Dow Dowsil EC-6601 Electrically Conductive Adhesive Datasheet Dow Dowsil EC-6601 Electrically Conductive Adhesive

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  • Description for Dow Dowsil EC-6601 Electrically Conductive Adhesive

    One-part electrically conductive adhesive with high elongation and stable conductivity designed for electromagnetic compatibility (EMC), durable mechanical and conductive properties, reliable performance.

    *See Terms of Use Below

    Brand Dowsil
    Application Type Bond, Sealant, Gasket
    1 Part or 2 Part 1-Part
    Material Form Liquid
    Substrate Al 5052, Ceramics, Glass, Many reactive metals, Plastics, Al clad
    Industry EMC solutions, PCB grounding, Electronic devices, Electrical connections
    Manufacturer Dow
    Chemistry Polydimethylsiloxane
    Cure Method Moisture cure, Heat
    Cure Temperature (°C) 20 to 25 Room temperature, 50 to 65
    Cure Time (min) 1,440 to 4,320
    Color Tan
    High Temperature Resistance (°C) 125
    Low Temperature Resistance (°C) -45, -55
    Silver (Ag)-Filled Filler: Silver filler composition blend
    Volume Resistivity (O) 2.7E-3 (Ohm-cm)
    Extrusion Rate (g/sec) 132
  • Technical Data for Dow Dowsil EC-6601 Electrically Conductive Adhesive

    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Liquid
    • Substrate
      • Ceramic - Ceramics
      • Glass
      • Metal - Many reactive metals
      • Aluminum - Al clad, Al 5052
      • Plastic - Plastics
      • Other - A variety of substrates, Resins, Selected laminates
    • Industry
      • Electronics - Electrical connections, EMC solutions, Electronic devices
      • Printed Circuit Board (PCB) - PCB grounding
    • Chemistry
    • Application Method
      • Dispenser - Easy to dispense
    • Cure Method
      • Moisture / Condensation Cure - Moisture cure
      • Heat
    • Color
      • Brown - Tan
    • Brand
      • Dowsil
    Cure Specs
    Cure Temperature (°C) 20 to 25 Room temperature, 50 to 65
    Cure Time (min) 1,440 to 4,320
    Tack Free Time (min) 30 Test Method
    Bond Strength
    Shear Strength (psi) 1.30 (MPa), 1.14 (MPa) Test Method
    Tensile Strength (psi) 1.61 (MPa)
    Material Resistance
    High Temperature Resistance (°C) 125
    Low Temperature Resistance (°C) -45, -55
    Electrical Conductivity (mhos/cm) Electrically Conductive, Stable
    Thermal Conductivity (W/m°K) 2.12
    Volume Resistivity (O) 2.7E-3 (Ohm-cm)
    Shore A Hardness 80 Test Method
    Elongation (%) High, 194
    Flexibility Flexible
    Other Properties
    Extrusion Rate (g/sec) 132
    Specific Gravity 3.370 Test Method
    Business Information
    Shelf Life (mon) For best results, Dow adhesives should be stored at or below the storage temperature listed on the product label.
    Not Good For
    Don't Use With Non-reactive metal substrates, Non-reactive plastic surfaces, PTFE, Polyethylene, Polypropylene, Plastic substrates that are highly plasticized, Rubber substrates that are highly plasticized
  • Best Practices for Dow Dowsil EC-6601 Electrically Conductive Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with Dow OS fluids, naptha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also recommended. Some cleaning techniques may provide better results than others

      users should determine the best techniques for their particular applications.

    2. Application

      Dow silicone adhesives are specially formulated to provide unprimed adhesion to many reactive metals, ceramics and glass, as well as to selected laminates, resins and plastics. However, good adhesion cannot be expected on non-reactive metal substrates or nonreactive plastic surfaces such as PTFE, polyethylene, or polypropylene. Special surface treatments such as chemical etching or plasma treatment can sometimes provide a reactive surface and promote adhesion to these types of substrates. Dow primers can be used to increase the chemical activity on difficult substrates. Poor adhesion may be experienced on plastic or rubber substrates that are highly plasticized, since the mobile plasticizers act as release agents. Small-scale laboratory evaluation of all substrates is recommended before production trials are made.

    3. Curing

      DOWSIL™ EC-6601 Electrically Conductive Adhesive is a one-part moisture cure adhesive generally cured at room temperature and in an environment of 30–80 percent relative humidity eliminating the need for curing ovens and the associated costs of energy and capital. Greater than 90 percent of full physical properties should be attained within 24 to 72 hours, and the adhesive and component can be handled in much shorter times of about 30 minutes, depending on the amount applied. The cure rate for this adhesive may be accelerated by heating to 50–65°C. These adhesives are not typically used in highly confined spaces or where a deep section cure is required as they cure from the air-exposed surface inward at a rate of about 1 mm per day. Cure progresses from the outer exposed surface and is dependent on the moisture in the air. Dow adhesives retain their original physical and electrical properties over a broad range of operating conditions which enhance the reliability and service life of electronic devices.

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    *See Terms of Use Below

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Tack Free Time Test Methods
Tack Free Time Test Method
30 min Skin over time
Shear Strength Test Methods
Shear Strength Type Substrate
1.30 (MPa) Lap Shear Adhesion Al 5052 substrate
1.14 (MPa) Lap Shear Adhesion Al clad substrate
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
80 Durometer
Specific Gravity Test Methods
Specific Gravity Test Method
3.370 Cured