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Description for Dow Dowsil JCR 6101 Encapsulant
Translucent, medium-modulus LED gel encapsulant; very long working time.Brand Dowsil Application Type Adhesive, Encapsulate 1 Part or 2 Part 1-Part Material Form Liquid, Silicone elastomer Industry Light Emitting Diodes (LEDs) Manufacturer Dow Chemistry High purity, Silicone elastomer, Solvent-Free, Phenyl methyl siloxane Cure Method Heat Cure Temperature (°C) 70, 150 Cure Time (min) 60, 120 Viscosity (cPs) 6,200 Color Translucent white, Translucent white High Temperature Resistance (°C) 200, Excellent thermal stability Low Temperature Resistance (°C) -45, -55 Volume Resistivity (O) 1.9E+15 (ohm*cm) Light Refractive Index (RI) 1.4070, 1.3980, 1.3970, 1.4100 -
Technical Data for Dow Dowsil JCR 6101 Encapsulant
Overview
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Application Type
- Adhesive
- Pottant / Encapsulant - Encapsulate
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1 Part or 2 Part
- 1-Part
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Material Form
- Elastomer - Silicone elastomer
- Liquid
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Industry
- LED (Light-Emitting Diodes) - Light Emitting Diodes (LEDs)
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Chemistry
- Solvent-Free
- Other - Phenyl methyl siloxane, High purity
- Silicone - Silicone elastomer
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Cure Method
- Heat
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Color
- Translucent - Translucent white
- White - Translucent white
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Brand
- Dowsil
Specifications
Cure Specs
Cure Temperature (°C) 70, 150 Cure Time (min) 60, 120 Viscosity (cPs) 6,200 Work / Pot Time (min) Very long Bond Strength
Tensile Strength (psi) 245 Material Resistance
High Temperature Resistance (°C) 200, Excellent thermal stability Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture resistance Conductivity
Dissipation Factor 6E-04 Test Method Dielectric Strength (V/mil) Durable, 565 Dielectric Constant 2.40 Test Method Thermal Conductivity (W/m°K) 0.20 Volume Resistivity (O) 1.9E+15 (ohm*cm) Hardness
Shore A Hardness 34 Elongation (%) 170 Flexibility Flexible Modulus (psi) Medium, 174 Test Method Other Properties
Glass Transition Temp (Tg) (°C) -121 Light Refractive Index (RI) 1.4070, 1.3980, 1.3970, 1.4100 Test Method Specific Gravity 1.040 Test Method Coefficient of Thermal Expansion (CTE) 300 (ppm/°C) Flash Point (°F) 212.0 % Solids (%) 100 Business Information
Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label., For best results, Dow Corning one-part products require cold storage at or below -5°C (23°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed with head space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen., Check the product label for specific storage conditions., Shelf life is indicated by the “Use Before” date found on the product label. For best results, Dow one-part products require cold storage at or below -5°C (23°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed with head space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Check the product label for specific storage conditions. Shelf Life Temperature (°F) <23 Shelf Life Type From date of manufacture Shelf Life (mon) 6 Not Good For
Don't Use For Some solder flux residues, Organotin compounds, Unsaturated hydrocarbon plasitcizers, Organometallic compounds, Silicone rubber containing organot, Polysulfides, Sulfur, Polysulfones, Other sulfur containing materials -
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Best Practices for Dow Dowsil JCR 6101 Encapsulant
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Surface Preparation
Surfaces should be clean and dry. Recommended cleaning methods include Dow OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Rougher surfaces tend to promote adhesion of silicones to other surfaces.
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Application
These products are also compatible with commercially available equipment and industry standard processes. These materials can be dispensed or molded depending on the product and application.
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Curing
These products are also compatible with commercially available equipment and industry standard processes. These products can be dispensed or molded depending on the product and application. Dow OS Fluids are recommended to clean cured or uncured silicone residue from application equipment.
Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
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Testing
If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured silicone indicates incompatibility and inhibition of cure.
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Dielectric Constant Test Methods
Dielectric Constant | Test Method |
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2.40 | 1MHz |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
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6E-04 | 1MHz |
Modulus Test Methods
Modulus | Test Method |
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Medium | |
174 psi | Youngs Modulus |
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) | Test Method |
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1.4070 | Cures at 633 nm |
1.3980 | Cured at 1321 nm |
1.3970 | Cured at 1554 nm |
1.4100 |
Specific Gravity Test Methods
Specific Gravity | Test Method |
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1.040 | Cured |