Bostik Thermogrip H1714 Datasheet Bostik Thermogrip H1714

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  • Description for Bostik Thermogrip H1714

    Hot Melt Adhesive

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1-Part
    Material Form Pellets
    Manufacturer Bostik
    Chemistry Hot melt
    Cure Method Hot melt
    Application Temperature (°F) 250 to 300, Low
    Viscosity (cPs) 1,375, 850, 550
    Density (g/cm³) 0.98 g/cc
  • Technical Data for Bostik Thermogrip H1714

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Pellets
    • Substrate
      • Other - Coated, Recycled
    • Chemistry
    • Cure Method
      • Hotmelt - Hot melt
    Specifications
    Cure Specs
    Application Temperature (°F) 250 to 300, Low
    Viscosity (cPs) 1,375, 850, 550 Test Method
    Softening Point (°C) 73 Test Method
    Other Properties
    Density (g/cm³) 0.98 g/cc Test Method
    Business Information
    Shelf Life Details Can be stored 730 days in a clean dry, place, in its original package at an average temperature of 25°C or below. Storage temperature should not exceed 40°C.
    Shelf Life Temperature (°F) 77
  • Best Practices for Bostik Thermogrip H1714

    *See Terms of Use Below

    1. Clean-Up

      Mineral oil or parafilm wax, not to exceed flash point as stated on the MSDS, followed by a thorough purge with the adhesive itself.

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Softening Point Test Methods
Softening Point Unit Test Method
73°C Ring and Ball (Herzog – ASTM E28)
Viscosity Test Methods
Viscosity Test Method Temperature
1,375 cPs Brookfield-ASTM D3236 121°C
850 cPs Brookfield-ASTM D3236 135°C
550 cPs Brookfield-ASTM D3236 149°C
Density Test Methods
Density Temperature
0.98 g/cc 25°C