Bostik Thermogrip 6305

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Description for Bostik Thermogrip 6305

Versatile, economical, fast setting hot melt; excellent bond characteristics for all temperature packaging applications.

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Application Type	Bond, Seal
1 Part or 2 Part	1 Part
Material Form	Bulk, Stick
Substrate	Porous, CardBoard, Wood
Manufacturer	Bostik
Chemistry	Hot melt
Cure Method	Hot melt
Cure Time (min)	1,440
Viscosity (cPs)	1,400
Color	Pale Straw
Chemical Resistance	Water, Weak acids
High Temperature Resistance (°C)	71, Good
Low Temperature Resistance (°C)	-18
Key Specifications	FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): FDA 21 CFR 175.105

Best Practices for Bostik Thermogrip 6305

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Surface Preparation

All surfaces should be clean and free of contaminants. If necessary, clean surfaces with solvent.
Application

Apply the adhesive to the more difficult-to-bond surface. In general, hard, smooth surfaces are more difficult to bond than rough, porous surfaces. “Open-time” varies depending on application temperature, amount of adhesive applied, type of substrate and ambient temperature conditions. Mate the surfaces to be bonded as quickly as possible after adhesive has been applied for optimum bond strength. Use firmest pressure practical for object being bonded. Do not move or adjust surfaces after contact has been made, as inferior bond strength will result. Typically, a properly formed hot melt adhesive bond will achieve 50% of its strength after 1 minute, 75% after 1 hour, and 100% after 1 day.

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Technical Data

Overview

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Specifications

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Best Practices

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Comparable Materials

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