Dow Dowsil 3-6265 Thixotropic Adhesive

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Description for Dow Dowsil 3-6265 Thixotropic Adhesive

One-part, black, non-flowing adhesive with high tensile strength, and UV indicator for inspection<br/>

Brand	Dowsil
Application Type	Bond, Seal, Attaching base plates gasket
1 Part or 2 Part	1-Part
Material Form	Liquid
Substrate	Ceramics, Glass, Many reactive metals, Plastics
Industry	Automotive, Sealing housings, PCB system assemblies., Connector sealing, Smart Meters, E-Mobility Solutions, Smart Home Devices
Manufacturer	Dow
Chemistry	Silicone
Cure Method	Heat, Addition cure
Cure Temperature (°C)	>100, 125, 150
Cure Time (min)	Rapid, 60, 30
Viscosity (cPs)	1,020,000, 235,000, Non-flowing
Color	Black
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Volume Resistivity (O)	4.7E+14 (ohms/cm)

Best Practices for Dow Dowsil 3-6265 Thixotropic Adhesive

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Technical Data for Dow Dowsil 3-6265 Thixotropic Adhesive

*See Terms of Use Below

Overview

Application Type
- Gasketing - Attaching base plates gasket
- Adhesive - Bond
- Sealant - Seal
1 Part or 2 Part
- 1-Part
Material Form
- Liquid
Substrate
- Ceramic - Ceramics
- Glass
- Metal - Many reactive metals
- Plastic - Plastics
- Other - Resins, Selected laminates
Industry
- Housing and Assembly - Sealing housings
- Smart Meters
- Smart Home Devices
- Automotive
- E-Mobility Solutions
- Printed Circuit Board (PCB) - PCB system assemblies.
- Connectors - Connector sealing
- Industrial - Industrial assembly areas
- Other - Sealing lids
Chemistry
- Silicone
Application Method
- Dispenser - Automated or manual needle dispense
Cure Method
- Addition cure
- Heat
Color
- Black
Brand
- Dowsil

Specifications

Cure Specs

Cure Temperature (°C)	>100, 125, 150
Cure Time (min)	Rapid, 60, 30
Viscosity (cPs)	1,020,000, 235,000, Non-flowing	Test Method
Work / Pot Time (min)	Long
Thixotropic	Thixotropic

Bond Strength

General Bond Strength (psi)	High
Shear Strength (psi)	611	Test Method
Tensile Strength (psi)	700, High

Material Resistance

Environmental Resistance	Environmental resistance
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Moisture/Humidity Resistance	Moisture/humidity resistance

Conductivity

Dissipation Factor	0.00900, <0.00100	Test Method
Dielectric Strength (V/mil)	Good, Durable, 550
Dielectric Constant	2.94, 2.89	Test Method
Volume Resistivity (O)	4.7E+14 (ohms/cm)

Hardness

Shore A Hardness	60
Elongation (%)	165
Flexibility	Flexible
Modulus (psi)	420	Test Method

Other Properties

Specific Gravity	1.340	Test Method
Coefficient of Thermal Expansion (CTE)	270 (Linear (micron/m °C or ppm ))

Business Information

Shelf Life Details	Shelf life is indicated by the “Use Before” date found on the product label. For best results, Dow Corning RTV adhesives should be stored at or below 25°C (77°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed with head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen., Refer to product label for storage temperature conditions. Containers should be kept tightly closed and kept in cold storage at all times to extend shelf life. The product should be stored in its original packaging with the cover tightly attached to avoid any contamination. Store in accordance with any special instructions listed on the product label. The product should be used by its Use Before date as indicated on the product label.
Shelf Life Temperature (°F)	<41, <77
Shelf Life Type	From date of manufacture
Shelf Life (mon)	12

Not Good For

Don't Use For	Some solder flux residues, Other sulfur containing materials, Organotin compounds, Unsaturated hydrocarbon plasitcizers, Organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Polysulfides, Polysulfones
Don't Use With	Plastic substrates that are highly plasticized, Rubber substrates that are highly plasticized, Polypropylene, Polyethylene, Teflon , Non-reactive plastic surfaces, Non-reactive metal substrates

Best Practices for Dow Dowsil 3-6265 Thixotropic Adhesive

*See Terms of Use Below
1. Surface Preparation
  
  All surfaces should be thoroughly cleaned and/or degreased with Dow OS fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others
  
  users should determine the best techniques for their particular applications
2. Mixing
  
  Upon standing, some filler may settle to the bottom of the liquid containers after several weeks. To ensure a uniform product mix, the material in the container should be thoroughly mixed prior to use.
3. Deairing/Degassing
  
  Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of > 28 inches Hg for 10 minutes or until bubbling subsides.
4. Curing
  
  Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
5. Testing
  
  Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength on a particular substrate, cohesive failure of the product in a lap shear or similar test is needed to ensure compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.
Comparable Materials for Dow Dowsil 3-6265 Thixotropic Adhesive

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Spec Engine^® Results
- Dowsil SE 1714 Beige or Black(Dow)
  A one-part, beige or black, flowable adhesive with high tensile strength sealing lids and housings for ECUs, power modules.
- Dowsil SE 1750 Adhesive(Dow)
  One-part, flowable adhesive with high tensile strength, Heat Cure, No added solvents, These adhesives generally have long working times so users can enjoy the greatest manufacturing flexibility and reduce waste.
- Dowsil SE 1713 Adhesive(Dow)
  One-part, beige, flowable adhesive with high tensile strength.
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