Bostik H2465

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Description for Bostik H2465

Hot Melt Adhesive

Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

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Application Type	Bond
1 Part or 2 Part	1 Part
Material Form	Liquid
Manufacturer	Bostik
Chemistry	Hot melt
Cure Method	Hot melt
Density (g/cm³)	0.98 (g/cc)

Best Practices for Bostik H2465

*See Terms of Use Below

Clean-Up

Mineral oil or paraffin wax, not to exceed flash point as stated on the MSDS, followed by a thorough purge with the adhesive itself.

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Technical Data

Overview

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Specifications

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Best Practices

*See Terms of Use Below
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Comparable Materials

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Softening Point Test Methods

Softening Point	Unit Test Method
83°C	Ring and Ball (Herzog – ASTM E28)

Density Test Methods

Density	Temperature
0.98 (g/cc)	25°C

Bostik H2465

Description for Bostik H2465

Best Practices for Bostik H2465