Bostik Thermogrip 0130 Best Bond

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Description for Bostik Thermogrip 0130 Best Bond

High performance, multi-purpose hot melt; good bonding characteristics to difficult to bond substrates.

Application Type	Bond
1 Part or 2 Part	1 Part
Material Form	Stick
Substrate	ABS
Manufacturer	Bostik
Chemistry	Hot melt
Cure Method	Hot melt
Viscosity (cPs)	11,200
Color	Colorless
Chemical Resistance	Acids & Alkalies, Water
High Temperature Resistance (°C)	67
Low Temperature Resistance (°C)	-18
Key Specifications	FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): FDA 21 CFR 175.105

Best Practices for Bostik Thermogrip 0130 Best Bond

*See Terms of Use Below

Surface Preparation

All surfaces should be clean and free of loose elements. If necessary, wipe surfaces with solvent.
Application

Apply the adhesive to the more difficult-to-bond surface. In general, hard, smooth surfaces are more difficult to bond than rough, porous surfaces. Mate the surfaces to be bonded as quickly as possible after adhesive has been applied for optimum bond strength. Use firmest pressure practical for object being bonded. Do not move or adjust surfaces after contact has been made, as inferior bond strength will result. As a rule of thumb, a property formed hot melt adhesive bond will achieve 50 % of its strength after 1 minute, 75% after 1 hour, and 100% after 1 day. Bonding is enhanced by pre-warming the surfaces. Metals should be pre-warmed to at least 200 F (95 C) for optimum effect.

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Technical Data

Overview

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Specifications

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Best Practices

*See Terms of Use Below
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Comparable Materials

*See Terms of Use Below
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Bostik Thermogrip 0130 Best Bond

Description for Bostik Thermogrip 0130 Best Bond

Best Practices for Bostik Thermogrip 0130 Best Bond

Surface Preparation