Dow Dowsil 866 Primerless Silicone Adhesive

Dow Dowsil 866 Primerless Silicone Adhesive Datasheet
  • Description for Dow Dowsil 866 Primerless Silicone Adhesive

    One-Part, gray, flowable adhesive with high tensile strength, Heat cure.

    *See Terms of Use Below

    Brand Dowsil
    Application Type Bond, Gasketing
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate Aluminum, Glass, Ceramics, Many reactive metals, Plastics
    Industry E-Mobility Solutions, Smart Meters, Smart Home Devices
    Manufacturer Dow
    Chemistry Silicone
    Cure Method Heat
    Cure Temperature (°C) 125, 150
    Cure Time (min) 60, 30, Rapid
    Viscosity (cPs) 48,000, Flowable, Self-leveling
    Color Gray
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
  • Technical Data for Dow Dowsil 866 Primerless Silicone Adhesive

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Liquid
    • Substrate
    • Industry
      • E-Mobility Solutions
      • Smart Meters
      • Smart Home Devices
      • Other - Sealing lids and housings, Attaching baseplates, Connector sealing
    • Chemistry
    • Application Method
      • Dispenser - Applied with simple needle dispensing systems, Automated systems are normally used for high volume process, In low volume, manual dispensing may be appropriate
    • Cure Method
      • Heat
    • Color
      • Gray
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 125, 150 Test Method
    Cure Time (min) 60, 30, Rapid Test Method
    Viscosity (cPs) 48,000, Flowable, Self-leveling
    Work / Pot Time (min) Long Test Method
    Bond Strength
    General Bond Strength (psi) High
    Shear Strength (psi) 775 Test Method
    Tear Strength (piw) 25 (ppi) Test Method
    Tensile Strength (psi) 925, High
    Material Resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dielectric Strength (V/mil) Good, Durable, 500
    Volume Resistivity (O) 2E+15 (ohm/cm)
    Hardness
    Shore A Hardness 57
    Elongation (%) 210
    Flexibility Flexible
    Other Properties
    Specific Gravity 1.290 Test Method
    Coefficient of Thermal Expansion (CTE) 350 (ppm/°C) Test Method
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label. For best results, Dow Corning RTV adhesives should be stored at or below 25°C (77°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed with head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen., Refer to product label for storage temperature conditions. Containers should be kept tightly closed and kept in cold storage at all times to extend shelf life. The product should be stored in its original packaging with the cover tightly attached to avoid any contamination. Store in accordance with any special instructions listed on the product label. The product should be used by its Use Before date as indicated on the product label.
    Shelf Life Type from date of manufacture
    Shelf Life (mon) 12
    Not Good For
    Don't Use For Some solder flux residues, Organotin compounds, Unsaturated hydrocarbon plasitcizers, Organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Polysulfides, Polysulfones, Other sulfur containing materials
    Don't Use With Non-reactive metal substrates, Nonreactive plastic surfaces, Teflon, Polyethylene, Polypropylene, Rubber substrates that are highly plasticized, Plastic substrates that are highly plasticized
  • Best Practices for Dow Dowsil 866 Primerless Silicone Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with Dow OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others

      users should determine the best techniques for their particular applications.

    2. Mixing

      Upon standing, some filler may settle to the bottom of the liquid containers after several weeks. To ensure a uniform product mix, the material in the container should be thoroughly mixed prior to use

    3. Deairing/Degassing

      Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of > 28 inches Hg for 10 minutes or until bubbling subsides.

    4. Curing

      Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

    5. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength on a particular substrate, cohesive failure of the product in a lap shear or similar test is needed to ensure compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
125°C Heat Cure
150°C Heat Cure
Cure Time Test Methods
Cure Time Test Method
60 min Heat Cure
30 min Heat Cure
Rapid
Work / Pot Time Test Methods
Work / Pot Time Temperature
Long
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
775 psi Lap shear strength Aluminum Unprimed Adhesion
Tear Strength Test Methods
Tear Strength Test Method
25 (ppi) Die B
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
350 (ppm/°C) by TMA
Specific Gravity Test Methods
Specific Gravity Test Method
1.290 Cured