Dow Dowsil 3-6751 Thermally Conductive Adhesive Datasheet Dow Dowsil 3-6751 Thermally Conductive Adhesive

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  • Description for Dow Dowsil 3-6751 Thermally Conductive Adhesive

    Two-part gray, thermally conductive adhesive with low viscosity and flame resistance

    *See Terms of Use Below

    Brand Dowsil
    Chemical Resistance Good
    Application Type Bond
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Substrate Al, Ceramics, Metals, Filled plastics, Epoxy laminate boards
    Industry Power supply, Automotive applications, Printed circuit boards (PCBs), Smart Meters, E-Mobility Solutions, Smart Home Devices, Consumer devices
    Manufacturer Dow
    Chemistry Silicone
    Cure Method 2-Part Cure, Heat
    Cure Temperature (°C) 100, 125, 150
    Cure Time (min) 50, 40, 10
    Viscosity (cPs) Low, 9,300, Self leveling, Highly flowable
    Color Gray
    Ozone Resistance Ozone resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Volume Resistivity (O) 7.2E+13 (ohm/cm)
    Extrusion Rate (g/sec) 8,760
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0
  • Technical Data for Dow Dowsil 3-6751 Thermally Conductive Adhesive

    • Chemical Resistance
      • Chemical Resistance - Good
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Substrate
      • Ceramic - Ceramics
      • Metal - Metals
      • Aluminum - Al
      • Plastic - Filled plastics
      • Epoxy - Epoxy laminate boards
      • Other - Reactive materials, A variety of common substrates
    • Industry
      • Smart Meters
      • Smart Home Devices
      • Automotive - Automotive applications
      • E-Mobility Solutions
      • Electronics - Consumer devices, Power supply
      • Printed Circuit Board (PCB) - Printed circuit boards (PCBs)
    • Chemistry
    • Application Method
      • Dispenser - Automated meter-mix
    • Cure Method
      • Heat
      • 2-Part Cure
    • Color
      • Gray
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - UL 94 V-0
    • Brand
      • Dowsil
    Cure Specs
    Cure Temperature (°C) 100, 125, 150 Test Method
    Cure Time (min) 50, 40, 10 Test Method
    Viscosity (cPs) Low, 9,300, Self leveling, Highly flowable Test Method
    Work / Pot Time (min) 120 Test Method
    Bond Strength
    General Bond Strength (psi) Good
    Shear Strength (psi) 510 Test Method
    Tensile Strength (psi) 400
    Material Resistance
    Non-Corrosive Corrosion
    Flame Resistance Flame resistance
    Ozone Resistance Ozone resistance
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Dissipation Factor 0.00450, 0.00013 Test Method
    Dielectric Strength (V/mil) Good, Durable, 454
    Dielectric Constant 4.71, 4.65 Test Method
    Thermal Conductivity (W/m°K) 1.00, High
    Volume Resistivity (O) 7.2E+13 (ohm/cm)
    Shore A Hardness 68
    Elongation (%) 36
    Flexibility Flexible
    Modulus (psi) Low, 125 Test Method
    Other Properties
    Extrusion Rate (g/sec) 8,760
    Specific Gravity 2.320 Test Method
    Coefficient of Thermal Expansion (CTE) 179 (ppm/°C) Test Method
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers., The product should be stored in its original packaging with the cover tightly attached to avoid any contamination. Store in accordance with any special instructions listed on the product label. The product should be used by the indicated Exp. Date found on the label.
    Shelf Life Type From date of manufacture, Shelf Life Type
    Shelf Life (mon) 12
    Not Good For
    Don't Use With non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene, Plastic substrates that are highly plasticized, Rubber substrates that are highly plasticized
  • Best Practices for Dow Dowsil 3-6751 Thermally Conductive Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.

    2. Mixing

      Upon standing, some filler may settle to the bottom of the liquid after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use. Two-part materials should be mixed in the proper ratio either by weight or volume. The presence of light-colored streaks or marbling indicates inadequate mixing.

    3. Deairing/Degassing

      Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If deairing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of > 8 inches Hg (or a residual pressure of 10–0 mm of Hg) for 10 minutes or until bubbling subsides.

    4. Curing

      Addition-cure silicones should be cured at 100°C (212°F) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). For thicker sections, a pre-cure at 70°C (158°F) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70°C (158°F) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These products generally have long working times.

      POT LIFE AND CURE RATE: Cure reaction begins with the mixing process. Initially, cure is evidenced by a gradual increase in viscosity, followed by gelation and conversion to its final state. Pot life is defined as the time required for viscosity to double after Parts A and B (base and curing agent) are mixed.

    5. Testing

      To ensure maximum bond strength for adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
100°C Heat Cure
125°C Heat Cure
150°C Heat Cure
Cure Time Test Methods
Cure Time Test Method
50 min Heat Cure
40 min Heat Cure
10 min Heat Cure
Viscosity Test Methods
Viscosity Test Method
9,300 cPs Mixed
Self leveling
Highly flowable
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
120 min Time to double initial mixed viscosity. 25°C
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
510 psi Lap shear strength AL Unprimed Adhesion
Dielectric Constant Test Methods
Dielectric Constant Test Method
4.71 100 Hz
4.65 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00450 100 Hz
0.00013 100 kHz
Modulus Test Methods
Modulus Test Method
125 psi Compression at 10%
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
179 (ppm/°C) By TMA
Specific Gravity Test Methods
Specific Gravity Test Method
2.320 Cured