Dow 3-6752 Thermally ConDuctive Adhesive

Dow 3-6752 Thermally ConDuctive Adhesive Datasheet
  • Description for Dow 3-6752 Thermally ConDuctive Adhesive

    One-part; rapid heat cure and primerless adhesion to common substrates used in the electronics industry

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Liquid, Silicone elastomer
    Substrate Al, Primerless adhesion to common substrates
    Industry Electronics, Power semiconductor components, E-Mobility Solutions, Smart Meters, Smart Home Devices, Headlamp assemblies, Heat sinks, Power semiconductor components, Hybrid circuit
    Manufacturer Dow
    Chemistry Silicone elastomer, Polydimethylsiloxane
    Cure Method Heat
    Cure Temperature (°C) 100, 125, 150
    Cure Time (min) 40, 10, 3.00
    Viscosity (cPs) 83,300
    Color Gray
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL V-0 recognized
  • Technical Data for Dow 3-6752 Thermally ConDuctive Adhesive

    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Elastomer - Silicone elastomer
      • Liquid
    • Substrate
      • Primerless - Primerless adhesion to common substrates
      • Aluminum - Al
    • Industry
      • Semiconductor - Power semiconductor components, Power semiconductor components
      • E-Mobility Solutions
      • Headlamp - Headlamp assemblies
      • Electronics - Heat sinks, Hybrid circuit
      • Smart Meters
      • Smart Home Devices
    • Chemistry
      • Other - Polydimethylsiloxane
      • Silicone - Silicone elastomer
    • Application Method
      • Dispenser - Automated dispensing
      • Brush - Manual
    • Cure Method
      • Heat
    • Color
      • Gray
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: V0 - UL V-0 recognized
    Cure Specs
    Cure Temperature (°C) 100, 125, 150
    Cure Time (min) 40, 10, 3.00
    Viscosity (cPs) 83,300
    Bond Strength
    Shear Strength (psi) 518 Test Method
    Tensile Strength (psi) 545
    Material Resistance
    Ozone Resistance Ozone resistance
    Flame Resistance Good flame resistance
    Chemical Resistance Good
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Dissipation Factor 0.00700, <0.00010 Test Method
    Dielectric Strength (V/mil) Good, Durable
    Dielectric Constant 5.64, 5.51 Test Method
    Thermal Conductivity (W/m°K) 1.70
    Volume Resistivity (O) 7.1E+13 (ohms/cm)
    Shore A Hardness 87
    Elongation (%) 15
    Flexibility Flexible
    Other Properties
    Specific Gravity 2.610 Test Method
    Coefficient of Thermal Expansion (CTE) 138 (Linear (ppm/ºC )) Test Method
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 6
    Not Good For
    Don't Use With non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene.
  • Best Practices for Dow 3-6752 Thermally ConDuctive Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.

    2. Curing

      Addition-cure adhesives should be cured at 100ºC (212 ºF) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). Thin sections of less than 20 mils may be cured in 15 minutes at 150ºC (30 ºF). For thicker sections, a pre-cure at 70ºC (158ºF) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70ºC (158ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These adhesives generally have long working times.

    3. Testing

      To ensure maximum bond strength for adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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Shear Strength Test Methods
Shear Strength Type Substrate
518 psi Lap shear strength AL
Dielectric Constant Test Methods
Dielectric Constant Test Method
5.64 Dielectric Constant at 100 Hz
5.51 Dielectric Constant at 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00700 Dissipation Factor at 100 Hz
<0.00010 Dissipation Factor at 100 kHz
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
138 (Linear (ppm/ºC )) By TMA
Specific Gravity Test Methods
Specific Gravity Test Method
2.610 Cured