Dow 3-6753 Thermally ConDuctive Adhesive Datasheet Dow 3-6753 Thermally ConDuctive Adhesive

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  • Description for Dow 3-6753 Thermally ConDuctive Adhesive

    Two-part; heat cure; low modulus; low viscosity; contains 7-mil (178 micron) glass beads for bond line control

    *See Terms of Use Below

    Chemical Resistance Good
    Application Type Bond
    1 Part or 2 Part 2-Part
    Material Form Liquid, Silicone elastomer
    Substrate Al
    Industry Electronic devices, Printed circuit boards, Smart Meters, Smart Home Devices, Heat sinks
    Manufacturer Dow
    Chemistry Silicone elastomer
    Cure Method Heat, 2 Parts
    Cure Temperature (°C) 100, 125, 150
    Cure Time (min) 50, 40, 10
    Viscosity (cPs) Low, 10,120
    Color Gray
    Ozone Resistance Ozone resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Volume Resistivity (O) 7.2E+13 (ohms/cm)
  • Technical Data for Dow 3-6753 Thermally ConDuctive Adhesive

    • Chemical Resistance
      • Chemical Resistance - Good
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Elastomer - Silicone elastomer
      • Liquid
    • Substrate
    • Industry
      • Smart Meters
      • Smart Home Devices
      • Electronics - Electronic devices, Heat sinks
      • Printed Circuit Board (PCB) - Printed circuit boards
    • Chemistry
    • Application Method
      • Dispenser - Automated meter-mix
      • Brush - Manual
    • Cure Method
      • Heat
      • 2-Part Cure - 2 Parts
    • Color
      • Gray
    Cure Specs
    Cure Temperature (°C) 100, 125, 150
    Cure Time (min) 50, 40, 10
    Viscosity (cPs) Low, 10,120
    Work / Pot Time (min) 120 Test Method
    Bond Strength
    Shear Strength (psi) 560 Test Method
    Tensile Strength (psi) 400
    Material Resistance
    Ozone Resistance Ozone resistance
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Dissipation Factor 0.00450, 0.00013 Test Method
    Dielectric Constant 4.71, 4.65 Test Method
    Thermal Conductivity (W/m°K) 1.00
    Volume Resistivity (O) 7.2E+13 (ohms/cm)
    Shore A Hardness 69
    Elongation (%) 36
    Flexibility Flexible
    Modulus (psi) Low, 125 Test Method
    Other Properties
    Specific Gravity 2.320 Test Method
    Coefficient of Thermal Expansion (CTE) 179 (Linear ppm/ºC)) Test Method
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 12
    Not Good For
    Don't Use With non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene.
  • Best Practices for Dow 3-6753 Thermally ConDuctive Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.

    2. Mixing

      Upon standing, some filler may settle to the bottom of the liquid after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use. Two-part materials should be mixed in the proper ratio either by weight or volume. The presence of light-colored streaks or marbling indicates inadequate mixing.

    3. Deairing/Degassing

      Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of > 8 inches Hg (or a residual pressure of 10- 0 mm of Hg) for 10 minutes or until bubbling subsides.

    4. Curing

      Addition-cure adhesives should be cured at 100ºC (212ºF) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). Thin sections of less than mils may be cured in 15 minutes at 150ºC (30ºF). For thicker sections, a pre-cure at 70ºC (158ºF) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70ºC (158ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These adhesives generally have long working times.

    5. Testing

      To ensure maximum bond strength for adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
120 min Time to double initial mixed viscosity. 25°C
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
560 psi Lap shear strength AL Unprimed Adhesion
Dielectric Constant Test Methods
Dielectric Constant Test Method
4.71 Dielectric Constant at 100 Hz
4.65 Dielectric Constant at 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00450 Dissipation Factor at 100 Hz
0.00013 Dissipation Factor at 100 kHz
Modulus Test Methods
Modulus Test Method
125 psi Compression at 10%
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
179 (Linear ppm/ºC)) By TMA
Specific Gravity Test Methods
Specific Gravity Test Method
2.320 Cured