Bostik H5265

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Description for Bostik H5265

Peelable, resealable, pouch seal hot melt adhesive.

Application Type	Bond
1 Part or 2 Part	1 Part
Material Form	Pillows
Manufacturer	Bostik
Chemistry	Hot melt
Cure Method	Pressure Sensitive, Hot melt
Viscosity (cPs)	2,235, 1,330, 850
Peelable	Peelable
Density (g/cm³)	0.95 (g/cc)
Key Specifications	FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): FDA 21 CFR 175.105

Best Practices for Bostik H5265

*See Terms of Use Below

Clean-Up

Clean-up Procedure: Mineral oil or paraffin wax, not to exceed flash point as stated on the MSDS, followed by a through purge with the adhesive itself.

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Technical Data

Overview

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Specifications

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Best Practices

*See Terms of Use Below
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Comparable Materials

*See Terms of Use Below
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Softening Point Test Methods

Softening Point	Unit Test Method
78°C	Ring and Ball (Herzog – ASTM E28)

Viscosity Test Methods

Viscosity	Test Method	Temperature
2,235 cPs	Brookfield -ASTM D3236	149°C
1,330 cPs	Brookfield -ASTM D3236	163°C
850 cPs	Brookfield -ASTM D3236	177°C

Density Test Methods

Density	Temperature
0.95 (g/cc)	25°C

Bostik H5265

Description for Bostik H5265

Best Practices for Bostik H5265