Bostik H5077

Bostik H5077 Datasheet
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  • Description for Bostik H5077

    Peelable, resealable, pouch seal hot melt adhesive.

    *See Terms of Use Below

    Application Type Peelable Bond
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate Plastic: Polyethylene, Polypropylene
    Manufacturer Bostik
    Chemistry Hot melt
    Cure Method Pressure Sensitive, Hot melt
    Viscosity (cPs) 4,700, 1,100, 700, 500
    Peelable Peelable
    Density (g/cm³) 0.95 (g/cc)

  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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  • Comparable Materials

    *See Terms of Use Below

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