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Description for Bostik H5077
Peelable, resealable, pouch seal hot melt adhesive.Application Type Peelable Bond 1 Part or 2 Part 1-Part Material Form Liquid Substrate Polypropylene, Polyethylene Manufacturer Bostik Chemistry Hot melt Cure Method Pressure Sensitive, Hot melt Viscosity (cPs) 4,700, 1,100, 700, 500 Peelable Peelable Density (g/cm³) 0.95 (g/cc) -
Technical Data for Bostik H5077
Overview
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Application Type
- Adhesive - Peelable Bond
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1 Part or 2 Part
- 1-Part
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Material Form
- Liquid
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Substrate
- Polypropylene
- Polyethylene (LDPE, HDPE) - Polyethylene
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Industry
- Other - Resealable, pouch seal
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Chemistry
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Application Method
- Contact
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Cure Method
- Pressure Sensitive (min) - Pressure Sensitive
- Hotmelt - Hot melt
Specifications
Cure Specs
Viscosity (cPs) 4,700, 1,100, 700, 500 Test Method Softening Point (°C) 78 Test Method Hardness
Peelable Peelable Other Properties
Density (g/cm³) 0.95 (g/cc) Test Method Business Information
Shelf Life Details Can be stored 730 days in a clean dry place, in its original package at an average temperature of 25°C or below. Storage temperature should not exceed 40°C. Shelf Life Temperature (°F) <77 -
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Best Practices for Bostik H5077
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Clean-Up
Clean-up Procedure: Mineral oil or paraffin wax, not to exceed flash point as stated on the MSDS, followed by a through purge with the adhesive itself.
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Comparable Materials for Bostik H5077
Spec Engine® Results
Closest Results from this Manufacturer
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Softening Point Test Methods
Softening Point | Unit Test Method |
---|---|
78°C | Ring and Ball (Herzog – ASTM E28) |
Viscosity Test Methods
Viscosity | Test Method | Temperature |
---|---|---|
4,700 cPs | Brookfield -ASTM D3236 | 121°C |
1,100 cPs | Brookfield -ASTM D3236 | 149°C |
700 cPs | Brookfield -ASTM D3236 | 163°C |
500 cPs | Brookfield - ASTM D3236 | 177°C |
Density Test Methods
Density | Temperature |
---|---|
0.95 (g/cc) | 25°C |