Bostik EFA Engineered Flooring Adhesive

Bostik EFA Engineered Flooring Adhesive Datasheet
  • Description for Bostik EFA Engineered Flooring Adhesive

    Single component, moisture cure adhesive; wet lay; fast cure rate; VOC compliant; low odor.

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    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate Ceramic, Vinyl, Cement, Chip Board, Concrete, Terrazzo, Particle Board, PlyWood, Wood
    Manufacturer Bostik
    Chemistry Urethane, Acrylic
    Application Method Notched trowel
    Cure Method Moisture
    Cure Time (min) Fast
    Viscosity (cPs) Self-Leveling, 275,000
    Color Beige, Beige
    High Temperature Resistance (°C) 49
    Low Temperature Resistance (°C) -7
    Density (g/cm³) 9 (weight (lbs/gal))
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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  • Comparable Materials

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