Dow Dowsil SE 1700 Adhesive

Dow Dowsil SE 1700 Adhesive Datasheet
  • Description for Dow Dowsil SE 1700 Adhesive

    • 2-part • Translucent • White • Non-flowing • Heat cure • High tensile strength • Long working time

    *See Terms of Use Below

    Brand Dowsil
    Application Type Bonding, Sealing
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Aluminum, Plastics, Glass, Ceramics, Many reactive metals
    Industry E-Mobility Solutions, Smart Meters, Smart Home Devices, Sealing PCB components, Bonding agent for key pad of PC, PCB assemblies
    Manufacturer Dow
    Chemistry Polydimethylsiloxane
    Cure Method Heat cure, 2-Part Cure, Addition-curing
    Cure Temperature (°C) 150
    Viscosity (cPs) Non-flowing, 542,000
    Color Translucent, White
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
  • Technical Data for Dow Dowsil SE 1700 Adhesive

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Liquid
    • Substrate
    • Industry
      • E-Mobility Solutions
      • Electronics - Bonding agent for key pad of PC
      • Smart Meters
      • Smart Home Devices
      • Printed Circuit Board (PCB) - Sealing PCB components, PCB assemblies
      • Industrial - Sealing ceramic condensers
    • Chemistry
    • Cure Method
      • Heat - Heat cure
      • 2-Part Cure
      • Other - Addition-curing
    • Color
      • Translucent
      • White
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 150 Test Method
    Viscosity (cPs) Non-flowing, 542,000 Test Method
    Work / Pot Time (min) Long, 480 Test Method
    Mix Ratio 10:1
    Bond Strength
    General Bond Strength (psi) High
    Shear Strength (psi) 390 Test Method
    Tensile Strength (psi) 985, High Test Method
    Material Resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55 Test Method
    Moisture/Humidity Resistance Moisture resistance, Humidity resistance
    Conductivity
    Dissipation Factor 0.00100 Test Method
    Dielectric Strength (V/mil) Good, Durable Test Method
    Dielectric Constant 3.00 Test Method
    Volume Resistivity (O) 5.0 E+14 (ohm*cm) Test Method
    Hardness
    Shore A Hardness 48 Test Method
    Elongation (%) 355 Test Method
    Flexibility Flexible
    Other Properties
    Specific Gravity 1.130 Test Method
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label.
    Shelf Life Temperature (°F) 77
    Shelf Life (mon) 18
    Not Good For
    Don't Use For Other sulfur containing materials, Some solder flux residues, Polysulfides, Other organometallic compounds, Sulfur, Unsaturated hydrocarbon plasticizers, Polysulfones, Organotin, Silicone rubber containing organotin catalyst, Chemicals
    Don't Use With Polyethylene, Non-reactive plastic surfaces, Plasticizers, Certain materials, Plastic substrates that are highly plasticized, Polypropylene, Teflon®, Non-reactive metal substrates, Curing agents, Rubber substrates that are highly plasticized
  • Best Practices for Dow Dowsil SE 1700 Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with Dow OS fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others

      users should determine the best techniques for their particular applications.

    2. Mixing

      Dow silicone 10:1 adhesives are supplied in two parts that do not require lot matching. The 10:1 mix ratio, by weight, simplifies the proportioning process. To ensure uniform distribution of filler, Part A must be thoroughly mixed prior to combination with Part B. When thoroughly blended, the Part A and B liquid mixture should have a uniform appearance. The presence of light colored streaks or marbling indicates inadequate mixing and will result in incomplete cure. For fast-curing adhesives automated mix and dispense equipment should be utilized.

    3. Deairing/Degassing

      In applications sensitive to air entrapment, de-airing with 28 to 30 inches Hg vacuum is required.

    4. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is desired. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or can detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

  • Comparable Materials for Dow Dowsil SE 1700 Adhesive

    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
150°C Heat Cure,These values are not intended for use in preparing specifications.
Cure Time Test Methods
Cure Time Test Method
Viscosity Test Methods
Viscosity Test Method
Non-flowing
542,000 cPs Mixed, These values are not intended for use in preparing specifications.
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Long Pot Life, These values are not intended for use in preparing specifications.
480 min These values are not intended for use in preparing specifications. 25°C
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
390 psi Lap Shear Aluminum Unprimed Adhesion, These values are not intended for use in preparing specifications.
Tensile Strength Test Methods
Tensile Strength Test Method
985 psi These values are not intended for use in preparing specifications.
High
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-45°C
-55°C Thermal cycling
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.00 @ 1 MHz, JIS K 6249, These values are not intended for use in preparing specifications.
Dielectric Strength Test Methods
Dielectric Strength Test Method
Good JIS K 6249, These values are not intended for use in preparing specifications.
Durable
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00100 @ 1 MHz, JIS K 6249, These values are not intended for use in preparing specifications.
Volume Resistivity Test Methods
Volume Resistivity Test Method
5.0 E+14 (ohm*cm) JIS K 6249, These values are not intended for use in preparing specifications.
Elongation Test Methods
Elongation Test Method
355 % These values are not intended for use in preparing specifications.
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
48 These values are not intended for use in preparing specifications., JIS: Japanese Industrial Standard, Durometer
Specific Gravity Test Methods
Specific Gravity Test Method
1.130 Cured, These values are not intended for use in preparing specifications.