Brand Dowsil Application Type Bond, Seal, Attaching base plates gasket 1 Part or 2 Part 1 Part Material Form Liquid Substrate Plastics, Glass, Ceramics, Many reactive metals Industry Connector sealing, Sealing housings, Automotive, PCB system assemblies., E-Mobility Solutions, Smart Meters, Smart Home Devices Manufacturer Dow Chemistry Silicone Cure Method Heat, Addition cure Cure Temperature (°C) >100, 125, 150 Cure Time (min) Rapid, 60, 30 Viscosity (cPs) 1,020,000, 235,000, Non-flowing Color Black High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55
Technical Data for Dow Dowsil 3-6265 Thixotropic Adhesive
1 Part or 2 Part
- 1 Part or 2 Part - 1 Part
- Dispenser - Automated or manual needle dispense
- Addition cure
Cure Temperature (°C) >100, 125, 150 Cure Time (min) Rapid, 60, 30 Viscosity (cPs) 1,020,000, 235,000, Non-flowing Test Method Work / Pot Time (min) Long Thixotropic Thixotropic
General Bond Strength (psi) High Shear Strength (psi) 611 Test Method Tensile Strength (psi) 700, High
Environmental Resistance Environmental resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture/humidity resistance
Dissipation Factor 0.00900, <0.00100 Test Method Dielectric Strength (V/mil) Good, Durable, 550 Dielectric Constant 2.94, 2.89 Test Method Volume Resistivity (O) 4.7E+14 (ohms/cm)
Shore A Hardness 60 Elongation (%) 165 Flexibility Flexible Modulus (psi) 420 Test Method
Specific Gravity 1.340 Test Method Coefficient of Thermal Expansion (CTE) 270 (Linear (micron/m °C or ppm ))
Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label. For best results, Dow Corning RTV adhesives should be stored at or below 25°C (77°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed with head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen., Refer to product label for storage temperature conditions. Containers should be kept tightly closed and kept in cold storage at all times to extend shelf life. The product should be stored in its original packaging with the cover tightly attached to avoid any contamination. Store in accordance with any special instructions listed on the product label. The product should be used by its Use Before date as indicated on the product label. Shelf Life Temperature (°F) <41, <77 Shelf Life Type From date of manufacture Shelf Life (mon) 12
Not Good For
Don't Use For Some solder flux residues, Other sulfur containing materials, Organotin compounds, Unsaturated hydrocarbon plasitcizers, Organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Polysulfides, Polysulfones Don't Use With Plastic substrates that are highly plasticized, Rubber substrates that are highly plasticized, Polypropylene, Polyethylene, Teflon , Non-reactive plastic surfaces, Non-reactive metal substrates
Best Practices for Dow Dowsil 3-6265 Thixotropic Adhesive
All surfaces should be thoroughly cleaned and/or degreased with Dow OS fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others
users should determine the best techniques for their particular applications
Upon standing, some filler may settle to the bottom of the liquid containers after several weeks. To ensure a uniform product mix, the material in the container should be thoroughly mixed prior to use.
Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of > 28 inches Hg for 10 minutes or until bubbling subsides.
Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength on a particular substrate, cohesive failure of the product in a lap shear or similar test is needed to ensure compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.
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Viscosity Test Methods
|1,020,000 cPs||Low Shear|
|235,000 cPs||High Shear|
Shear Strength Test Methods
|611 psi||Lap shear strength|
Dielectric Constant Test Methods
|Dielectric Constant||Test Method|
Dissipation Factor Test Methods
|Dissipation Factor||Test Method|
Modulus Test Methods
|420 psi||Tensile Modulus|
Specific Gravity Test Methods
|Specific Gravity||Test Method|