Bostik B-Component SMP

Bostik B-Component SMP Datasheet
  • Description for Bostik B-Component SMP

    Paste like compound which is used as an accelerator for the curing process for SMP products.

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Paste
    Manufacturer Bostik
    Chemistry Dispersion-based
    Cure Method Part A/Part B
    Color Off White
    High Temperature Resistance (°C) 5 to 40
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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55 DIN 53505