Dow 732 Multi-Purpose Sealant

Dow 732 Multi-Purpose Sealant Datasheet
  • Description for Dow 732 Multi-Purpose Sealant

    One-part; non-slumping RTV paste, good resistance to weathering, moisture and temperature extremes; cures to a tough rubbery solid.

    *See Terms of Use Below

    Application Type Bond, Seal
    1 Part or 2 Part 1 Part
    Material Form Paste
    Substrate Glass, Metals, Engineering Plastics
    Industry Power Tools, Smart Home Devices
    Manufacturer Dow
    Chemistry Acetoxy, Silicone
    Application Method Spatula
    Cure Method Moisture
    Cure Temperature (°C) 20 to 25, 25, 20 to 25
    Cure Time (min) 10,080, 1,440
    Viscosity (cPs) Non-sag, Non-slump, NonFlow
    Color Black, Clear, White, Gray: Aluminum
    High Temperature Resistance (°C) 180, 205, 230
    Low Temperature Resistance (°C) -60
    Durability Tough
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): FDA 21 CFR177.2600; FDA 177.2600, Mil-Spec (United States Military Standard): MIL-A-46106
  • Technical Data for Dow 732 Multi-Purpose Sealant

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Paste
    • Substrate
    • Industry
      • Smart Home Devices
      • Power Tools
    • Chemistry
    • Application Method
      • Spatula/Trowel - Spatula
    • Cure Method
      • Moisture / Condensation Cure - Moisture
    • Color
      • Black
      • Clear / Transparent - Clear
      • Gray: Aluminum
      • White
    • Key Specifications
      • FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): 177.2600 - FDA 21 CFR177.2600; FDA 177.2600
      • Mil-Spec (United States Military Standard): A-46106 - MIL-A-46106
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25, 25, 20 to 25 Test Method
    Cure Time (min) 10,080, 1,440 Test Method
    Viscosity (cPs) Non-sag, Non-slump, NonFlow
    Tack Free Time (min) 20, <45 Test Method
    Work / Pot Time (min) 7 Test Method
    Bond Strength
    Tensile Strength (psi) 2.3 (Mpa) Test Method
    Material Resistance
    Environmental Resistance Good
    High Temperature Resistance (°C) 180, 205, 230
    Low Temperature Resistance (°C) -60
    Conductivity
    Dissipation Factor 0.00150, 0.00150 Test Method
    Dielectric Strength (V/mil) 21.6 (KV/mm), Good Test Method
    Dielectric Constant 2.80, 2.80 Test Method
    Volume Resistivity (O) 1.5e15 (ohms/cm) Test Method
    Hardness
    Durability Tough
    Shore A Hardness 25 Test Method
    Elongation (%) 540 Test Method
    Flexibility Flexible
    Other Properties
    Specific Gravity 1.040 Test Method
    Coefficient of Thermal Expansion (CTE) 1.12e-3 (Volume (1/K)) Test Method
    Business Information
    Shelf Life Details When stored at or below 32°C (90°F) in the original unopened containers, this product has a usable life of 27 months from the date of production.;As DOW CORNING 732 Multi-Purpose Sealant cures by reaction with moisture in air, keep the container tightly sealed when not in use. A plug of used material may form in the tip of a tube or cartridge during storage. This is easily removed and does not affect the remaining contents.
    Shelf Life Temperature (°F) <90
    Shelf Life Type from the date of production
    Shelf Life (mon) 27
  • Best Practices for Dow 732 Multi-Purpose Sealant

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces must be clean and dry. Degrease and wash off any contaminants that could impair adhesion. Suitable solvent include isopropyl alcohol, acetone or methylethyl ketone. Unprimed adhesion may be obtained on many substrates such as glass, metals and most common engineering plastics. Substrates to which good adhesion is normally not obtained include PTFE, polyethylene, polypropylene and related materials.

      After solvent cleaning, a thin coat of DOW CORNING 1200 OS Primer is applied by dipping, brushing or spraying. Allow primer to dry for 15 to 90 minutes at room temperature and a relative humidity of 50% or higher.

    2. Application

      Apply DOW CORNING 732 Multi-Purpose Sealant to one of the prepared surfaces, then quickly cover with the other substrate to be bonded. On exposure to moisture, the freshly applied material will "skin-over". Any tooling should be completed before this skin forms. The surface is easily tooled with a spatula. The Adhesive/Sealant will be tack-free in less than 45 minutes.

    3. Curing

      After skin formation, cure continues inward from the surface. In 24 hours (at room temperature and 50% relative humidity) DOW CORNING 732 Multi-Purpose Sealant will cure to a depth of about 3mm. Very deep sections, especially when access to atmospheric moisture is restricted will take longer to cure completely. Cure time is extended at lower humidity levels.

      Before handling and packaging bonded components, users are advised to wait a sufficiently long time to ensure that the integrity of the adhesive seal is not affected. This will depend on many factors and should be determined by the user for each specific application.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C When exposed to moisture in the air
25°C Cured 7 days in air at 25°C (77°F) and 50% relative humidity.
20 to 25°C 50% relative humidity
Cure Time Test Methods
Cure Time Test Method
10,080 min Cured 7 days in air at 25°C (77°F) and 50% relative humidity.
1,440 min 50% relative humidity
Tack Free Time Test Methods
Tack Free Time Test Method
20 min CTM 0095
<45 min
Work / Pot Time Test Methods
Work / Pot Time Test Method
7 min CTM 0098
Tensile Strength Test Methods
Tensile Strength Cure Time Cure Temperature Cure Humidity Test Method
2.3 (Mpa) 10,080 min 25°C 50 % CTM 0137A, ASTM D 412, Mechanical properties, cured 7 days in air at 25°C (77°F) and 50% relative humidity
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
2.80 25°C CTM 0112, ASTM D150, cured 7 days in air at 25°C (77°F) and 50% relative humidity, 100 Hz
2.80 25°C CTM 0112, ASTM D150, cured 7 days in air at 25°C (77°F) and 50% relative humidity, 100 KHz
Dielectric Strength Test Methods
Dielectric Strength Temperature Test Method
21.6 (KV/mm) 25°C CTM 0114, ASTM D149, cured 7 days in air at 25°C (77°F) and 50% relative humidity
Good
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.00150 25°C CTM 0112, ASTM D150, cured 7 days in air at 25°C (77°F) and 50% relative humidity, 100 Hz
0.00150 25°C CTM 0112, ASTM D150, cured 7 days in air at 25°C (77°F) and 50% relative humidity, 100 KHz
Volume Resistivity Test Methods
Volume Resistivity Temp (°C) Test Method
1.5e15 (ohms/cm) 25°C CTM 0112, ASTM D150, cured 7 days in air at 25°C (77°F) and 50% relative humidity
Elongation Test Methods
Elongation Test Method
540 % CTM 0137A, ASTM D412, cured 7 days in air at 25°C (77°F) and 50% relative humidity, at Break
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method Hardness Temperature
25 CTM 0099, ASTM D2240, cured 7 days in air at 25°C (77°F) and 50% relative humidity 25°C
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C) CTE Test Method
1.12e-3 (Volume (1/K)) 25°C CTM D420, cured 7 days in air at 25°C (77°F) and 50% relative humidity
Specific Gravity Test Methods
Specific Gravity Temperature Test Method
1.040 25°C CTM 0097B, ASTM D1475, cured 7 days in air at 25°C (77°F) and 50% relative humidity