Dow Dowsil Q3-6611 Adhesive

Dow Dowsil Q3-6611 Adhesive Datasheet
  • Description for Dow Dowsil Q3-6611 Adhesive

    Noncorrosive; self-priming; rapid heat cure; high strength; moderate flow.

    *See Terms of Use Below

    Brand Dowsil
    Application Type Bond, Seal, Gasket
    1 Part or 2 Part 1 Part
    Material Form Liquid, Silicone elastomer
    Substrate ABS, Aluminum
    Industry Connector sealing, Lighting, Engine controllers, E-Mobility Solutions, Smart Meters, Smart Home Devices
    Manufacturer Dow
    Chemistry Silicone elastomer
    Cure Method Heat, Addition cure
    Cure Temperature (°C) 125, 150
    Cure Time (min) 60, 30
    Viscosity (cPs) 87,025
    Color Gray
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
  • Technical Data for Dow Dowsil Q3-6611 Adhesive

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Elastomer - Silicone elastomer
      • Liquid
    • Substrate
    • Industry
      • Lighting
      • Other Transportation - Transmission controllers
      • E-Mobility Solutions
      • Connectors - Connector sealing
      • Smart Meters
      • Smart Home Devices
      • Industrial - Housings, Sealing lids
      • Engine - Engine controllers
      • Construction - Attaching baseplates
    • Chemistry
    • Application Method
      • Dispenser - Automated or manual needle dispense
      • Flow - Flowable
    • Cure Method
      • Heat
      • 2-Part Cure - Addition cure
    • Color
      • Gray
    • Brand
      • Dowsil
    • Also Known As
      • Old Name - Q3-6611 Adhesive Grey
    Specifications
    Cure Specs
    Cure Temperature (°C) 125, 150 Test Method
    Cure Time (min) 60, 30 Test Method
    Viscosity (cPs) 87,025
    Work / Pot Time (min) Long Test Method
    Bond Strength
    General Bond Strength (psi) High
    Shear Strength (psi) 880 Test Method
    Tensile Strength (psi) 850, High
    Material Resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.01200, 0.00310 Test Method
    Dielectric Strength (V/mil) Good, Durable, 350
    Dielectric Constant 3.02, 2.95 Test Method
    Thermal Conductivity (W/m°K) 0.32
    Volume Resistivity (O) 1.6E+14 (ohms/cm)
    Hardness
    Shore A Hardness 59
    Elongation (%) 2
    Flexibility Flexible
    Other Properties
    Specific Gravity 1.310 Test Method
    Coefficient of Thermal Expansion (CTE) 250 (Linear (micron/m °C or ppm )) Test Method
    Business Information
    Shelf Life Details Refer to product label for storage temperature conditions. Containers should be kept tightly closed and kept in cold storage at all times to extend shelf life. Shelf life is indicated by the “Use Before” date found on the product label.
    Shelf Life Temperature (°F) 41
    Shelf Life (mon) 12
    Not Good For
    Don't Use With Plastic, rubber
  • Best Practices for Dow Dowsil Q3-6611 Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with Dow Corning® brand OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others

      users should determine the best techniques for their particular applications.

    2. Mixing

      Upon standing, some filler may settle to the bottom of the liquid containers after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use. Two-part materials should be mixed in the proper ratio (1:1 or 10:1) either by weight or volume. The presence of light colored streaks or marbling indicates inadequate mixing.

    3. Deairing/Degassing

      Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of >28 inches Hg for 10 minutes or until bubbling subsides.

    4. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is desired. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or can detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

  • Comparable Materials for Dow Dowsil Q3-6611 Adhesive

    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
125°C Heat Cure
150°C Heat Cure
Cure Time Test Methods
Cure Time Test Method
60 min Heat Cure
30 min Heat Cure
Work / Pot Time Test Methods
Work / Pot Time Temperature
Long
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
880 psi Lap shear strength Aluminum Unprimed Adhesion
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.02 Dielectric constant, 100 Hz
2.95 Dielectric constant, 100 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.01200 Dissipation factor, 100 Hz
0.00310 Dissipation factor, 100 KHz
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
250 (Linear (micron/m °C or ppm )) by TMA
Specific Gravity Test Methods
Specific Gravity Test Method
1.310 Cured