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Description for Bostik EFA Engineered Flooring Adhesive
Single component, moisture cure adhesive; wet lay; fast cure rate; VOC compliant; low odor.Application Type Bond 1 Part or 2 Part 1 Part Material Form Liquid Substrate Ceramic, Cement, Chip Board, Concrete, Vinyl, Terrazzo, Particle Board, PlyWood, Wood Manufacturer Bostik Chemistry Acrylic, Urethane Application Method Notched trowel Cure Method Moisture Cure Time (min) Fast Viscosity (cPs) 275,000, Self-Leveling Color Beige, Beige High Temperature Resistance (°C) 49 Low Temperature Resistance (°C) -7 Density (g/cm³) 9 (weight (lbs/gal))
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