Application Type Bond 1 Part or 2 Part 1 Part Material Form Stick Substrate Fabrics, Porous substrates, CardBoard, Paper Manufacturer Bostik Chemistry Hot melt Cure Method Hot melt Cure Time (min) 1,440 Viscosity (cPs) 11,000 Color Water Clear Chemical Resistance Acids & Alkalies, Water High Temperature Resistance (°C) 68 Low Temperature Resistance (°C) -28 Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): FDA 21 CFR 175.105
Technical Data for Bostik Thermogrip 0110 Clear Bond
- Adhesive - Bond
1 Part or 2 Part
- 1 Part or 2 Part - 1 Part
- Hotmelt - Hot melt
- Clear / Transparent - Water Clear
- FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): 175.105 - FDA 21 CFR 175.105
Cure Time (min) 1,440 Viscosity (cPs) 11,000 Test Method Fixture or Handling Strength Time (min) 60 Softening Point (°C) 85 Work / Pot Time (min) Medium, 10 to 30 (Seconds)
General Bond Strength (psi) Good Tensile Strength (psi) 350 Test Method
Chemical Resistance Acids & Alkalies, Water High Temperature Resistance (°C) 68 Low Temperature Resistance (°C) -28
Elongation (%) 550 Test Method
Specific Gravity 0.96 (gm/cc) Test Method
Shelf Life Details Shelf Life: 999 days @ 73.4°F (23°C);Shipping and storage: Between 40°F Shelf Life Temperature (°F) 73 Shelf Life (mon) 33
Best Practices for Bostik Thermogrip 0110 Clear Bond
All surfaces should be clean and free of contaminants. If necessary, clean surfaces with solvent.
Apply the adhesive to the more difficult-to-bond surface. In general, hard, smooth surfaces are more difficult to bond than rough, porous surfaces. “Open-time” varies depending on application temperature, amount of adhesive applied, type of substrate and ambient temperature conditions. Mate the surfaces to be bonded as quickly as possible after adhesive has been applied for optimum bond strength. Use firmest pressure practical for object being bonded. Do not move or adjust surfaces after contact has been made, as inferior bond strength will result. Typically, a properly formed hot melt adhesive bond will achieve 50% of its strength after 1 minute, 75% after 1 hour, and 100% after 1 day.
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