

-
Description for Bostik BOSC25C-79
An adduct of toluene diisocyanate solvated in ethyl acetate. It is used when one wants slower cure times than MDI based systems.Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.
Application Type Bond, Coat 1 Part or 2 Part 1-Part Material Form Liquid Manufacturer Bostik Chemistry MDI Cure Method Solvent Cure Temperature (°C) Moderate -
Technical Data for Bostik BOSC25C-79
Overview
-
1 Part or 2 Part
- 1-Part
-
Material Form
- Liquid
-
Chemistry
- Other - MDI
-
Cure Method
- Solvent
Specifications
Cure Specs
Cure Temperature (°C) Moderate Work / Pot Time (min) Good Hardness
Modulus (psi) Lower Other Properties
Flash Point (°F) 29.0 Business Information
Shelf Life Details 180 days in sealed continers, Store at 55°F to 75°F Shelf Life Temperature (°F) 131 to 167 Shelf Life (mon) 6 -
Best Practices for Bostik BOSC25C-79
-
Application
Read MSDS before opening container.
-
Mixing
Material should be blended with base resin just prior to use. Add to resin solution with sufficient agitation. Make up only enough blend to use in 4 hours. Mixed resin solution will gel with time.
-
-
Comparable Materials for Bostik BOSC25C-79
Spec Engine® Results
Closest Results from this Manufacturer
Popular Articles
Silicones in LED Lighting | Gluespec
Read ArticleInfographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation
Read ArticleTesting the effectiveness of surface treatments
Read ArticleElectrically Conductive Adhesives
Read ArticleSponsored Articles
Unique Advantages of Contact Adhesives
Read ArticleUsing LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials
Read ArticleSylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:
Read ArticleCase Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive
Read ArticleFeatured Ads
