Dow 3-6752 Thermally ConDuctive Adhesive

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Description for Dow 3-6752 Thermally ConDuctive Adhesive

One-part; rapid heat cure and primerless adhesion to common substrates used in the electronics industry

Chemical Resistance	Good
Application Type	Bond
1 Part or 2 Part	1-Part
Material Form	Liquid, Silicone elastomer
Substrate	Al, Primerless adhesion to common substrates
Industry	Electronics, Power semiconductor components, Smart Meters, E-Mobility Solutions, Smart Home Devices, Headlamp assemblies, Heat sinks, Power semiconductor components, Hybrid circuit
Manufacturer	Dow
Chemistry	Polydimethylsiloxane, Silicone elastomer
Cure Method	Heat
Cure Temperature (°C)	100, 125, 150
Cure Time (min)	40, 10, 3.00
Viscosity (cPs)	83,300
Color	Gray
Ozone Resistance	Ozone resistance
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Volume Resistivity (O)	7.1E+13 (ohms/cm)
Key Specifications	UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL V-0 recognized

Best Practices for Dow 3-6752 Thermally ConDuctive Adhesive

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Technical Data for Dow 3-6752 Thermally ConDuctive Adhesive

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Overview

Chemical Resistance
- Chemical Resistance - Good
Application Type
- Adhesive - Bond
1 Part or 2 Part
- 1-Part
Material Form
- Elastomer - Silicone elastomer
- Liquid
Substrate
- Primerless - Primerless adhesion to common substrates
- Aluminum - Al
Industry
- Semiconductor - Power semiconductor components, Power semiconductor components
- Smart Meters
- Smart Home Devices
- E-Mobility Solutions
- Headlamp - Headlamp assemblies
- Electronics - Heat sinks, Hybrid circuit
Chemistry
- Other - Polydimethylsiloxane
- Silicone - Silicone elastomer
Application Method
- Dispenser - Automated dispensing
- Brush - Manual
Cure Method
- Heat
Color
- Gray
Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - UL V-0 recognized

Specifications

Cure Specs

Cure Temperature (°C)	100, 125, 150
Cure Time (min)	40, 10, 3.00
Viscosity (cPs)	83,300

Bond Strength

Shear Strength (psi)	518	Test Method
Tensile Strength (psi)	545

Material Resistance

Flame Resistance	Good flame resistance
Ozone Resistance	Ozone resistance
UV Resistance	UV resistance
Environmental Resistance	Environmental resistance
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Moisture/Humidity Resistance	Moisture/humidity resistance

Conductivity

Dissipation Factor	0.00700, <0.00010	Test Method
Dielectric Strength (V/mil)	Good, Durable
Dielectric Constant	5.64, 5.51	Test Method
Thermal Conductivity (W/m°K)	1.70
Volume Resistivity (O)	7.1E+13 (ohms/cm)

Hardness

Shore A Hardness	87
Elongation (%)	15
Flexibility	Flexible

Other Properties

Specific Gravity	2.610	Test Method
Coefficient of Thermal Expansion (CTE)	138 (Linear (ppm/ºC ))	Test Method

Business Information

Shelf Life Details	Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers.
Shelf Life Type	From date of manufacture
Shelf Life (mon)	6

Not Good For

Don't Use With	non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene.

Best Practices for Dow 3-6752 Thermally ConDuctive Adhesive

*See Terms of Use Below
1. Surface Preparation
  
  All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.
2. Curing
  
  Addition-cure adhesives should be cured at 100ºC (212 ºF) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). Thin sections of less than 20 mils may be cured in 15 minutes at 150ºC (30 ºF). For thicker sections, a pre-cure at 70ºC (158ºF) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70ºC (158ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These adhesives generally have long working times.
3. Testing
  
  To ensure maximum bond strength for adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.
Comparable Materials for Dow 3-6752 Thermally ConDuctive Adhesive

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