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Application Type Bond 1 Part or 2 Part 1-Part Material Form Pillows Manufacturer Bostik Chemistry Hot melt Cure Method Pressure Sensitive, Hotmelt Application Temperature (°F) High Viscosity (cPs) High, 30,800, 11,800, 8,000, 4,000 Color Amber High Temperature Resistance (°C) high temp. resistance Density (g/cm³) 0.94 (g/cc) -
Technical Data for Bostik H2315-02
Overview
Specifications
Cure Specs
Application Temperature (°F) High Viscosity (cPs) High, 30,800, 11,800, 8,000, 4,000 Test Method Softening Point (°C) 120 Test Method Bond Strength
Shear Strength (psi) High Material Resistance
High Temperature Resistance (°C) high temp. resistance Other Properties
Density (g/cm³) 0.94 (g/cc) Test Method Business Information
Shelf Life Temperature (°F) 77 -
Best Practices for Bostik H2315-02
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Clean-Up
Mineral oil or paraffin wax, not to exceed flash point as stated on the MSDS, followed by a thorough purge with the adhesive itself.
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Comparable Materials for Bostik H2315-02
Spec Engine® Results
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