

-
Description for Dow 3-6753 Thermally ConDuctive Adhesive
Two-part; heat cure; low modulus; low viscosity; contains 7-mil (178 micron) glass beads for bond line controlChemical Resistance Good Application Type Bond 1 Part or 2 Part 2-Part Material Form Liquid, Silicone elastomer Substrate Al Industry Electronic devices, Printed circuit boards, Smart Meters, Smart Home Devices, Heat sinks Manufacturer Dow Chemistry Silicone elastomer Cure Method Heat, 2 Parts Cure Temperature (°C) 100, 125, 150 Cure Time (min) 50, 40, 10 Viscosity (cPs) Low, 10,120 Color Gray Ozone Resistance Ozone resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Volume Resistivity (O) 7.2E+13 (ohms/cm) -
Technical Data for Dow 3-6753 Thermally ConDuctive Adhesive
Overview
-
Chemical Resistance
- Chemical Resistance - Good
-
Application Type
- Adhesive - Bond
-
1 Part or 2 Part
- 2-Part
-
Material Form
- Elastomer - Silicone elastomer
- Liquid
-
Substrate
- Aluminum - Al
-
Industry
- Smart Meters
- Smart Home Devices
- Electronics - Electronic devices, Heat sinks
- Printed Circuit Board (PCB) - Printed circuit boards
-
Chemistry
- Silicone - Silicone elastomer
-
Application Method
- Dispenser - Automated meter-mix
- Brush - Manual
-
Cure Method
- Heat
- 2-Part Cure - 2 Parts
-
Color
- Gray
Specifications
Cure Specs
Cure Temperature (°C) 100, 125, 150 Cure Time (min) 50, 40, 10 Viscosity (cPs) Low, 10,120 Work / Pot Time (min) 120 Test Method Bond Strength
Shear Strength (psi) 560 Test Method Tensile Strength (psi) 400 Material Resistance
Ozone Resistance Ozone resistance UV Resistance UV resistance Environmental Resistance Environmental resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture/humidity resistance Conductivity
Dissipation Factor 0.00450, 0.00013 Test Method Dielectric Constant 4.71, 4.65 Test Method Thermal Conductivity (W/m°K) 1.00 Volume Resistivity (O) 7.2E+13 (ohms/cm) Hardness
Shore A Hardness 69 Elongation (%) 36 Flexibility Flexible Modulus (psi) Low, 125 Test Method Other Properties
Specific Gravity 2.320 Test Method Coefficient of Thermal Expansion (CTE) 179 (Linear ppm/ºC)) Test Method Business Information
Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers. Shelf Life Type From date of manufacture Shelf Life (mon) 12 Not Good For
Don't Use With non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene. -
-
Best Practices for Dow 3-6753 Thermally ConDuctive Adhesive
-
Surface Preparation
All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.
-
Mixing
Upon standing, some filler may settle to the bottom of the liquid after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use. Two-part materials should be mixed in the proper ratio either by weight or volume. The presence of light-colored streaks or marbling indicates inadequate mixing.
-
Deairing/Degassing
Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of > 8 inches Hg (or a residual pressure of 10- 0 mm of Hg) for 10 minutes or until bubbling subsides.
-
Curing
Addition-cure adhesives should be cured at 100ºC (212ºF) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). Thin sections of less than mils may be cured in 15 minutes at 150ºC (30ºF). For thicker sections, a pre-cure at 70ºC (158ºF) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70ºC (158ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These adhesives generally have long working times.
-
Testing
To ensure maximum bond strength for adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.
-
-
Comparable Materials for Dow 3-6753 Thermally ConDuctive Adhesive
Spec Engine® Results
Popular Articles
Testing the effectiveness of surface treatments
Read ArticleInfographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation
Read ArticleElectrically Conductive Adhesives
Read Article6 objects held together by adhesives you probably can't live without
Read ArticleSponsored Articles
Unique Advantages of Contact Adhesives
Read ArticleUsing LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials
Read ArticleSylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:
Read ArticleCase Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive
Read ArticleFeatured Ads

Work / Pot Time Test Methods
Work / Pot Time | Test Method | Temperature |
---|---|---|
120 min | Time to double initial mixed viscosity. | 25°C |
Shear Strength Test Methods
Shear Strength | Type | Substrate | Test Method |
---|---|---|---|
560 psi | Lap shear strength | AL | Unprimed Adhesion |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
---|---|
4.71 | Dielectric Constant at 100 Hz |
4.65 | Dielectric Constant at 100 kHz |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
---|---|
0.00450 | Dissipation Factor at 100 Hz |
0.00013 | Dissipation Factor at 100 kHz |
Modulus Test Methods
Modulus | Test Method |
---|---|
Low | |
125 psi | Compression at 10% |
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) | CTE Test Method |
---|---|
179 (Linear ppm/ºC)) | By TMA |
Specific Gravity Test Methods
Specific Gravity | Test Method |
---|---|
2.320 | Cured |

1 VIEW FREE
Don't Leave!
View Dow - 3-6753 Thermally ConDuctive Adhesive now.