Bostik H5077

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Description for Bostik H5077

Peelable, resealable, pouch seal hot melt adhesive.

Application Type	Peelable Bond
1 Part or 2 Part	1 Part
Material Form	Liquid
Substrate	Plastic: Polyethylene, Polypropylene
Manufacturer	Bostik
Chemistry	Hot melt
Cure Method	Pressure Sensitive, Hot melt
Viscosity (cPs)	4,700, 1,100, 700, 500
Peelable	Peelable
Density (g/cm³)	0.95 (g/cc)

Best Practices for Bostik H5077

*See Terms of Use Below

Clean-Up

Clean-up Procedure: Mineral oil or paraffin wax, not to exceed flash point as stated on the MSDS, followed by a through purge with the adhesive itself.

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Technical Data

Overview

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Specifications

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Best Practices

*See Terms of Use Below
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Comparable Materials

*See Terms of Use Below
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Softening Point Test Methods

Softening Point	Unit Test Method
78°C	Ring and Ball (Herzog – ASTM E28)

Viscosity Test Methods

Viscosity	Test Method	Temperature
4,700 cPs	Brookfield -ASTM D3236	121°C
1,100 cPs	Brookfield -ASTM D3236	149°C
700 cPs	Brookfield -ASTM D3236	163°C
500 cPs	Brookfield - ASTM D3236	177°C

Density Test Methods

Density	Temperature
0.95 (g/cc)	25°C

Bostik H5077

Description for Bostik H5077

Best Practices for Bostik H5077