Dow Dowsil 3-6265 HP Adhesive Datasheet Dow Dowsil 3-6265 HP Adhesive

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  • Description for Dow Dowsil 3-6265 HP Adhesive

    A one-part, black, non-flowing adhesive with high tensile strength, heat cure, low void formation after cure for sensitive substrates, rapid, versatile cure processing controlled by temperature.

    *See Terms of Use Below

    Brand Dowsil
    Application Type Bond, Sealing, Gasketing
    1 Part or 2 Part 1-Part
    Material Form Paste
    Substrate Aluminum, Ceramics, Glass, Many reactive metals, ABS, Selected plastics
    Industry PCB system asemblies, Connector sealing, Lighting, Smart Meters, Engine controllers, E-Mobility Solutions, Smart Home Devices
    Manufacturer Dow
    Chemistry Silicone elastomer, Polydimethylsiloxane
    Cure Method Heat cure
    Cure Temperature (°C) 100, 120, 125, 150
    Cure Time (min) 240, 50, 25, 10, Rapid
    Viscosity (cPs) Non-flowing, 10700 (Poise), Low void formation
    Color Black
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Volume Resistivity (O) 1.0 E+15 (Ohm-cm)
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94V-0
  • Technical Data for Dow Dowsil 3-6265 HP Adhesive

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Paste
    • Substrate
      • Ceramic - Ceramics
      • Glass
      • Metal - Many reactive metals
      • Aluminum
      • Plastic - ABS, Selected plastics
      • Other - Selected resins, Selected laminates, Sensitive substrates
    • Industry
      • Lighting
      • Other Transportation - Transmission controllers
      • Smart Meters
      • Smart Home Devices
      • E-Mobility Solutions
      • Printed Circuit Board (PCB) - PCB system asemblies
      • Connectors - Connector sealing
      • Power Supplies - Power Supply
      • Industrial - Sealing housings, Sealing lids
      • Engine - Engine controllers
      • Construction - Attaching baseplates
    • Chemistry
      • Silicone - Silicone elastomer, Polydimethylsiloxane
    • Application Method
      • Dispenser - Automated or manual needle dispense
    • Cure Method
      • Heat - Heat cure
    • Color
      • Black
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - UL 94V-0
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 100, 120, 125, 150
    Cure Time (min) 240, 50, 25, 10, Rapid
    Viscosity (cPs) Non-flowing, 10700 (Poise), Low void formation
    Work / Pot Time (min) Long
    Bond Strength
    General Bond Strength (psi) High
    Shear Strength (psi) 825 Test Method
    Tear Strength (piw) 80 (ppi) Test Method
    Tensile Strength (psi) High, 850
    Material Resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00360, <0.00300 Test Method
    Dielectric Strength (V/mil) 550
    Dielectric Constant 3.20, 3.15 Test Method
    Volume Resistivity (O) 1.0 E+15 (Ohm-cm)
    Hardness
    Shore A Hardness 68
    Elongation (%) 275
    Flexibility Flexible
    Other Properties
    Specific Gravity 1.330 Test Method
    Coefficient of Thermal Expansion (CTE) 215 (ppm/°C) Test Method
    Business Information
    Shelf Life Details Refer to product label for storage temperature conditions. Containers should be kept tightly closed and kept in cold storage at all times to extend shelf life. The product should be stored in its original packaging with the cover tightly attached to avoid any contamination. Store in accordance with any special instructions listed on the product label. The product should be used by its Use Before date as indicated on the product label.
    Shelf Life Temperature (°F) 41 to -40
    Not Good For
    Don't Use For Chemicals, Some solder flux residues, Other sulfur containing materials, Polysulfides, Silicone rubber containing organotin catalyst, Organotin, Curing agents, Unsaturated hydrocarbon plasitcizers, Polysulfones, Sulfur, Organometallic compounds
    Don't Use With Plastic substrates that are highly plasticized, Polypropylene, Teflon®, Non-reactive metal substrates, Plasticizers, Polyethylene, Non-reactive plastic surfaces, Certain materials, Rubber substrates that are highly plasticized
  • Best Practices for Dow Dowsil 3-6265 HP Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with Dow OS fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others

      users should determine the best techniques for their particular applications.

    2. Mixing

      Upon standing, some filler may settle to the bottom of the liquid containers after several weeks. To ensure a uniform product mix, the material in the container should be thoroughly mixed prior to use.

    3. Deairing/Degassing

      Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of >28 inches Hg for 10 minutes or until bubbling subsides.

    4. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength on a particular substrate, cohesive failure of the product in a lap shear or similar test is needed to ensure compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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    *See Terms of Use Below

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Tear Strength Test Methods
Tear Strength Test Method
80 (ppi) Die B
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
825 psi Lap Shear Aluminum Unprimed Adhesion
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.20 At 100 Hz
3.15 At 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00360 At 100 kHz
<0.00300
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
215 (ppm/°C) Linear CTE (by TMA)
Specific Gravity Test Methods
Specific Gravity Test Method
1.330 Cured