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Description for Bostik 8104
A two component water-based adhesive for bonding primed polyolefin foam-backed vinyl by heat activation to ABS, primed PP, PC/ABS blends, and fiber board.Application Type Bond 1 Part or 2 Part 2-Part Material Form Liquid Substrate Primed polyolefin foam-backed vinyl, PC/ABS blends, POF/PVC, Fiberboard, PC/ABS blends, Expanded vinyls Manufacturer Bostik Chemistry Modified urethane dispersion, Water-based Cure Method Heat, 2-Part Cure Viscosity (cPs) 1,750 Color Green liquid High Temperature Resistance (°C) Excellent Heat results Density (g/cm³) 8.90 (lb/gal) -
Technical Data for Bostik 8104
Overview
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Application Type
- Adhesive - Bond
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1 Part or 2 Part
- 2-Part
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Material Form
- Liquid
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Substrate
- Vinyl - Primed polyolefin foam-backed vinyl, Expanded vinyls
- ABS - PC/ABS blends
- Polyvinyl chloride (PVC) - POF/PVC
- Polycarbonate - PC/ABS blends
- Wood - Fiberboard
- Other - Primed PP
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Industry
- Other - Adhesive for vacuum lamination of bilaminate and expanded vinyls
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Chemistry
- Polyurethane - Modified urethane dispersion
- Water-based
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Application Method
- Roll - Roll coater
- Brush - Hand Brush
- Spray
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Cure Method
- Heat
- 2-Part Cure
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Color
- Green - Green liquid
Specifications
Cure Specs
Viscosity (cPs) 1,750 Test Method Work / Pot Time (min) 480 Mix Ratio 3:5 (by weight) Material Resistance
High Temperature Resistance (°C) Excellent Heat results Moisture/Humidity Resistance Excellent humidity cycling results Other Properties
Specific Gravity 1.070 Density (g/cm³) 8.90 (lb/gal) Business Information
Shelf Life (mon) 4 -
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Best Practices for Bostik 8104
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Application
Apply by roller coater, hand brush, or spray at the rate of 100-140 grams per square meter.
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Curing
Dry approximately 4-5 minutes at 63-85°C (145-185°F). Heat activate under pressure (vacuum) at a bond line temperature of 43-85°C (109-185°F) within 60 minutes after drying. Maximum hot bond strength develops after 72 hours.
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Clean-Up
Water while wet, MEK for dry adhesive
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Comparable Materials for Bostik 8104
Spec Engine® Results
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