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Description for Bostik Thermogrip 0130 Best Bond
High performance, multi-purpose hot melt; good bonding characteristics to difficult to bond substrates.Chemical Resistance Alkalies, Chemical Resistance: Acids, Chemical Resistance: Fluid Resistance: Water Application Type Bond 1 Part or 2 Part 1-Part Material Form Stick Substrate ABS Industry Food Manufacturer Bostik Chemistry Hot melt Cure Method Hot melt Viscosity (cPs) 11,200 Color Colorless High Temperature Resistance (°C) 67 Low Temperature Resistance (°C) -18 Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): FDA 21 CFR 175.105 -
Technical Data for Bostik Thermogrip 0130 Best Bond
Overview
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Chemical Resistance
- Chemical Resistance : Fluid Resistance : Water Resistance - Water
- Chemical Resistance - Alkalies
- Chemical Resistance : Acid Resistance - Acids
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Application Type
- Adhesive - Bond
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1 Part or 2 Part
- 1-Part
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Material Form
- Stick
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Substrate
- ABS
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Industry
- Food & Beverage - Food
- Industrial - Beads
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Chemistry
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Cure Method
- Hotmelt - Hot melt
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Color
- Clear / Transparent - Colorless
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Key Specifications
- FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency) : 175.105 - FDA 21 CFR 175.105
Specifications
Cure Specs
Viscosity (cPs) 11,200 Test Method Softening Point (°C) 88 Open Time (min) Medium to Long, >0.50 Bond Strength
Tensile Strength (psi) 250 Test Method Material Resistance
High Temperature Resistance (°C) 67 Low Temperature Resistance (°C) -18 Hardness
Elongation (%) 750 Test Method Other Properties
Specific Gravity 0.96 (gm/cc) Test Method Business Information
Shelf Life Details Shelf life, °F (°C): 2 yrs. @ 73.4(23), Shipping and storage, °F(°C): Between 40-95 (4-35) Shelf Life Temperature (°F) 73 Shelf Life (mon) 24 -
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Best Practices for Bostik Thermogrip 0130 Best Bond
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Surface Preparation
All surfaces should be clean and free of loose elements. If necessary, wipe surfaces with solvent.
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Application
Apply the adhesive to the more difficult-to-bond surface. In general, hard, smooth surfaces are more difficult to bond than rough, porous surfaces. Mate the surfaces to be bonded as quickly as possible after adhesive has been applied for optimum bond strength. Use firmest pressure practical for object being bonded. Do not move or adjust surfaces after contact has been made, as inferior bond strength will result. As a rule of thumb, a property formed hot melt adhesive bond will achieve 50 % of its strength after 1 minute, 75% after 1 hour, and 100% after 1 day. Bonding is enhanced by pre-warming the surfaces. Metals should be pre-warmed to at least 200 F (95 C) for optimum effect.
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