Dow Dowsil 3-6751 Thermally Conductive Adhesive

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Description for Dow Dowsil 3-6751 Thermally Conductive Adhesive

Two-part gray, thermally conductive adhesive with low viscosity and flame resistance

Brand	Dowsil
Chemical Resistance	Good
Application Type	Bond
1 Part or 2 Part	2-Part
Material Form	Liquid
Substrate	Al, Ceramics, Metals, Filled plastics, Epoxy laminate boards
Industry	Power supply, Automotive applications, Printed circuit boards (PCBs), Smart Meters, E-Mobility Solutions, Smart Home Devices, Consumer devices
Manufacturer	Dow
Chemistry	Silicone
Cure Method	2-Part Cure, Heat
Cure Temperature (°C)	100, 125, 150
Cure Time (min)	50, 40, 10
Viscosity (cPs)	Low, 9,300, Self leveling, Highly flowable
Color	Gray
Ozone Resistance	Ozone resistance
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Volume Resistivity (O)	7.2E+13 (ohm/cm)
Extrusion Rate (g/sec)	8,760
Key Specifications	UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0

Best Practices for Dow Dowsil 3-6751 Thermally Conductive Adhesive

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Technical Data for Dow Dowsil 3-6751 Thermally Conductive Adhesive

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Overview

Chemical Resistance
- Chemical Resistance - Good
Application Type
- Adhesive - Bond
1 Part or 2 Part
- 2-Part
Material Form
- Liquid
Substrate
- Ceramic - Ceramics
- Metal - Metals
- Aluminum - Al
- Plastic - Filled plastics
- Epoxy - Epoxy laminate boards
- Other - Reactive materials, A variety of common substrates
Industry
- Smart Meters
- Smart Home Devices
- Automotive - Automotive applications
- E-Mobility Solutions
- Electronics - Consumer devices, Power supply
- Printed Circuit Board (PCB) - Printed circuit boards (PCBs)
Chemistry
- Silicone
Application Method
- Dispenser - Automated meter-mix
Cure Method
- Heat
- 2-Part Cure
Color
- Gray
Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - UL 94 V-0
Brand
- Dowsil

Specifications

Cure Specs

Cure Temperature (°C)	100, 125, 150	Test Method
Cure Time (min)	50, 40, 10	Test Method
Viscosity (cPs)	Low, 9,300, Self leveling, Highly flowable	Test Method
Work / Pot Time (min)	120	Test Method

Bond Strength

General Bond Strength (psi)	Good
Shear Strength (psi)	510	Test Method
Tensile Strength (psi)	400

Material Resistance

Non-Corrosive	Corrosion
Flame Resistance	Flame resistance
Ozone Resistance	Ozone resistance
UV Resistance	UV resistance
Environmental Resistance	Environmental resistance
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Moisture/Humidity Resistance	Moisture/humidity resistance

Conductivity

Dissipation Factor	0.00450, 0.00013	Test Method
Dielectric Strength (V/mil)	Good, Durable, 454
Dielectric Constant	4.71, 4.65	Test Method
Thermal Conductivity (W/m°K)	1.00, High
Volume Resistivity (O)	7.2E+13 (ohm/cm)

Hardness

Shore A Hardness	68
Elongation (%)	36
Flexibility	Flexible
Modulus (psi)	Low, 125	Test Method

Other Properties

Extrusion Rate (g/sec)	8,760
Specific Gravity	2.320	Test Method
Coefficient of Thermal Expansion (CTE)	179 (ppm/°C)	Test Method

Business Information

Shelf Life Details	Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers., The product should be stored in its original packaging with the cover tightly attached to avoid any contamination. Store in accordance with any special instructions listed on the product label. The product should be used by the indicated Exp. Date found on the label.
Shelf Life Type	From date of manufacture, Shelf Life Type
Shelf Life (mon)	12

Not Good For

Don't Use With	non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene, Plastic substrates that are highly plasticized, Rubber substrates that are highly plasticized

Best Practices for Dow Dowsil 3-6751 Thermally Conductive Adhesive

*See Terms of Use Below
1. Surface Preparation
  
  All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.
2. Mixing
  
  Upon standing, some filler may settle to the bottom of the liquid after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use. Two-part materials should be mixed in the proper ratio either by weight or volume. The presence of light-colored streaks or marbling indicates inadequate mixing.
3. Deairing/Degassing
  
  Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If deairing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of > 8 inches Hg (or a residual pressure of 10–0 mm of Hg) for 10 minutes or until bubbling subsides.
4. Curing
  
  Addition-cure silicones should be cured at 100°C (212°F) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). For thicker sections, a pre-cure at 70°C (158°F) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70°C (158°F) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These products generally have long working times.
  
  POT LIFE AND CURE RATE: Cure reaction begins with the mixing process. Initially, cure is evidenced by a gradual increase in viscosity, followed by gelation and conversion to its final state. Pot life is defined as the time required for viscosity to double after Parts A and B (base and curing agent) are mixed.
5. Testing
  
  To ensure maximum bond strength for adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.
Comparable Materials for Dow Dowsil 3-6751 Thermally Conductive Adhesive

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Spec Engine^® Results
- Sylgard 184 Silicone Elastomer(Dow)
  Two part; 10:1 mix; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; deep section cure; repairable; good dielectric properties; flexible elastomer.
- Sylgard 186 Silicone Elastomer(Dow)
  Two part; 10:1 mix; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; deep section cure; repairable; good dielectric properties; flexible elastomer.
- 3-6753 Thermally ConDuctive Adhesive(Dow)
  Two-part; heat cure; low modulus; low viscosity; contains 7-mil (178 micron) glass beads for bond line control
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