Dow Dowsil Q1-9226 Thermally Conductive Adhesive Datasheet Dow Dowsil Q1-9226 Thermally Conductive Adhesive

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  • Description for Dow Dowsil Q1-9226 Thermally Conductive Adhesive

    Two-part, semi-flowable thermally conductive adhesive, Accelerated heat cure, Self priming adhesion to many<br/>substrates, Long pot life for ease of use,

    *See Terms of Use Below

    Brand Dowsil
    Chemical Resistance Good
    Application Type Bond
    1 Part or 2 Part 2-Part
    Material Form Liquid, Silicone elastomer
    Substrate Al
    Industry Heat sinks, Automotive applications, Smart Meters, Advanced driver-assistance systems (ADAS), E-Mobility Solutions, Smart Home Devices, Hybrids, Microprocessors, Control modules
    Manufacturer Dow
    Chemistry Silicone elastomer
    Cure Method 2-Part Cure, Accelerated heat cure
    Cure Temperature (°C) 20 to 25, 100, 150
    Cure Time (min) Fast, 60, 30
    Viscosity (cPs) 59,000, Semi-flowable
    Color Gray
    Ozone Resistance Ozone resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Volume Resistivity (O) 1.9E+14 (ohms/cm)

  • Technical Data for Dow Dowsil Q1-9226 Thermally Conductive Adhesive

    *See Terms of Use Below

    Overview
    • Chemical Resistance
      • Chemical Resistance - Good
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Elastomer - Silicone elastomer
      • Liquid
    • Substrate
      • Aluminum - Al
      • Other - Many substrates, Organic substrates, Ceramic substrates
    • Industry
      • Smart Meters
      • Smart Home Devices
      • Automotive - Automotive applications
      • Advanced driver-assistance systems (ADAS)
      • E-Mobility Solutions
      • Electronics - Heat sinks, Hybrids, Microprocessors, Control modules
    • Chemistry
    • Application Method
      • Dispenser - Automated, Manual dispensing
    • Cure Method
      • Heat - Accelerated heat cure
      • 2-Part Cure
    • Color
      • Gray
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25, 100, 150 Test Method
    Cure Time (min) Fast, 60, 30 Test Method
    Viscosity (cPs) 59,000, Semi-flowable Test Method
    Work / Pot Time (min) Long
    Bond Strength
    Shear Strength (psi) 375 Test Method
    Tensile Strength (psi) 600
    Material Resistance
    Ozone Resistance Ozone resistance
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00130 Test Method
    Filler Filler
    Dielectric Strength (V/mil) 630
    Dielectric Constant 4.50 Test Method
    Thermal Conductivity (W/m°K) 0.80, Thermally conductive Test Method
    Volume Resistivity (O) 1.9E+14 (ohms/cm)
    Hardness
    Shore A Hardness 67 Test Method
    Elongation (%) 124
    Flexibility Flexible
    Other Properties
    Specific Gravity 2.140 Test Method
    Business Information
    Shelf Life Details The product should be stored in its original packaging with the cover tightly attached to avoid any contamination. Store in accordance with any special instructions listed on the product label. The product should be used by the indicated Exp. Date found on the label.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 12
    Not Good For
    Don't Use With non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene

  • Best Practices for Dow Dowsil Q1-9226 Thermally Conductive Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.

    2. Mixing

      Upon standing, some filler may settle to the bottom of the liquid after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use. Two-part materials should be mixed in the proper ratio either by weight or volume. The presence of light-colored streaks or marbling indicates inadequate mixing.

    3. Deairing/Degassing

      Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of >28 inches Hg (or a residual pressure of 10-20 mm of Hg) for 10 minutes or until bubbling subsides.

    4. Curing

      Addition-cure silicones should be cured at 100°C (212°F) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). For thicker sections, a pre-cure at 70°C (158°F) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70°C (158°F) be used as a starting point for determining necessary precure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These products generally have long working times.

    5. Testing

      SUBSTRATE TESTING: To ensure maximum bond strength for adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C
100°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
150°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
Cure Time Test Methods
Cure Time Test Method
Fast
60 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
30 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
Viscosity Test Methods
Viscosity Test Method
59,000 cPs
Semi-flowable Mixed
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
375 psi Lap Shear strength AL Unprimed Adhesion
Dielectric Constant Test Methods
Dielectric Constant Test Method
4.50 Dielectric constant, 100 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00130 Dissipation factor, 100 KHz
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
0.80 W/m°K hot disk
Thermally conductive
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
67 Durometer
Specific Gravity Test Methods
Specific Gravity Test Method
2.140 Cured