Bostik H2315-02

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Description for Bostik H2315-02

Hot Melt Pressure Sensitive Adhesive

Application Type	Bond
1 Part or 2 Part	1 Part
Material Form	Pillows
Manufacturer	Bostik
Chemistry	Hot melt
Cure Method	Pressure Sensitive, Hotmelt
Viscosity (cPs)	High, 30,800, 11,800, 8,000, 4,000
Color	Amber
High Temperature Resistance (°C)	high temp. resistance
Density (g/cm³)	0.94 (g/cc)

Best Practices for Bostik H2315-02

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Clean-Up

Mineral oil or paraffin wax, not to exceed flash point as stated on the MSDS, followed by a thorough purge with the adhesive itself.

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Technical Data

Overview

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Specifications

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Best Practices

*See Terms of Use Below
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Comparable Materials

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Softening Point Test Methods

Softening Point	Unit Test Method
120°C	Ring and Ball (Herzog – ASTM E28)

Viscosity Test Methods

Viscosity	Temperature
High
30,800 cPs	163°C
11,800 cPs	177°C
8,000 cPs	191°C
4,000 cPs	204°C

Density Test Methods

Density	Temperature
0.94 (g/cc)	25°C

Bostik H2315-02

Description for Bostik H2315-02

Best Practices for Bostik H2315-02