Application Type Bond, Seal 1 Part or 2 Part 1 Part Material Form Stick Substrate Fabric, Foam, Porous, Polyethylene, CardBoard, Paper, Filter Paper Industry Food, Filter Manufacturer Bostik Chemistry Hot melt Cure Method Hot melt Cure Time (min) 1,440 Viscosity (cPs) 42,500 Color Light Amber Chemical Resistance Acids & Alkalies, Fats & oils, Water High Temperature Resistance (°C) 76 Low Temperature Resistance (°C) -46, Good cold resistance Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): FDA 21 CFR 175.105
Technical Data for Bostik Thermogrip 6368
1 Part or 2 Part
- 1 Part or 2 Part - 1 Part
- Food & Beverage - Food
- Industrial - Boards, Carton, Case
- Filters - Filter
- Hotmelt - Hot melt
- Red - Light Amber
- FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): 175.105 - FDA 21 CFR 175.105
Cure Time (min) 1,440 Viscosity (cPs) 42,500 Test Method Fixture or Handling Strength Time (min) 1,440 Set Time (min) Quick Softening Point (°C) 99 to 107 Open Time (min) Short, 0.08 to 0.17
General Bond Strength (psi) Good Shear Strength (psi) Good
Chemical Resistance Acids & Alkalies, Fats & oils, Water High Temperature Resistance (°C) 76 Low Temperature Resistance (°C) -46, Good cold resistance
Dissipation Factor 0.07000 Dielectric Strength (V/mil) 180 Dielectric Constant 3.50
Specific Gravity 0.95 (gm/cc) Test Method
Shelf Life Details Shelf Life: 730 days @ 73.4°F (23°C). Shipping and storage: Between 40°F to 95°F (4°C to 35°C) Shelf Life Temperature (°F) 73 Shelf Life (mon) 24
Best Practices for Bostik Thermogrip 6368
All surfaces should be clean and free of contaminants. If necessary, clean surfaces with solvent.
Apply the adhesive to the more difficult-to-bond surface. In general, hard, smooth surfaces are more difficult to bond than rough, porous surfaces. Metals should be pre-warmed up to 200°F (95°C) for optimum results. Open-time varies depending on application temperature, amount of adhesive applied, type of substrate and ambient temperature conditions. Mate the surfaces to be bonded as quickly as possible after adhesive has been applied for optimum bond strength. Use firmest pressure practical for object being bonded. Do not move or adjust surfaces after contact has been made, as inferior bond strength will result. Typically, a properly formed hot melt adhesive bond will achieve 50% of its strength after 1 minute, 75% after 1 hour, and 100% after 1 day.
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