300 to 2,700 Fixture or Handling Strength Time (min) Slow Bond Strength
Shear Strength (psi) High Impact Strength (psi) 4 to 6 (lbs/in) Tensile Strength (psi) High, 4000 (piw) Material Resistance
High Temperature Resistance (°C) 82 Low Temperature Resistance (°C) -73 Conductivity
Dissipation Factor 2.02000 Test Method Dielectric Constant 3.34 Test Method Hardness
Shore D Hardness 65(Barcol) Elongation (%) 0 Other Properties
Light Refractive Index (RI) 1.4200 to 1.4800 Test Method Specific Gravity 1.110 Outgassing No outgassing Test Method Flash Point (°F) 200.0 Business Information
Shelf Life Details Keep unopened adhesively refrigerated until needed. Shelf Life (mon) >12 Not Good For
Don't Use With some plastics -
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Best Practices for Bostik 7435 Maximum Gap Filler
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Surface Preparation
Parts to be bonded with cyanoacrylates must be clean and free of oil, silicone and mold release agents.
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Application
Do not over apply adhesive, especially high viscosity types. This could increase bond line gap and cause “squeeze out” of adhesive which creates handling and odor problems.
Best results are obtained on very close fitting surfaces, the thinner the gap between parts the better the bond strength.
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Curing
In low humidity conditions, the use of Cyanoacrylate Accelerator is recommended for rapid fixturing of parts.
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Testing
Because cyanoacrylate may damage some plastics, testing on scrap material is suggested.
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
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20 to 25°C |
Cure Time Test Methods
Cure Time | Test Method |
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1,440 min | |
0.42 to 0.75 min | Cure time is related ot bod thickness. These values are typical but are dependent on bond line. Note: All bostik cyanacrylates are non-corrosive to copper. |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
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3.34 | 1mc (ASTM D-150-54T) |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
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2.02000 | @ 1mc, % |
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) | Test Method |
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1.4200 to 1.4800 | in (20 C/D) |
Outgassing Test Methods
Outgassing | Temperature (°C) | Test Method |
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No outgassing | 22°C | 10.6mm Hg 72°F |