Bostik AQ8104W-FF

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Description for Bostik AQ8104W-FF

A two component water-based adhesive for bonding primed polyolefin foam-backed vinyl and expanded vinyl by heat activation to ABS, primed PP, ABS/PC blends and fiber board.

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Chemical Resistance	Chemical Resistance: Plasticizer resistant
Application Type	Bond
1 Part or 2 Part	2-Part
Material Form	Liquid
Substrate	PC/ABS blends, Fiberboard, Vinyl, Foam-backed vinyl, Primed polyolefin, PC/ABS blends, Foam-backed vinyl, Expanded vinyl
Industry	Automotive interior trim
Manufacturer	Bostik
Chemistry	Modified polyurethane, Water-based
Cure Method	2-Part Cure
Cure Temperature (°C)	63 to 86
Cure Time (min)	2.00 to 6
Viscosity (cPs)	Sprayable viscosity, 1,750
Color	Milky white liquid
High Temperature Resistance (°C)	Excellent Heat resistance
Density (g/cm³)	8.90 (lb/gal)

Best Practices for Bostik AQ8104W-FF

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Technical Data for Bostik AQ8104W-FF

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Overview

Chemical Resistance
- Chemical Resistance : Plasticizer Resistance - Plasticizer resistant
Application Type
- Adhesive - Bond
1 Part or 2 Part
- 2-Part
Material Form
- Liquid
Substrate
- Foam - Foam-backed vinyl
- Polyolefin - Primed polyolefin
- Polycarbonate - PC/ABS blends
- Vinyl - Foam-backed vinyl, Expanded vinyl
- ABS - PC/ABS blends
- Wood - Fiberboard
- Other - Primed PP
Industry
- Textiles - Textile applications
- Interior - Automotive interior trim
- Other - Center-pad insert, Edge-turning applications, General adhesive assembly
Chemistry
- Polyurethane - Modified polyurethane
- Water-based
Application Method
- Roll - Roll coater
- Brush
- Spray
Cure Method
- 2-Part Cure
Color
- White - Milky white liquid

Specifications

Cure Specs

Cure Temperature (°C)	63 to 86
Cure Time (min)	2.00 to 6
Viscosity (cPs)	Sprayable viscosity, 1,750	Test Method
Work / Pot Time (min)	480

Material Resistance

High Temperature Resistance (°C)	Excellent Heat resistance
Moisture/Humidity Resistance	Excellent humidity resistance

Other Properties

Density (g/cm³)	8.90 (lb/gal)

Business Information

Shelf Life Temperature (°F)	77
Shelf Life (mon)	4

Best Practices for Bostik AQ8104W-FF

*See Terms of Use Below
1. Application
  
  Stir well before using. Apply by roller coater, brush or spray at the rate of 80-120 grams per square meter wet.
  
  Please refer to Bostik Findley Technical Assistance for spray equipment recommendation.
2. Curing
  
  Dry approximately 2 to 6 minutes at 63-86 C (145-185½F) with good air flow. Heat activate under vacuum pressure of 12-25 psi for 10-30 seconds at a bond line temperature of 43-85½C (109-185½F) within 60 minutes after drying. Excellent initial strength develops to a maximum after 72 hours at room temperature.
3. Clean-Up
  
  Water while wet, MEK for dry adhesive
Comparable Materials for Bostik AQ8104W-FF

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Spec Engine^® Results
- Conathane CE-1175(Elantas (Altana))
  A single-component water based polyurethane conformal coating. Designed for thin film applications, and developed specifically to provide the ultimate in humidity resistance and hydrolytic stability. Maintains excellent adhesion to phenolic and epoxy glass laminates even in adverse environmental conditions.
- 8104(Bostik)
  A two component water-based adhesive for bonding primed polyolefin foam-backed vinyl by heat activation to ABS, primed PP, PC/ABS blends, and fiber board.
- 20-800(Bostik)
  Off-white, Foam combining contact adhesive. Lower cost version of 20-600. Faster tack.
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