Bostik H2465 Datasheet Bostik H2465

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  • Description for Bostik H2465

    Hot Melt Adhesive

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

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    Application Type Bond
    1 Part or 2 Part 1-Part
    Material Form Liquid
    Manufacturer Bostik
    Chemistry Hot melt
    Cure Method Hot melt
    Density (g/cm³) 0.98 (g/cc)

  • Technical Data for Bostik H2465

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    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Liquid
    • Industry
    • Chemistry
    • Cure Method
      • Hotmelt - Hot melt
    Specifications
    Cure Specs
    Softening Point (°C) 83 Test Method
    Other Properties
    Density (g/cm³) 0.98 (g/cc) Test Method
    Business Information
    Shelf Life Details Can be stored 365 days in a clean dry place, in its original package at an average temperature of 25ºC or below. Storage temperature should not exceed 40ºC.
    Shelf Life Temperature (°F) 77
    Shelf Life (mon) 12

  • Best Practices for Bostik H2465

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    1. Clean-Up

      Mineral oil or paraffin wax, not to exceed flash point as stated on the MSDS, followed by a thorough purge with the adhesive itself.

  • Comparable Materials for Bostik H2465

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    Spec Engine® Results

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Softening Point Test Methods
Softening Point Unit Test Method
83°C Ring and Ball (Herzog – ASTM E28)
Density Test Methods
Density Temperature
0.98 (g/cc) 25°C