• Description for Bostik L7132K

    A two-component adhesive system specifically designed for use in the vacuum form bonding of PVC films to wood, fiberboards, and most porous substrates.

    *See Terms of Use Below

    Chemical Resistance Good
    Application Type Bond, Gasket
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Sheet metal surfaces, Most plastic laminating films, Polyester films, PVC, Rubber, Wood, Most porous substrates, Polylolefin foams, Low surface energy substrates, Foils, Plastics
    Industry Automotive applications, Aerospace applications, Belt splicing, Flooring installation, Marine, Door panels, Aerospace Interior, Newsprint splicing, Hypalon rubber boat repair
    Manufacturer Bostik
    Chemistry MEK blend, Water borne
    Cure Method Solvent, 2 Parts
    Creep Resistance Creep resistant
    High Temperature Resistance (°C) Highly heat resistant
    Durability Tough
    Tape Backing/Carrier Vinyl

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