Brand Dowsil Application Type Bond 1 Part or 2 Part 2 Part Material Form Liquid, Silicone elastomer Substrate Al Industry Heat sinks, Automotive applications, Advanced driver-assistance systems (ADAS), E-Mobility Solutions, Smart Meters, Smart Home Devices, Hybrids, Microprocessors, Control modules Manufacturer Dow Chemistry Silicone elastomer Cure Method Accelerated heat cure, 2-Part Cure Cure Temperature (°C) 20 to 25, 100, 150 Cure Time (min) Fast, 60, 30 Viscosity (cPs) 59,000, Semi-flowable Color Gray Ozone Resistance Ozone resistance Chemical Resistance Good High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55
Technical Data for Dow Dowsil Q1-9226 Thermally Conductive Adhesive
- Adhesive - Bond
1 Part or 2 Part
- 1 Part or 2 Part - 2 Part
- Elastomer - Silicone elastomer
- Aluminum - Al
- Other - Many substrates, Organic substrates, Ceramic substrates
- Silicone - Silicone elastomer
- Dispenser - Automated, Manual dispensing
- Heat - Accelerated heat cure
- 2-Part Cure
Cure Temperature (°C) 20 to 25, 100, 150 Test Method Cure Time (min) Fast, 60, 30 Test Method Viscosity (cPs) 59,000, Semi-flowable Test Method Work / Pot Time (min) Long
Shear Strength (psi) 375 Test Method Tensile Strength (psi) 600
Ozone Resistance Ozone resistance Chemical Resistance Good UV Resistance UV resistance Environmental Resistance Environmental resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture/humidity resistance
Dissipation Factor 0.00130 Test Method Filler Filler Dielectric Strength (V/mil) 630 Dielectric Constant 4.50 Test Method Thermal Conductivity (W/m°K) 0.80, Thermally conductive Test Method Volume Resistivity (O) 1.9E+14 (ohms/cm)
Shore A Hardness 67 Test Method Elongation (%) 124 Flexibility Flexible
Specific Gravity 2.140 Test Method
Shelf Life Details The product should be stored in its original packaging with the cover tightly attached to avoid any contamination. Store in accordance with any special instructions listed on the product label. The product should be used by the indicated Exp. Date found on the label. Shelf Life Type From date of manufacture Shelf Life (mon) 12
Not Good For
Don't Use With non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene
Best Practices for Dow Dowsil Q1-9226 Thermally Conductive Adhesive
All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.
Upon standing, some filler may settle to the bottom of the liquid after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use. Two-part materials should be mixed in the proper ratio either by weight or volume. The presence of light-colored streaks or marbling indicates inadequate mixing.
Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of >28 inches Hg (or a residual pressure of 10-20 mm of Hg) for 10 minutes or until bubbling subsides.
Addition-cure silicones should be cured at 100°C (212°F) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). For thicker sections, a pre-cure at 70°C (158°F) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70°C (158°F) be used as a starting point for determining necessary precure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These products generally have long working times.
SUBSTRATE TESTING: To ensure maximum bond strength for adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.
Comparable Materials for Dow Dowsil Q1-9226 Thermally Conductive Adhesive
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Cure Temperature Test Methods
|Cure Temperature||Cure Time Test Method|
|20 to 25°C|
|100°C||Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.|
|150°C||Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.|
Cure Time Test Methods
|Cure Time||Test Method|
|60 min||Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.|
Viscosity Test Methods
Shear Strength Test Methods
|Shear Strength||Type||Substrate||Test Method|
|375 psi||Lap Shear strength||AL||Unprimed Adhesion|
Dielectric Constant Test Methods
|Dielectric Constant||Test Method|
|4.50||Dielectric constant, 100 KHz|
Dissipation Factor Test Methods
|Dissipation Factor||Test Method|
|0.00130||Dissipation factor, 100 KHz|
Thermal Conductivity Test Methods
|Thermal Conductivity||Test Method|
|0.80 W/m°K||hot disk|
Shore A Hardness Test Methods
|Shore A Hardness||Shore Hardness Test Method|
Specific Gravity Test Methods
|Specific Gravity||Test Method|