• Description for Bostik 7435 Maximum Gap Filler

    One-component; bonds instantly; easily dispensed; very high viscosity; slow fixturing.

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

    *See Terms of Use Below

    Application Type Bond, Fixture
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate Porous substrates
    Manufacturer Bostik
    Chemistry Cyanoacrylate, Ethyl
    Cure Method Moisture
    Cure Temperature (°C) 20 to 25
    Cure Time (min) 1,440, 0.42 to 0.75
    Viscosity (cPs) Very high, 2,300 to 2,700
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -73
    Light Refractive Index (RI) 1.4200 to 1.4800
    Key Specifications Mil-Spec (United States Military Standard): MIL Spec A46050-C Type II
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C
Cure Time Test Methods
Cure Time Test Method
1,440 min
0.42 to 0.75 min Cure time is related ot bod thickness. These values are typical but are dependent on bond line. Note: All bostik cyanacrylates are non-corrosive to copper.
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.34 1mc (ASTM D-150-54T)
Dissipation Factor Test Methods
Dissipation Factor Test Method
2.02000 @ 1mc, %
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) Test Method
1.4200 to 1.4800 in (20 C/D)
Outgassing Test Methods
Outgassing Temperature (°C) Test Method
No outgassing 22°C 10.6mm Hg 72°F