Dow Dowsil EA-6052 Fast Low-Temp Cure Adhesive

Dow Dowsil EA-6052 Fast Low-Temp Cure Adhesive Datasheet
  • Description for Dow Dowsil EA-6052 Fast Low-Temp Cure Adhesive

    A two-part, 1:1 mix, black, flowable adhesive with high tensile strength and UV indicator for inspection.

    *See Terms of Use Below

    Brand Dowsil
    Application Type Adhesive, Gasketing
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Aluminum, Ceramics, Glass, Selected plastics
    Industry Housings, Connector sealing, Smart Meters, E-Mobility Solutions, Smart Home Devices
    Manufacturer Dow
    Chemistry Silicone, No added solvents
    Cure Method 2-Part Cure, Heat
    Cure Temperature (°C) 90, 125, 150, 70, Low-Temp
    Cure Time (min) 60, 30, 10, 30, Fast
    Viscosity (cPs) 40,600, Flowable, Self-leveling
    Color Black
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
  • Technical Data for Dow Dowsil EA-6052 Fast Low-Temp Cure Adhesive

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Liquid
    • Substrate
    • Industry
      • Housing and Assembly - Housings
      • E-Mobility Solutions
      • Connectors - Connector sealing
      • Smart Meters
      • Smart Home Devices
      • Other - Ataching baseplates, Sealing lids
    • Chemistry
    • Application Method
      • Dispenser - Automated or manual needle dispense
    • Cure Method
      • Heat
      • 2-Part Cure
    • Color
      • Black
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 90, 125, 150, 70, Low-Temp Test Method
    Cure Time (min) 60, 30, 10, 30, Fast Test Method
    Viscosity (cPs) 40,600, Flowable, Self-leveling Test Method
    Work / Pot Time (min) Long, 300 Test Method
    Mix Ratio 1:1 (by volume), 1:1 (by weight)
    Bond Strength
    Shear Strength (psi) 710 Test Method
    Tear Strength (piw) 50 (ppi) Test Method
    Tensile Strength (psi) 685, High
    Material Resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Conductivity
    Dissipation Factor 0.00200, <0.00020 Test Method
    Dielectric Strength (V/mil) Good, 575
    Dielectric Constant 3.06, 3.01 Test Method
    Volume Resistivity (O) 5.3E+14 (ohms/cm)
    Hardness
    Shore A Hardness 48
    Elongation (%) 170
    Flexibility Flexible
    Modulus (psi) 400 Test Method
    Other Properties
    Specific Gravity 1.240 Test Method
    Coefficient of Thermal Expansion (CTE) 290 (Linear (micron/m °C or ppm ))
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label.
    Shelf Life Temperature (°F) 77
    Shelf Life (mon) 12
    Not Good For
    Don't Use With Non-reactive plastic surfaces, Teflon®, Non-reactive metal substrates, Polyethylene, Polypropylene, Plastic substrates that are highly plasticized, Rubber substrates that are highly plasticized
  • Best Practices for Dow Dowsil EA-6052 Fast Low-Temp Cure Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with Dow OS fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others

      users should determine the best techniques for their particular applications.

    2. Mixing

      Dow silicone 1:1 adhesives are supplied in two parts that do not require lot matching. The 1:1 mix ratio, by weight or volume, simplifies the proportioning process. To ensure uniform distribution of filler, Parts A and B must each be thoroughly mixed prior to their combination in a 1:1 ratio. When thoroughly blended, the Part A and B liquid mixture should have a uniform appearance. The presence of light colored streaks or marbling indicates inadequate mixing and will result in incomplete cure. For fast-curing adhesives automated mix and dispense equipment should be utilized.

    3. Deairing/Degassing

      In applications sensitive to air entrapment, de-airing with 28 to 30 inches Hg vacuum is required.

    4. Curing

      Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: Organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

    5. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is desired. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or can detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

  • Comparable Materials for Dow Dowsil EA-6052 Fast Low-Temp Cure Adhesive

    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
90°C Heat Cure
125°C Heat Cure
150°C Heat Cure
70°C Pre-cure
Low-Temp
Cure Time Test Methods
Cure Time Test Method
60 min Heat Cure
30 min Heat Cure
10 min Heat Cure
30 min Pre-cure
Fast
Viscosity Test Methods
Viscosity Test Method
40,600 cPs Mixed
Flowable
Self-leveling
Work / Pot Time Test Methods
Work / Pot Time Temperature
Long
300 min 25°C
Tear Strength Test Methods
Tear Strength Test Method
50 (ppi) Die B
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
710 psi Lap shear Aluminum Unprimed Adhesion
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.06 Dielectric constant, 100 Hz
3.01 Dielectric constant, 100 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00200 Dissipation factor, 100 Hz
<0.00020 Dissipation factor, 100 KHz
Modulus Test Methods
Modulus Test Method
400 psi Tensile Modulus
Specific Gravity Test Methods
Specific Gravity Test Method
1.240 Cured