Dow Dowsil 1-4174 Thermally Conductive Adhesive

Dow Dowsil 1-4174 Thermally Conductive Adhesive Datasheet
  • Description for Dow Dowsil 1-4174 Thermally Conductive Adhesive

    One-part gray, flowable thermally conductive adhesive with high tensile strength and 7 mil glass beads<br/><br/>

    *See Terms of Use Below

    Brand Dowsil
    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Liquid, Silicone elastomer
    Substrate Al, Ceramics, Metals, Epoxy laminate boards, Filled plastics, Primerless adhesion
    Industry Heat sink attach, PCB system assemblies, Displays, E-Mobility Solutions, Smart Meters, Smart Home Devices, Bonding integrated circuit substrates
    Manufacturer Dow
    Chemistry Silicone elastomer, No added solvents, Versatile, 7 mil glass beads
    Cure Method Heat cure
    Cure Temperature (°C) 100, 125, 150, 125
    Cure Time (min) 90, 30, 20, 6
    Viscosity (cPs) 62,300, Flowable, Self-leveling after dispensing , Able to flow after dispensing
    Color Gray
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55, Low Thermal Resistance
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94-V0
  • Technical Data for Dow Dowsil 1-4174 Thermally Conductive Adhesive

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Elastomer - Silicone elastomer
      • Liquid
    • Substrate
      • Ceramic - Ceramics
      • Primerless - Primerless adhesion
      • Metal - Metals
      • Aluminum - Al
      • Plastic - Filled plastics
      • Epoxy - Epoxy laminate boards
      • Other - A variety of common substrates, Reactive materials
    • Industry
      • E-Mobility Solutions
      • Electronics - Heat sink attach, Bonding integrated circuit substrates
      • Printed Circuit Board (PCB) - PCB system assemblies
      • Displays
      • Smart Meters
      • Smart Home Devices
      • Industrial - Adhering housings, Adhering lids
      • Construction - Base plate attach
      • Other - Thermal management
    • Chemistry
      • Solvent-Free - No added solvents
      • Other - Versatile, 7 mil glass beads
      • Silicone - Silicone elastomer
    • Application Method
      • Dispenser - Automated and manual dispensing
    • Cure Method
      • Heat - Heat cure
    • Color
      • Gray
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: V0 - UL 94-V0
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 100, 125, 150, 125 Test Method
    Cure Time (min) 90, 30, 20, 6 Test Method
    Viscosity (cPs) 62,300, Flowable, Self-leveling after dispensing , Able to flow after dispensing
    Thixotropic 3.7, Thixotropy
    Bond Strength
    Shear Strength (psi) 646 Test Method
    Tensile Strength (psi) High
    Material Resistance
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55, Low Thermal Resistance
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00210 Test Method
    Filler Ceramic filler, Ceramic filler
    Dielectric Strength (V/mil) 400, 400
    Dielectric Constant 5.62, 4.65 Test Method
    Thermal Conductivity (W/m°K) Thermally Conductive, 1.78
    Volume Resistivity (O) 1.9E+14 (ohms/cm)
    Hardness
    Shore A Hardness 92 Test Method
    Elongation (%) 0
    Flexibility Flexible
    Other Properties
    Specific Gravity 2.710 Test Method
    Coefficient of Thermal Expansion (CTE) 125 (ppm/ºC) Test Method
    Business Information
    Shelf Life Details The product should be stored in its original packaging with the cover tightly attached to avoid any contamination. Store in accordance with any special instructions listed on the product label. The product should be used by the indicated Expiration Date found on the label.
    Shelf Life Temperature (°F) 41
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 6
    Not Good For
    Don't Use With Non-reactive metal substrates, Non-reactive plastic surfaces, Teflon, Polyethylene, Polypropylene
  • Best Practices for Dow Dowsil 1-4174 Thermally Conductive Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.

    2. Mixing

      No mixing of separate components required

    3. Curing

      Addition-cure silicones should be cured at 100 ºC (212 ºF) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). Thin sections of less than 20 mils may be cured in 15 minutes at 150 ºC (30 ºF). For thicker sections, a pre-cure at 70 ºC (158 ºF) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70 ºC (158 ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These adhesives generally have long working times.

    4. Testing

      To ensure maximum bond strength for adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
100°C Heat Cure
125°C Heat Cure
150°C Heat Cure
125°C Rheometer T90
Cure Time Test Methods
Cure Time Test Method
90 min Heat Cure
30 min Heat Cure
20 min Heat Cure
6 min Rheometer T90
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
646 psi Lap shear strength Al Unprimed Adhesion
Dielectric Constant Test Methods
Dielectric Constant Test Method
5.62 At 100 Hz
4.65 At 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00210 At 100 kHz
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
92 Durometer
Specific Gravity Test Methods
Specific Gravity Test Method
2.710 Uncured
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
125 (ppm/ºC) By TMA, Linear