Bostik H2315-02

Bostik H2315-02 Datasheet
  • Description for Bostik H2315-02

    Hot Melt Pressure Sensitive Adhesive

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Pillows
    Manufacturer Bostik
    Chemistry Hot melt
    Cure Method Pressure Sensitive, Hotmelt
    Viscosity (cPs) High, 30,800, 11,800, 8,000, 4,000
    Color Amber
    High Temperature Resistance (°C) high temp. resistance
    Density (g/cm³) 0.94 (g/cc)
  • Technical Data for Bostik H2315-02

    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Other - Pillows
    • Chemistry
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
      • Hotmelt
    • Color
      • Red - Amber
    Cure Specs
    Application Temperature (°F) High
    Viscosity (cPs) High, 30,800, 11,800, 8,000, 4,000 Test Method
    Softening Point (°C) 120 Test Method
    Bond Strength
    Shear Strength (psi) High
    Material Resistance
    High Temperature Resistance (°C) high temp. resistance
    Other Properties
    Density (g/cm³) 0.94 (g/cc) Test Method
    Business Information
    Shelf Life Temperature (°F) 77
  • Best Practices for Bostik H2315-02

    *See Terms of Use Below

    1. Clean-Up

      Mineral oil or paraffin wax, not to exceed flash point as stated on the MSDS, followed by a thorough purge with the adhesive itself.

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Softening Point Test Methods
Softening Point Unit Test Method
120°C Ring and Ball (Herzog – ASTM E28)
Viscosity Test Methods
Viscosity Temperature
30,800 cPs 163°C
11,800 cPs 177°C
8,000 cPs 191°C
4,000 cPs 204°C
Density Test Methods
Density Temperature
0.94 (g/cc) 25°C