

-
Description for Bostik BOSC25C-79
An adduct of toluene diisocyanate solvated in ethyl acetate. It is used when one wants slower cure times than MDI based systems.Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.
Application Type Bond, Coat 1 Part or 2 Part 1 Part Material Form Liquid Manufacturer Bostik Chemistry MDI Cure Method Solvent Cure Temperature (°C) Moderate
Popular Articles
Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation
Read ArticleTesting the effectiveness of surface treatments
Read ArticleSilicones in LED Lighting | Gluespec
Read ArticleElectrically Conductive Adhesives
Read ArticleSponsored Articles
Unique Advantages of Contact Adhesives
Read ArticleUsing LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials
Read ArticleSylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:
Read ArticleCase Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive
Read ArticleFeatured Ads
