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Description for Bostik B-Component SMP
Paste like compound which is used as an accelerator for the curing process for SMP products.Application Type Bond 1 Part or 2 Part 2-Part Material Form Paste Manufacturer Bostik Chemistry Dispersion-based Cure Method Part A/Part B Application Temperature (°F) 41 to 95 Color Off White High Temperature Resistance (°C) 5 to 40 -
Technical Data for Bostik B-Component SMP
Overview
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Application Type
- Adhesive - Bond
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1 Part or 2 Part
- 2-Part
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Material Form
- Paste
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Industry
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Chemistry
- Other - Dispersion-based
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Cure Method
- 2-Part Cure - Part A/Part B
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Color
- Off-White - Off White
Specifications
Cure Specs
Application Temperature (°F) 41 to 95 Thixotropic Controlled Mix Ratio 1:40 (by volume) Material Resistance
High Temperature Resistance (°C) 5 to 40 Hardness
Shore A Hardness 55 Test Method Other Properties
Specific Gravity ~1.4 (g/ml) Business Information
Shelf Life Details B-Component SMP® may be stored for 12 months in the closed (unopened) container in a dry place at temperatures between 41°F to 104°F (+5°C and +40°C). Must be stored at room temperature—protect from freezing. Shelf Life Temperature (°F) 41 to 104 Shelf Life (mon) 12 -
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Best Practices for Bostik B-Component SMP
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Mixing
The two-components are mixed together by means of a static mixer shortly before extrusion. Two static mixers are available: Static Mixer 8® for 70-08 / 70-09 and Static Mixer 10® for 70-03 / 70-03A SK / 70-04 / 70-05.
The mixing ratio of two-component adhesives is controlled with great accuracy. The one-component (A-Component) SMP adhesive is available in 400 ml packaging for use in the Dual SMP 400P gun applicator
and in the 20 oz. (600 ml) sausages and 52 gallon (200 liter) drum for use in the SMP Precision Dose 2C Pump system.
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Comparable Materials for Bostik B-Component SMP
Spec Engine® Results
Closest Results from this Manufacturer
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