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Description for Bostik H2465
Hot Melt AdhesiveNote: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.
Application Type Bond 1 Part or 2 Part 1-Part Material Form Liquid Manufacturer Bostik Chemistry Hot melt Cure Method Hot melt Density (g/cm³) 0.98 (g/cc) -
Technical Data for Bostik H2465
Overview
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Application Type
- Adhesive - Bond
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1 Part or 2 Part
- 1-Part
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Material Form
- Liquid
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Industry
- Construction
- Other - Multipurpose, Elastic attachments
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Chemistry
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Cure Method
- Hotmelt - Hot melt
Specifications
Cure Specs
Softening Point (°C) 83 Test Method Other Properties
Density (g/cm³) 0.98 (g/cc) Test Method Business Information
Shelf Life Details Can be stored 365 days in a clean dry place, in its original package at an average temperature of 25ºC or below. Storage temperature should not exceed 40ºC. Shelf Life Temperature (°F) 77 Shelf Life (mon) 12 -
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Best Practices for Bostik H2465
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Clean-Up
Mineral oil or paraffin wax, not to exceed flash point as stated on the MSDS, followed by a thorough purge with the adhesive itself.
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Comparable Materials for Bostik H2465
Spec Engine® Results
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