Bostik Thermogrip 6368

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Description for Bostik Thermogrip 6368

Short open time hot melt; good shear strength and good adhesion to porous materials; wide temperature range.

Chemical Resistance	Alkalies, Chemical Resistance: Acids, Chemical Resistance: Fluid Resistance: Water, Fats & oils
Application Type	Bond, Seal
1 Part or 2 Part	1-Part
Material Form	Stick
Substrate	Fabric, CardBoard, Porous, Polyethylene, Foam, Paper, Filter Paper
Industry	Filter, Food
Manufacturer	Bostik
Chemistry	Hot melt
Cure Method	Hot melt
Cure Time (min)	1,440
Viscosity (cPs)	42,500
Color	Light Amber
High Temperature Resistance (°C)	76
Low Temperature Resistance (°C)	-46, Good cold resistance
Key Specifications	FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): FDA 21 CFR 175.105

Best Practices for Bostik Thermogrip 6368

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Technical Data for Bostik Thermogrip 6368

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Overview

Chemical Resistance
- Chemical Resistance : Fluid Resistance : Water Resistance - Water
- Chemical Resistance - Alkalies, Fats & oils
- Chemical Resistance : Acid Resistance - Acids
Application Type
- Adhesive - Bond
- Sealant - Seal
1 Part or 2 Part
- 1-Part
Material Form
- Stick
Substrate
- Porous Substrates - Porous
- Foam
- Polyethylene (LDPE, HDPE) - Polyethylene
- Fabric
- Paper - CardBoard, Filter Paper
- Other - Kraft
Industry
- Food & Beverage - Food
- Industrial - Boards, Carton, Case
- Filters - Filter
Chemistry
- Hot melt
Cure Method
- Hotmelt - Hot melt
Color
- Red - Light Amber
Key Specifications
- FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency) : 175.105 - FDA 21 CFR 175.105

Specifications

Cure Specs

Cure Time (min)	1,440
Viscosity (cPs)	42,500	Test Method
Fixture or Handling Strength Time (min)	1,440
Set Time (min)	Quick
Softening Point (°C)	99 to 107
Open Time (min)	Short, 0.08 to 0.17

Bond Strength

General Bond Strength (psi)	Good
Shear Strength (psi)	Good

Material Resistance

High Temperature Resistance (°C)	76
Low Temperature Resistance (°C)	-46, Good cold resistance

Conductivity

Dissipation Factor	0.07000
Dielectric Strength (V/mil)	180
Dielectric Constant	3.50

Other Properties

Specific Gravity	0.95 (gm/cc)	Test Method

Business Information

Shelf Life Details	Shelf Life: 730 days @ 73.4°F (23°C). Shipping and storage: Between 40°F to 95°F (4°C to 35°C)
Shelf Life Temperature (°F)	73
Shelf Life (mon)	24

Best Practices for Bostik Thermogrip 6368

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1. Surface Preparation
  
  All surfaces should be clean and free of contaminants. If necessary, clean surfaces with solvent.
2. Application
  
  Apply the adhesive to the more difficult-to-bond surface. In general, hard, smooth surfaces are more difficult to bond than rough, porous surfaces. Metals should be pre-warmed up to 200°F (95°C) for optimum results. Open-time varies depending on application temperature, amount of adhesive applied, type of substrate and ambient temperature conditions. Mate the surfaces to be bonded as quickly as possible after adhesive has been applied for optimum bond strength. Use firmest pressure practical for object being bonded. Do not move or adjust surfaces after contact has been made, as inferior bond strength will result. Typically, a properly formed hot melt adhesive bond will achieve 50% of its strength after 1 minute, 75% after 1 hour, and 100% after 1 day.
Comparable Materials for Bostik Thermogrip 6368

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Spec Engine^® Results
- 3762(3M)
  Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood
- Thermogrip 6305(Bostik)
  Versatile, economical, fast setting hot melt; excellent bond characteristics for all temperature packaging applications.
- 3762LM(3M)
  Excellent “hot tack”, fast setting • Bonds variety of corrugated packaging, beadboard, recouperage, repacking area • Economical, general purpose • Can bond chipboard and wood
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