Bostik B-Component SMP

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Description for Bostik B-Component SMP

Paste like compound which is used as an accelerator for the curing process for SMP products.

Application Type	Bond
1 Part or 2 Part	2-Part
Material Form	Paste
Manufacturer	Bostik
Chemistry	Dispersion-based
Cure Method	Part A/Part B
Application Temperature (°F)	41 to 95
Color	Off White
High Temperature Resistance (°C)	5 to 40

Best Practices for Bostik B-Component SMP

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Technical Data for Bostik B-Component SMP

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Overview

Application Type
- Adhesive - Bond
1 Part or 2 Part
- 2-Part
Material Form
- Paste
Industry
- Construction
Chemistry
- Other - Dispersion-based
Cure Method
- 2-Part Cure - Part A/Part B
Color
- Off-White - Off White

Specifications

Cure Specs

Application Temperature (°F)	41 to 95
Thixotropic	Controlled
Mix Ratio	1:40 (by volume)

Material Resistance

High Temperature Resistance (°C)	5 to 40

Hardness

Shore A Hardness	55	Test Method

Other Properties

Specific Gravity	~1.4 (g/ml)

Business Information

Shelf Life Details	B-Component SMP® may be stored for 12 months in the closed (unopened) container in a dry place at temperatures between 41°F to 104°F (+5°C and +40°C). Must be stored at room temperature—protect from freezing.
Shelf Life Temperature (°F)	41 to 104
Shelf Life (mon)	12

Best Practices for Bostik B-Component SMP

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1. Mixing
  
  The two-components are mixed together by means of a static mixer shortly before extrusion. Two static mixers are available: Static Mixer 8® for 70-08 / 70-09 and Static Mixer 10® for 70-03 / 70-03A SK / 70-04 / 70-05.
  
  The mixing ratio of two-component adhesives is controlled with great accuracy. The one-component (A-Component) SMP adhesive is available in 400 ml packaging for use in the Dual SMP 400P gun applicator
  
  and in the 20 oz. (600 ml) sausages and 52 gallon (200 liter) drum for use in the SMP Precision Dose 2C Pump system.
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