Dow Dowsil 3-6265 Thixotropic Adhesive

Dow Dowsil 3-6265 Thixotropic Adhesive Datasheet
  • Description for Dow Dowsil 3-6265 Thixotropic Adhesive

    One-part, black, non-flowing adhesive with high tensile strength, and UV indicator for inspection<br/>

    *See Terms of Use Below

    Brand Dowsil
    Application Type Bond, Seal, Attaching base plates gasket
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate Plastics, Glass, Ceramics, Many reactive metals
    Industry Connector sealing, Sealing housings, Automotive, PCB system assemblies., E-Mobility Solutions, Smart Meters, Smart Home Devices
    Manufacturer Dow
    Chemistry Silicone
    Cure Method Heat, Addition cure
    Cure Temperature (°C) >100, 125, 150
    Cure Time (min) Rapid, 60, 30
    Viscosity (cPs) 1,020,000, 235,000, Non-flowing
    Color Black
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
  • Technical Data for Dow Dowsil 3-6265 Thixotropic Adhesive

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Liquid
    • Substrate
    • Industry
      • Housing and Assembly - Sealing housings
      • Automotive
      • E-Mobility Solutions
      • Connectors - Connector sealing
      • Printed Circuit Board (PCB) - PCB system assemblies.
      • Smart Meters
      • Smart Home Devices
      • Industrial - Industrial assembly areas
      • Other - Sealing lids
    • Chemistry
    • Application Method
      • Dispenser - Automated or manual needle dispense
    • Cure Method
      • Addition cure
      • Heat
    • Color
      • Black
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) >100, 125, 150
    Cure Time (min) Rapid, 60, 30
    Viscosity (cPs) 1,020,000, 235,000, Non-flowing Test Method
    Work / Pot Time (min) Long
    Thixotropic Thixotropic
    Bond Strength
    General Bond Strength (psi) High
    Shear Strength (psi) 611 Test Method
    Tensile Strength (psi) 700, High
    Material Resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00900, <0.00100 Test Method
    Dielectric Strength (V/mil) Good, Durable, 550
    Dielectric Constant 2.94, 2.89 Test Method
    Volume Resistivity (O) 4.7E+14 (ohms/cm)
    Hardness
    Shore A Hardness 60
    Elongation (%) 165
    Flexibility Flexible
    Modulus (psi) 420 Test Method
    Other Properties
    Specific Gravity 1.340 Test Method
    Coefficient of Thermal Expansion (CTE) 270 (Linear (micron/m °C or ppm ))
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label. For best results, Dow Corning RTV adhesives should be stored at or below 25°C (77°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed with head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen., Refer to product label for storage temperature conditions. Containers should be kept tightly closed and kept in cold storage at all times to extend shelf life. The product should be stored in its original packaging with the cover tightly attached to avoid any contamination. Store in accordance with any special instructions listed on the product label. The product should be used by its Use Before date as indicated on the product label.
    Shelf Life Temperature (°F) <41, <77
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 12
    Not Good For
    Don't Use For Some solder flux residues, Other sulfur containing materials, Organotin compounds, Unsaturated hydrocarbon plasitcizers, Organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Polysulfides, Polysulfones
    Don't Use With Plastic substrates that are highly plasticized, Rubber substrates that are highly plasticized, Polypropylene, Polyethylene, Teflon , Non-reactive plastic surfaces, Non-reactive metal substrates
  • Best Practices for Dow Dowsil 3-6265 Thixotropic Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with Dow OS fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others

      users should determine the best techniques for their particular applications

    2. Mixing

      Upon standing, some filler may settle to the bottom of the liquid containers after several weeks. To ensure a uniform product mix, the material in the container should be thoroughly mixed prior to use.

    3. Deairing/Degassing

      Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of > 28 inches Hg for 10 minutes or until bubbling subsides.

    4. Curing

      Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

    5. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength on a particular substrate, cohesive failure of the product in a lap shear or similar test is needed to ensure compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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    *See Terms of Use Below

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Viscosity Test Methods
Viscosity Test Method
1,020,000 cPs Low Shear
235,000 cPs High Shear
Non-flowing
Shear Strength Test Methods
Shear Strength Type
611 psi Lap shear strength
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.94 100 Hz
2.89 100 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00900 100 Hz
<0.00100 100 KHz
Modulus Test Methods
Modulus Test Method
420 psi Tensile Modulus
Specific Gravity Test Methods
Specific Gravity Test Method
1.340 Cured