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| Application Type | Bond |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Stick |
| Substrate | Porous substrates, ABS, Plastic: PolyEthylene, Lexan, CardBoard, Plastic: Phenolic Board, Lexan, Polycarbonate, Particle Board, Plastics, Phenolic Board, PlyWood, Wood |
| Manufacturer | Bostik |
| Chemistry | Hot melt |
| Cure Method | Hot melt |
| Cure Time (min) | 1,440 |
| Viscosity (cPs) | 12,500 |
| Color | Light straw |
| High Temperature Resistance (°C) | 76 |
| Low Temperature Resistance (°C) | -40 |
| Key Specifications | FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): FDA 21 CFR 175.105 |
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