Application Type Bond, Seal 1 Part or 2 Part 1 Part Material Form Bulk, Stick Substrate Porous, CardBoard, Wood Manufacturer Bostik Chemistry Hot melt Cure Method Hot melt Cure Time (min) 1,440 Viscosity (cPs) 1,400 Color Pale Straw Chemical Resistance Water, Weak acids High Temperature Resistance (°C) 71, Good Low Temperature Resistance (°C) -18 Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): FDA 21 CFR 175.105
Technical Data for Bostik Thermogrip 6305
1 Part or 2 Part
- 1 Part or 2 Part - 1 Part
- Porous Substrates - Porous
- Wood - CardBoard
- Other - Flexible foams, Rigid foams
- Industrial - Carton, Case
- Hotmelt - Hot melt
- Yellow - Pale Straw
- FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): 175.105 - FDA 21 CFR 175.105
Application Temperature (°F) 335 to 360 Cure Time (min) 1,440 Viscosity (cPs) 1,400 Test Method Fixture or Handling Strength Time (min) 1,440 Set Time (min) Fast Softening Point (°C) 110 to 114 Test Method Open Time (min) Short, 0.05 to 0.13
Chemical Resistance Water, Weak acids High Temperature Resistance (°C) 71, Good Low Temperature Resistance (°C) -18
Flexibility Rigid, Flexible
Specific Gravity 0.9 (gm/cc) Test Method
Shelf Life Details 999 days @ 73.4°F (23°C). Shipping and storage: Between 40°F to 95°F (4°C to 35°C) Shelf Life Temperature (°F) 73 Shelf Life (mon) 33
Best Practices for Bostik Thermogrip 6305
All surfaces should be clean and free of contaminants. If necessary, clean surfaces with solvent.
Apply the adhesive to the more difficult-to-bond surface. In general, hard, smooth surfaces are more difficult to bond than rough, porous surfaces. “Open-time” varies depending on application temperature, amount of adhesive applied, type of substrate and ambient temperature conditions. Mate the surfaces to be bonded as quickly as possible after adhesive has been applied for optimum bond strength. Use firmest pressure practical for object being bonded. Do not move or adjust surfaces after contact has been made, as inferior bond strength will result. Typically, a properly formed hot melt adhesive bond will achieve 50% of its strength after 1 minute, 75% after 1 hour, and 100% after 1 day.
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