• Description for Bostik L7132K

    A two-component adhesive system specifically designed for use in the vacuum form bonding of PVC films to wood, fiberboards, and most porous substrates.

    *See Terms of Use Below

    Application Type Bond, Gasket
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Most porous substrates, Polyester films, PVC, Rubber, Wood, Most plastic laminating films, Sheet metal surfaces, Plastics, Foils
    Industry Transportation: Marine, Industrial: Belt splicing, Construction: Flooring installation, Transportation: Automotive applications, Industrial: Newsprint splicing
    Manufacturer Bostik
    Chemistry Water borne, MEK blend
    Cure Method 2 Parts, Solvent
    Creep Resistance Creep resistant
    Chemical Resistance Good
    High Temperature Resistance (°C) Highly heat resistant
    Tape Backing/Carrier Vinyl
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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    *See Terms of Use Below

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