Dow Dowsil 1-4173 Thermally Conductive Adhesive Datasheet Dow Dowsil 1-4173 Thermally Conductive Adhesive

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  • Description for Dow Dowsil 1-4173 Thermally Conductive Adhesive

    A one-part gray, flowable thermally conductive adhesive with high tensile strength.

    *See Terms of Use Below

    Brand Dowsil
    Chemical Resistance Good chemical stability
    Application Type Bond
    1 Part or 2 Part 1-Part
    Material Form Liquid, Silicone elastomer
    Substrate Al, Ceramics, Metals, Filled plastic, Epoxy laminate boards
    Industry Heat sink attach, PCB systems components, Smart Meters, Displays, E-Mobility Solutions, Smart Home Devices, Headlamp assemblies, Bonding integrated circuit substrates, Reliable protection of sensitive components, Reliable protection of sensitive circuits
    Manufacturer Dow
    Chemistry Aluminum Oxide, Silicone elastomer, No added solvents, Versatile, Polydimethylsiloxane
    Cure Method Heat cure
    Cure Temperature (°C) 100, 125, 150
    Cure Time (min) 90, 30, 20
    Viscosity (cPs) 61,000, Flowable, Self-leveling after dispensing , Able to flow after dispensing , Low surface tension
    Color Gray
    Primerless Primerless adhesion
    Ozone Resistance Resistant to ozone
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Other Resistance Thermal contact resistance
    Volume Resistivity (O) 2.2E+14 (ohms/cm)
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94-V0

  • Technical Data for Dow Dowsil 1-4173 Thermally Conductive Adhesive

    *See Terms of Use Below

    Overview
    • Chemical Resistance
      • Chemical Resistance - Good chemical stability
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Elastomer - Silicone elastomer
      • Liquid
    • Substrate
      • Ceramic - Ceramics
      • Metal - Metals
      • Aluminum - Al
      • Plastic - Filled plastic
      • Epoxy - Epoxy laminate boards
      • Other - A variety of common substrates, Reactive materials, Wet most surfaces
    • Industry
      • Displays
      • Smart Meters
      • Smart Home Devices
      • E-Mobility Solutions
      • Headlamp - Headlamp assemblies
      • Electronics - Heat sink attach, Bonding integrated circuit substrates, Reliable protection of sensitive circuits, Reliable protection of sensitive components
      • Printed Circuit Board (PCB) - PCB systems components
      • Industrial - Adhering housings, Adhering lids
      • Construction - Base plate attach
      • Other - Thermal management
    • Chemistry
      • Solvent-Free - No added solvents
      • Other - Aluminum Oxide, Versatile
      • Silicone - Silicone elastomer, Polydimethylsiloxane
    • Application Method
      • Dispenser - Automated or manual dispensing
    • Cure Method
      • Heat - Heat cure
    • Color
      • Gray
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - UL 94-V0
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 100, 125, 150 Test Method
    Cure Time (min) 90, 30, 20 Test Method
    Viscosity (cPs) 61,000, Flowable, Self-leveling after dispensing , Able to flow after dispensing , Low surface tension
    Thixotropic 3.9, Thixotropy
    Bond Strength
    Primerless Primerless adhesion
    Shear Strength (psi) 650 Test Method
    Tensile Strength (psi) High
    Material Resistance
    Ozone Resistance Resistant to ozone
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Other Resistance Thermal contact resistance
    Vibration Resistance/Shock Resistance Stress-relieving shock absorbers, Stress-relieving vibration absorbers
    Conductivity
    Dissipation Factor 0.00800, <0.00300 Test Method
    Dielectric Strength (V/mil) Good, Durable dielectric insulation, Durable, 425
    Dielectric Constant 4.98, 4.86 Test Method
    Thermal Conductivity (W/m°K) Thermally Conductive, 1.80
    Volume Resistivity (O) 2.2E+14 (ohms/cm)
    Hardness
    Shore A Hardness 92 Test Method
    Elongation (%) 0
    Flexibility Flexible
    Other Properties
    Specific Gravity 2.700 Test Method
    Coefficient of Thermal Expansion (CTE) 125 (ppm/°C) Test Method
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 6
    Not Good For
    Don't Use With Non-reactive metal substrates, Non-reactive plastic surfaces, Teflon, Polyethylene, Polypropylene

  • Best Practices for Dow Dowsil 1-4173 Thermally Conductive Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.

    2. Mixing

      No mixing of separate components required

    3. Curing

      Addition-cure silicones should be cured at 100 ºC (212 ºF) or above the cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). For thicker sections, a pre-cure at 70 ºC (158 ºF) may be necessary to reduce voids in the elastomer Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70 ºC (158 ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These products generally have long working times.

    4. Testing

      To ensure maximum bond strength for adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
100°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature, Heat cure
125°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature, Heat cure
150°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature, Heat cure
Cure Time Test Methods
Cure Time Test Method
90 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature, Heat cure
30 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature, Heat cure
20 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature, Heat cure
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
650 psi Lap shear strength AL Unprimed Adhesion
Dielectric Constant Test Methods
Dielectric Constant Test Method
4.98 Dielectric constant, 100 Hz
4.86 Dielectric constant, 100 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00800 Dissipation factor, 100 Hz
<0.00300 Dissipation factor, 100 KHz
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
92 Durometer
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
125 (ppm/°C) By TMA, Linear
Specific Gravity Test Methods
Specific Gravity Test Method
2.700 Cured