Dow Dowsil JCR 6101 Encapsulant

Dow Dowsil JCR 6101 Encapsulant Datasheet
  • Description for Dow Dowsil JCR 6101 Encapsulant

    Translucent, medium-modulus LED gel encapsulant; very long working time.

    *See Terms of Use Below

    Brand Dowsil
    Application Type Adhesive, Encapsulate
    1 Part or 2 Part 1 Part
    Material Form Liquid, Silicone elastomer
    Industry Light Emitting Diodes (LEDs)
    Manufacturer Dow
    Chemistry High purity, Silicone elastomer, Solvent-Free, Phenyl methyl siloxane
    Cure Method Heat
    Cure Temperature (°C) 70, 150
    Cure Time (min) 60, 120
    Viscosity (cPs) 6,200
    Color Translucent white, Translucent white
    High Temperature Resistance (°C) 200, Excellent thermal stability
    Low Temperature Resistance (°C) -45, -55
    Light Refractive Index (RI) 1.4070, 1.3980, 1.3970, 1.4100
  • Technical Data for Dow Dowsil JCR 6101 Encapsulant

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Elastomer - Silicone elastomer
      • Liquid
    • Industry
      • LED (Light-Emitting Diodes) - Light Emitting Diodes (LEDs)
    • Chemistry
    • Cure Method
      • Heat
    • Color
      • Translucent - Translucent white
      • White - Translucent white
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 70, 150
    Cure Time (min) 60, 120
    Viscosity (cPs) 6,200
    Work / Pot Time (min) Very long
    Bond Strength
    Tensile Strength (psi) 245
    Material Resistance
    High Temperature Resistance (°C) 200, Excellent thermal stability
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture resistance
    Conductivity
    Dissipation Factor 6E-04 Test Method
    Dielectric Strength (V/mil) Durable, 565
    Dielectric Constant 2.40 Test Method
    Thermal Conductivity (W/m°K) 0.20
    Volume Resistivity (O) 1.9E+15 (ohm*cm)
    Hardness
    Shore A Hardness 34
    Elongation (%) 170
    Flexibility Flexible
    Modulus (psi) Medium, 174 Test Method
    Other Properties
    Glass Transition Temp (Tg) (°C) -121
    Light Refractive Index (RI) 1.4070, 1.3980, 1.3970, 1.4100 Test Method
    Specific Gravity 1.040 Test Method
    Coefficient of Thermal Expansion (CTE) 300 (ppm/°C)
    Flash Point (°F) 212.0
    % Solids (%) 100
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label., For best results, Dow Corning one-part products require cold storage at or below -5°C (23°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed with head space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen., Check the product label for specific storage conditions., Shelf life is indicated by the “Use Before” date found on the product label. For best results, Dow one-part products require cold storage at or below -5°C (23°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed with head space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Check the product label for specific storage conditions.
    Shelf Life Temperature (°F) <23
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 6
    Not Good For
    Don't Use For Some solder flux residues, Organotin compounds, Unsaturated hydrocarbon plasitcizers, Organometallic compounds, Silicone rubber containing organot, Polysulfides, Sulfur, Polysulfones, Other sulfur containing materials
  • Best Practices for Dow Dowsil JCR 6101 Encapsulant

    *See Terms of Use Below

    1. Surface Preparation

      Surfaces should be clean and dry. Recommended cleaning methods include Dow OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Rougher surfaces tend to promote adhesion of silicones to other surfaces.

    2. Application

      These products are also compatible with commercially available equipment and industry standard processes. These materials can be dispensed or molded depending on the product and application.

    3. Curing

      These products are also compatible with commercially available equipment and industry standard processes. These products can be dispensed or molded depending on the product and application. Dow OS Fluids are recommended to clean cured or uncured silicone residue from application equipment.

      Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

    4. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured silicone indicates incompatibility and inhibition of cure.

  • Comparable Materials for Dow Dowsil JCR 6101 Encapsulant

    *See Terms of Use Below

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Dielectric Constant Test Methods
Dielectric Constant Test Method
2.40 1MHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
6E-04 1MHz
Modulus Test Methods
Modulus Test Method
Medium
174 psi Youngs Modulus
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) Test Method
1.4070 Cures at 633 nm
1.3980 Cured at 1321 nm
1.3970 Cured at 1554 nm
1.4100
Specific Gravity Test Methods
Specific Gravity Test Method
1.040 Cured