Dow Dowsil 866 Primerless Silicone Adhesive

CONTACT REP

Description for Dow Dowsil 866 Primerless Silicone Adhesive

One-Part, gray, flowable adhesive with high tensile strength, Heat cure.

Brand	Dowsil
Application Type	Bond, Gasketing
1 Part or 2 Part	1-Part
Material Form	Liquid
Substrate	Aluminum, Ceramics, Glass, Many reactive metals, Plastics
Industry	Smart Meters, E-Mobility Solutions, Smart Home Devices
Manufacturer	Dow
Chemistry	Silicone
Cure Method	Heat
Cure Temperature (°C)	125, 150
Cure Time (min)	60, 30, Rapid
Viscosity (cPs)	48,000, Flowable, Self-leveling
Color	Gray
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Volume Resistivity (O)	2E+15 (ohm/cm)

Best Practices for Dow Dowsil 866 Primerless Silicone Adhesive

Register for FREE to view more details

Why register?

View Technical Details
View Test Methods
View Key Specifications
View Similar Materials
Save your Project Searches

See what Gluespec offers

Sign up now Already registered? Sign in!

Email: *

Password: *

Confirm Password: *

Do you prefer to see data in °F or °C?

First Name: *

Last Name: *

Phone: *

Company Name: *

Address: *

Postal Code: *

Country: *

Job Function: *

Industry: *

Describe: *

I agree to the terms of use *

*: Required

Technical Data for Dow Dowsil 866 Primerless Silicone Adhesive

*See Terms of Use Below

Overview

Application Type
- Gasketing
- Adhesive - Bond
1 Part or 2 Part
- 1-Part
Material Form
- Liquid
Substrate
- Ceramic - Ceramics
- Glass
- Metal - Many reactive metals
- Aluminum
- Plastic - Plastics
- Other - Resins, Selected laminates
Industry
- Smart Meters
- Smart Home Devices
- E-Mobility Solutions
- Other - Sealing lids and housings, Attaching baseplates, Connector sealing
Chemistry
- Silicone
Application Method
- Dispenser - Applied with simple needle dispensing systems, Automated systems are normally used for high volume process, In low volume, manual dispensing may be appropriate
Cure Method
- Heat
Color
- Gray
Brand
- Dowsil

Specifications

Cure Specs

Cure Temperature (°C)	125, 150	Test Method
Cure Time (min)	60, 30, Rapid	Test Method
Viscosity (cPs)	48,000, Flowable, Self-leveling
Work / Pot Time (min)	Long	Test Method

Bond Strength

General Bond Strength (psi)	High
Shear Strength (psi)	775	Test Method
Tear Strength (piw)	25 (ppi)	Test Method
Tensile Strength (psi)	925, High

Material Resistance

Environmental Resistance	Environmental resistance
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Moisture/Humidity Resistance	Moisture/humidity resistance

Conductivity

Dielectric Strength (V/mil)	Good, Durable, 500
Volume Resistivity (O)	2E+15 (ohm/cm)

Hardness

Shore A Hardness	57
Elongation (%)	210
Flexibility	Flexible

Other Properties

Specific Gravity	1.290	Test Method
Coefficient of Thermal Expansion (CTE)	350 (ppm/°C)	Test Method

Business Information

Shelf Life Details	Shelf life is indicated by the “Use Before” date found on the product label. For best results, Dow Corning RTV adhesives should be stored at or below 25°C (77°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed with head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen., Refer to product label for storage temperature conditions. Containers should be kept tightly closed and kept in cold storage at all times to extend shelf life. The product should be stored in its original packaging with the cover tightly attached to avoid any contamination. Store in accordance with any special instructions listed on the product label. The product should be used by its Use Before date as indicated on the product label.
Shelf Life Type	from date of manufacture
Shelf Life (mon)	12

Not Good For

Don't Use For	Some solder flux residues, Organotin compounds, Unsaturated hydrocarbon plasitcizers, Organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Polysulfides, Polysulfones, Other sulfur containing materials
Don't Use With	Non-reactive metal substrates, Nonreactive plastic surfaces, Teflon, Polyethylene, Polypropylene, Rubber substrates that are highly plasticized, Plastic substrates that are highly plasticized

Best Practices for Dow Dowsil 866 Primerless Silicone Adhesive

*See Terms of Use Below
1. Surface Preparation
  
  All surfaces should be thoroughly cleaned and/or degreased with Dow OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others
  
  users should determine the best techniques for their particular applications.
2. Mixing
  
  Upon standing, some filler may settle to the bottom of the liquid containers after several weeks. To ensure a uniform product mix, the material in the container should be thoroughly mixed prior to use
3. Deairing/Degassing
  
  Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of > 28 inches Hg for 10 minutes or until bubbling subsides.
4. Curing
  
  Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
5. Testing
  
  Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength on a particular substrate, cohesive failure of the product in a lap shear or similar test is needed to ensure compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.
Comparable Materials for Dow Dowsil 866 Primerless Silicone Adhesive

*See Terms of Use Below

Spec Engine^® Results
- 3-6876 Black Adhesive(Dow)
  Noncorrosive; self-priming; rapid heat cure; high strength; good flow.
- Dowsil SE 4402 Thermally Conductive Adhesive(Dow)
  A one-part, gray, flowable thermally conductive adhesive is bonding organic and ceramic substrates to heat sinks for control modules in automotive.
- Compare All