Application Type Bond 1 Part or 2 Part 1 Part Material Form Liquid Substrate Ceramic tile, Well-Bonded Vinyl, Cement backer board, Chip Board, Concrete, Terrazzo, Particle Board, Cement Patch/Underlayment, PlyWood, Stone Inlays, Wood, OSB, Solid Hardwood, Engineered Hardwood, Bamboo, Cork, Parquet Manufacturer Bostik Chemistry Urethane, Acrylic Application Method Notched trowel Cure Method Moisture Odor Details Mild Cure Time (min) 480 to 600, 360 to 480, 480 to 720 Viscosity (cPs) 220,000 Color White, Eggshell, Tan High Temperature Resistance (°C) 66 Low Temperature Resistance (°C) -40 Density (g/cm³) 12.66 (weight (lbs/gal))
Technical Data for Bostik Bostik BEST
- Adhesive - Bond
1 Part or 2 Part
- 1 Part or 2 Part - 1 Part
- Construction - Wood Floors, Hospital, Offices, Heavy Commercial, Offices/Light Commercial, Residential
- Spatula/Trowel - Notched trowel
- Moisture / Condensation Cure - Moisture
- Brown - Tan
- Other - Eggshell
Application Temperature (°F) 50 to 100 Odor Details Mild Cure Time (min) 480 to 600, 360 to 480, 480 to 720 Test Method Open Time Temperature (°C) 16, 16, 16, 21, 21, 21, 27, 27, 27 Viscosity (cPs) 220,000 Work / Pot Time (min) 180 Open Time (min) 210, 210, 180, 180, 180, 150, 180, 150, 120
Shear Strength (psi) >180 Test Method Tensile Strength (psi) >175
High Temperature Resistance (°C) 66 Test Method Low Temperature Resistance (°C) -40 Test Method
Elongation (%) >100, >150 Test Method
Flash Point (°F) 142.0 Test Method % Solids (%) >95 Density (g/cm³) 12.66 (weight (lbs/gal))
Shelf Life Details Store at temperatures between 50°F and 100°F. Shelf life is one year from date of manufacturing in closed,original packaging. Shelf Life Temperature (°F) 50 to 100 Shelf Life Type From date of manufacture Shelf Life (mon) 12
Not Good For
Don't Use With VCT, Vinyl
Best Practices for Bostik Bostik BEST
Surfaces must be absorptive, clean, and free from loose materials, oil, grease, sealers, curing compounds, waxes, silicates, laitance, and all other surface contaminants that may inhibit proper bond. Completely remove cutback adhesive residue or other surface contaminants by diamond grinding, shot blasting, or scarifying to open the pores of the concrete. All surfaces to be treated must have a concrete surface profile (CSP) of 1-3 (similar to a broomed finish), as defined by ICRI (International Concrete Repair Institute, Guideline No. 03732). Maximum acceptable floor variation is 3/16" in 10 feet. Areas requiring patching or leveling must be done using a Portland cement-based material (e.g., Bostik Webcrete® 95, Webcrete® 98, SL-Rapid™, SL-100™, SL-150™, SL-175™, SL-200™ or UltraFinish™ Pro). Seal any cracks larger than 1/8" or expansion joints with Bostik 915FS™ or 955-SL™.
PLEASE NOTE: Concrete substrate should NOT be smooth and reflective
it must have a concrete surface profile of CSP 1-3 (similar to a broomed finish), as defined by ICRI (International Concrete Repair Institute, Guideline No. 03732). It also must be tested in accordance with ASTM F3191 and be found porous, where a 1/4" drop of water must absorb into the concrete within 1 minute.
Humidity affects cure to a greater degree than temperature
the higher the humidity, the faster the cure. Under normal conditions, light foot traffic is acceptable after 8 to 10 hours
normal traffic after 24 hours.
As you work, immediately clean any adhesive from prefinished flooring with Bostik Ultimate™ Adhesive Remover or mineral spirits (be careful not to harm finish), then dry buff with a nonabrasive towel. Immediately clean all tools and equipment with Bostik’s Ultimate™ Adhesive Remover or mineral spirits before material cures.
TROWEL CLEAN-UP TIP: Before use, cover areas of the trowel that are not used to spread the adhesive with blue tape. After use, simply tear off tape before material cures, and clean the remainder of the trowel with adhesive remover.
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Cure Time Test Methods
|Cure Time||Test Method|
|480 to 600 min|
|360 to 480 min||Light foot traffic|
|480 to 720 min||Normal foot traffic|
Shear Strength Test Methods
|>180 psi||Oak to concrete|
High Temperature Resistance Test Methods
|High Temperature Resistance||Test Method|
Low Temperature Resistance Test Methods
|Low Temperature Resistance||Test Method|
Elongation Test Methods
Flash Point Test Methods
|Flash Point||Test Method|