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Description for Bostik 7534 High Peel
One-component; bonds instantly; easily dispensed; high peel; excellent elongation.Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.
Application Type Bond 1 Part or 2 Part 1-Part Material Form Liquid Manufacturer Bostik Chemistry Cyanoacrylate, Ethyl Cure Method Moisture Cure Temperature (°C) 20 to 25 Cure Time (min) 0.13 to 0.25 Viscosity (cPs) 400 to 800 High Temperature Resistance (°C) -81 to 127, 100 Low Temperature Resistance (°C) -81 Light Refractive Index (RI) 1.4200 to 1.4800 Key Specifications Mil-Spec (United States Military Standard): MIL Spec A46050-C Type II -
Technical Data for Bostik 7534 High Peel
Overview
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Application Type
- Adhesive - Bond
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1 Part or 2 Part
- 1-Part
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Material Form
- Liquid
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Chemistry
- Cyanoacrylate (CA) - Cyanoacrylate
- Other - Ethyl
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Cure Method
- Moisture / Condensation Cure - Moisture
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Key Specifications
- Mil-Spec (United States Military Standard) : A-46050C - MIL Spec A46050-C Type II
Specifications
Cure Specs
Cure Temperature (°C) 20 to 25 Test Method Cure Time (min) 0.13 to 0.25 Test Method Viscosity (cPs) 400 to 800 Bond Strength
Peel Strength (piw) High Shear Strength (psi) High Impact Strength (psi) 5 to 10 (lbs/in) Tensile Strength (psi) High, 2900 (lbs/in) Material Resistance
High Temperature Resistance (°C) -81 to 127, 100 Low Temperature Resistance (°C) -81 Conductivity
Dissipation Factor 2.02000 Test Method Dielectric Constant 3.34 Test Method Hardness
Shore D Hardness 65(Barcol) Elongation (%) Excellent, 2 Other Properties
Light Refractive Index (RI) 1.4200 to 1.4800 Test Method Outgassing No outgassing Test Method Flash Point (°F) 200.0 Business Information
Shelf Life (mon) 12 Not Good For
Don't Use With some plastics -
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Best Practices for Bostik 7534 High Peel
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Surface Preparation
Parts to be bonded with cyanoacrylates must be clean and free of oil, silicone and mold release agents.
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Comparable Materials for Bostik 7534 High Peel
Spec Engine® Results
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
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20 to 25°C |
Cure Time Test Methods
Cure Time | Test Method |
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0.13 to 0.25 min | Cure time is related to bond thickness. These values are typical but are dependent on bond line. Note: All Bostik cyanoacrylates are non-corrosive to copper. |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
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3.34 | 1mc (ASTM D-150-54T) |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
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2.02000 | @ 1mc, % |
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) | Test Method |
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1.4200 to 1.4800 | in (20 C/D) |
Outgassing Test Methods
Outgassing | Temperature (°C) | Test Method |
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No outgassing | 22°C | 10.6mm Hg 72°F |