Bostik L7132K

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Description for Bostik L7132K

A two-component adhesive system specifically designed for use in the vacuum form bonding of PVC films to wood, fiberboards, and most porous substrates.

*See Terms of Use Below

Application Type	Bond
1 Part or 2 Part	2 Part
Material Form	Liquid
Substrate	Most porous substrates, Polyester films, PVC, Rubber, Wood, Most plastic laminating films, Sheet metal surfaces, Plastics, Foils
Industry	Transportation: Marine, Industrial: Belt splicing, Construction: Flooring installation, Transportation: Automotive applications, Industrial: Newsprint splicing
Manufacturer	Bostik
Chemistry	Water borne, MEK blend
Cure Method	2 Parts, Solvent
Creep Resistance	Creep resistant
Chemical Resistance	Good
High Temperature Resistance (°C)	Highly heat resistant

Best Practices for Bostik L7132K

*See Terms of Use Below

Application

Adhesive can be applied via direct roll, reverse roll, gravure, or any coater common to the industry. This adhesive can also be sprayed.

Apply 100-150 g/m² (wet) adhesive to the least porous laminating surface and evaporate the solvent by standard drying techniques. Mate the secondary substrate under pressure at 110-212°F (41-100°C).
Mixing

Boscodur 24T should be added to L7132R in accordance with the mixing ratio (1:16) and blended to a homogenous solution (solvent dilutions, where applicable, should be made immediately after the Boscodur 24T addition).
Curing

To cure the part, the adhesive should be held at a minimum of 190°F (88°C) for at least 4 minutes. Vacuum pressure should be held at a minimum of 15 in Hg (51 kPa), 20 in HG (68 kPa) is preferred.
Clean-Up

Recommended clean up is with MEK/Toluene solution.

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Technical Data

Overview

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Specifications

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Best Practices

*See Terms of Use Below
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Comparable Materials

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Bostik L7132K

Description for Bostik L7132K

Best Practices for Bostik L7132K

Application

Mixing

Curing