

-
Description for Bostik AQ8104W-FF
A two component water-based adhesive for bonding primed polyolefin foam-backed vinyl and expanded vinyl by heat activation to ABS, primed PP, ABS/PC blends and fiber board.Chemical Resistance Chemical Resistance: Plasticizer resistant Application Type Bond 1 Part or 2 Part 2 Part Material Form Liquid Substrate Primed polyolefin, Vinyl, PC/ABS blends, Fiberboard, Foam-backed vinyl, Foam-backed vinyl, Expanded vinyl Industry Automotive interior trim Manufacturer Bostik Chemistry Modified polyurethane, Water-based Cure Method 2-Part Cure Cure Temperature (°C) 63 to 86 Cure Time (min) 2.00 to 6 Viscosity (cPs) Sprayable viscosity, 1,750 Color Milky white liquid High Temperature Resistance (°C) Excellent Heat resistance Density (g/cm³) 8.90 (lb/gal)
Popular Articles
Testing the effectiveness of surface treatments
Read ArticleUnique Advantages of Contact Adhesives
Read ArticleCharacteristics of MMAs
Read ArticleInfographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation
Read ArticleSponsored Articles
Unique Advantages of Contact Adhesives
Read ArticleUsing LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials
Read ArticleSylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:
Read ArticleCase Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive
Read ArticleFeatured Ads
