Dow 3-1818 Thermally Conductive Adhesive
Chemical Resistance Good Application Type Bond 1 Part or 2 Part 1-Part Material Form Liquid, Silicone elastomer Substrate Al, Ceramic, Metal , Filled plastic, Epoxy laminate boards Industry Sinks to electronics devices, Printed circuit boards, Smart Meters, E-Mobility Solutions, Smart Home Devices Manufacturer Dow Chemistry Aluminum Oxide, Silicone elastomer Cure Method Heat Cure Temperature (°C) 20 to 25, 100, 125, 150 Cure Time (min) Fast, 60, 45, 10 Viscosity (cPs) 76,000 Color Gray Ozone Resistance Ozone resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Volume Resistivity (O) 6.85e13 (ohms/cm) Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: 94 V-0
Technical Data for Dow 3-1818 Thermally Conductive Adhesive
- Chemical Resistance - Good
- Adhesive - Bond
1 Part or 2 Part
- Elastomer - Silicone elastomer
- Smart Meters
- Smart Home Devices
- E-Mobility Solutions
- Electronics - Sinks to electronics devices
- Printed Circuit Board (PCB) - Printed circuit boards
- Other - Aluminum Oxide
- Silicone - Silicone elastomer
- Dispenser - Automated dispensing
- Brush - Manual
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - 94 V-0
Cure Temperature (°C) 20 to 25, 100, 125, 150 Test Method Cure Time (min) Fast, 60, 45, 10 Test Method Viscosity (cPs) 76,000
Shear Strength (psi) 560 Test Method Tensile Strength (psi) 625
Flame Resistance Good Flame Resistance Ozone Resistance Ozone resistance UV Resistance UV resistance Environmental Resistance Environmental resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture/humidity resistance
Dissipation Factor 0.00590, <0.00022 Test Method Dielectric Strength (V/mil) Good, Durable Dielectric Constant 5.60, 5.50 Test Method Thermal Conductivity (W/m°K) 1.70 Test Method Volume Resistivity (O) 6.85e13 (ohms/cm)
Shore A Hardness 88 Elongation (%) 20 Flexibility Flexible
Specific Gravity 2.630 Coefficient of Thermal Expansion (CTE) 125 (Linear, ppm/ºC Flash Point (°F) 212.0
Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers. Shelf Life Type From date of manufacture Shelf Life (mon) 6
Not Good For
Don't Use With non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene.
Best Practices for Dow 3-1818 Thermally Conductive Adhesive
All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.
Upon standing, some filler may settle to the bottom of the liquid after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use.
Two-part materials should be mixed in the proper ratio either by weight or volume. The presence of light-colored streaks or marbling indicates inadequate mixing.
Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of >28 inches Hg (or a residual pressure of 10-20 mm of Hg) for 10 minutes or until bubbling subsides.
Addition-cure silicones should be cured at 100 ºC (212 ºF) or aboveThe cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). For thicker sections, a pre-cure at 70 ºC (158 ºF) may be necessary to reduce voids in the elastomer Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70 ºC (158 ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These products generally have long working times.
To ensure maximum bond strength for adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.
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Cure Temperature Test Methods
|Cure Temperature||Cure Time Test Method|
|20 to 25°C|
|100°C||Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.|
|125°C||Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.|
|150°C||Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.|
Cure Time Test Methods
|Cure Time||Test Method|
Shear Strength Test Methods
|560 psi||Lap shear strength||Al|
Dielectric Constant Test Methods
|Dielectric Constant||Test Method|
Dissipation Factor Test Methods
|Dissipation Factor||Test Method|
Thermal Conductivity Test Methods