Dow Dowsil EC-6601 Electrically Conductive Adhesive

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Description for Dow Dowsil EC-6601 Electrically Conductive Adhesive

One-part electrically conductive adhesive with high elongation and stable conductivity designed for electromagnetic compatibility (EMC), durable mechanical and conductive properties, reliable performance.

*See Terms of Use Below

Brand	Dowsil
Application Type	Bond, Sealant, Gasket
1 Part or 2 Part	1-Part
Material Form	Liquid
Substrate	Al 5052, Ceramics, Glass, Many reactive metals, Plastics, Al clad
Industry	EMC solutions, PCB grounding, Electronic devices, Electrical connections
Manufacturer	Dow
Chemistry	Polydimethylsiloxane
Cure Method	Moisture cure, Heat
Cure Temperature (°C)	20 to 25 Room temperature, 50 to 65
Cure Time (min)	1,440 to 4,320
Color	Tan
High Temperature Resistance (°C)	125
Low Temperature Resistance (°C)	-45, -55
Silver (Ag)-Filled	Filler: Silver filler composition blend
Volume Resistivity (O)	2.7E-3 (Ohm-cm)
Extrusion Rate (g/sec)	132

Best Practices for Dow Dowsil EC-6601 Electrically Conductive Adhesive

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Technical Data for Dow Dowsil EC-6601 Electrically Conductive Adhesive

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Overview

Application Type
- Gasketing - Gasket
- Adhesive - Bond
- Sealant
1 Part or 2 Part
- 1-Part
Material Form
- Liquid
Substrate
- Ceramic - Ceramics
- Glass
- Metal - Many reactive metals
- Aluminum - Al clad, Al 5052
- Plastic - Plastics
- Other - A variety of substrates, Resins, Selected laminates
Industry
- Electronics - Electrical connections, EMC solutions, Electronic devices
- Printed Circuit Board (PCB) - PCB grounding
Chemistry
- Silicone - Polydimethylsiloxane
Application Method
- Dispenser - Easy to dispense
Cure Method
- Moisture / Condensation Cure - Moisture cure
- Heat
Color
- Brown - Tan
Brand
- Dowsil

Specifications

Cure Specs

Cure Temperature (°C)	20 to 25 Room temperature, 50 to 65
Cure Time (min)	1,440 to 4,320
Tack Free Time (min)	30	Test Method

Bond Strength

Shear Strength (psi)	1.30 (MPa), 1.14 (MPa)	Test Method
Tensile Strength (psi)	1.61 (MPa)

Material Resistance

High Temperature Resistance (°C)	125
Low Temperature Resistance (°C)	-45, -55

Conductivity

Electrical Conductivity (mhos/cm)	Electrically Conductive, Stable
Thermal Conductivity (W/m°K)	2.12
Volume Resistivity (O)	2.7E-3 (Ohm-cm)

Hardness

Shore A Hardness	80	Test Method
Elongation (%)	High, 194
Flexibility	Flexible

Other Properties

Extrusion Rate (g/sec)	132
Specific Gravity	3.370	Test Method

Business Information

Shelf Life (mon)	For best results, Dow adhesives should be stored at or below the storage temperature listed on the product label.

Not Good For

Don't Use With	Non-reactive metal substrates, Non-reactive plastic surfaces, PTFE, Polyethylene, Polypropylene, Plastic substrates that are highly plasticized, Rubber substrates that are highly plasticized

Best Practices for Dow Dowsil EC-6601 Electrically Conductive Adhesive

*See Terms of Use Below
1. Surface Preparation
  
  All surfaces should be thoroughly cleaned and/or degreased with Dow OS fluids, naptha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also recommended. Some cleaning techniques may provide better results than others
  
  users should determine the best techniques for their particular applications.
2. Application
  
  Dow silicone adhesives are specially formulated to provide unprimed adhesion to many reactive metals, ceramics and glass, as well as to selected laminates, resins and plastics. However, good adhesion cannot be expected on non-reactive metal substrates or nonreactive plastic surfaces such as PTFE, polyethylene, or polypropylene. Special surface treatments such as chemical etching or plasma treatment can sometimes provide a reactive surface and promote adhesion to these types of substrates. Dow primers can be used to increase the chemical activity on difficult substrates. Poor adhesion may be experienced on plastic or rubber substrates that are highly plasticized, since the mobile plasticizers act as release agents. Small-scale laboratory evaluation of all substrates is recommended before production trials are made.
3. Curing
  
  DOWSIL™ EC-6601 Electrically Conductive Adhesive is a one-part moisture cure adhesive generally cured at room temperature and in an environment of 30–80 percent relative humidity eliminating the need for curing ovens and the associated costs of energy and capital. Greater than 90 percent of full physical properties should be attained within 24 to 72 hours, and the adhesive and component can be handled in much shorter times of about 30 minutes, depending on the amount applied. The cure rate for this adhesive may be accelerated by heating to 50–65°C. These adhesives are not typically used in highly confined spaces or where a deep section cure is required as they cure from the air-exposed surface inward at a rate of about 1 mm per day. Cure progresses from the outer exposed surface and is dependent on the moisture in the air. Dow adhesives retain their original physical and electrical properties over a broad range of operating conditions which enhance the reliability and service life of electronic devices.
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