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Description for Dow Dowsil SE 1713 Adhesive
One-part, beige, flowable adhesive with high tensile strength.Brand Dowsil Application Type Adhesive, Gaskets 1 Part or 2 Part 1-Part Material Form Liquid Substrate Aluminum, Ceramics, Glass, Many Reactive Metals, Selected Plastics, Selected Resins Industry Electronic components, Fixturing parts to printed circuit board, Flyback transformer, Reinforcing or fixing parts of connectors, Sealing housings for ECUs, Electronic modules, Electronics parts, Sealing power modules Manufacturer Dow Chemistry Silicone, No added solvents Cure Method Heat, Addition Cure Cure Temperature (°C) Faster or lower, 20 to 25, >100, 150, 70 Cure Time (min) 30, 30 Viscosity (cPs) 91,200, Flowable, Self-leveling Color Beige High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Volume Resistivity (O) 8.66 E+15 (ohm*cm) -
Technical Data for Dow Dowsil SE 1713 Adhesive
Overview
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Application Type
- Gasketing - Gaskets
- Adhesive
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1 Part or 2 Part
- 1-Part
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Material Form
- Liquid
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Industry
- Electronic Control Unit - Sealing housings for ECUs
- Electronics - Electronic components, Electronic modules, Electronics parts, Sealing power modules
- Printed Circuit Board (PCB) - Fixturing parts to printed circuit board
- Transformers - Flyback transformer
- Connectors - Reinforcing or fixing parts of connectors
- Industrial - Condensers, Housing seals, Sealing lids
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Chemistry
- Solvent-Free - No added solvents
- Silicone
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Application Method
- Dispenser - Automated or manual needle dispense
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Cure Method
- Addition cure
- Heat
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Color
- Brown - Beige
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Brand
- Dowsil
Specifications
Cure Specs
Cure Temperature (°C) Faster or lower, 20 to 25, >100, 150, 70 Test Method Cure Time (min) 30, 30 Test Method Viscosity (cPs) 91,200, Flowable, Self-leveling Tack Free Time (min) Fast Test Method Work / Pot Time (min) Long Test Method Bond Strength
General Bond Strength (psi) High Shear Strength (psi) 740, 790, 830, 700 Test Method Tensile Strength (psi) 1,080, High Material Resistance
Environmental Resistance Environmental resistance High Temperature Resistance (°C) 200 Test Method Low Temperature Resistance (°C) -45, -55 Test Method Moisture/Humidity Resistance Moisture/humidity resistance Conductivity
Dissipation Factor 0.00300 Test Method Dielectric Strength (V/mil) Good, Durable, 725 Test Method Dielectric Constant 3.00 Test Method Volume Resistivity (O) 8.66 E+15 (ohm*cm) Test Method Hardness
Shore A Hardness 61 Test Method Elongation (%) 205 Flexibility Flexible Other Properties
Specific Gravity 1.270 Test Method Business Information
Shelf Life Details Dow heat-cure adhesives should be stored at or below 25°C (77°C). Containers should be kept tightly closed and kept in cold storage at all times to extend shelf life. Shelf life is indicated by the “Use Before” date found on the product label. Shelf Life Temperature (°F) 41, 77 Shelf Life Type From date of manufacture Shelf Life (mon) 8 Not Good For
Don't Use With Rubber, Non-reactive metal substrates, Non-reactive plastic surfaces, Teflon®, Polyethylene, Polypropylene, Plastic or Rubber Substrates that are Highly Plasticized -
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Best Practices for Dow Dowsil SE 1713 Adhesive
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Surface Preparation
All surfaces should be thoroughly cleaned and/or degreased with Dow Corning® brand OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others
users should determine the best techniques for their particular applications.
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Mixing
Upon standing, some filler may settle to the bottom of the liquid containers after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use. Two-part materials should be mixed in the proper ratio (1:1 or 10:1) either by weight or volume. The presence of light colored streaks or marbling indicates inadequate mixing.
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Deairing/Degassing
Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of >28 inches Hg for 10 minutes or until bubbling subsides.
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Curing
Heat cure (addition-curing) adhesives are typically cured at 100°C (212°F) or higher. Their cure rate is rapidly accelerated with heat (see cure schedules in table) and an optimum cure schedule will balance processing performance and costs. For thicker sections or if voiding is observed the use of a 30-minute pre-cure at 70°C (158°F) or the use of an adhesive with low-void technology may reduce voids. Addition-cure silicones are formulated with all necessary ingredients for cure and there are no by-products generated during the cure process. Deep-section or confined cures are possible as cure reactions progress evenly throughout the material.
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Testing
Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is desired. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or can detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
---|---|
Faster or lower | |
20 to 25°C | |
>100°C | |
150°C | Heat Cure |
70°C | Pre-Cure |
Cure Time Test Methods
Cure Time | Test Method |
---|---|
30 min | Heat Cure |
30 min | Pre-Cure |
Tack Free Time Test Methods
Tack Free Time | Tack Free Temperature |
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Fast |
Work / Pot Time Test Methods
Work / Pot Time | Temperature |
---|---|
Long |
Shear Strength Test Methods
Shear Strength | Type | Substrate | Test Method |
---|---|---|---|
740 psi | Lap shear strength | Unprimed Adhesion | |
790 psi | Lap Shear Strength | Aluminum | Unprimed Adhesion |
830 psi | Lap Shear Strength | Glass | Unprimed Adhesion |
700 psi | Lap Shear Strength | FR4 | Unprimed Adhesion |
High Temperature Resistance Test Methods
High Temperature Resistance | Test Method |
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200°C | Operational |
Low Temperature Resistance Test Methods
Low Temperature Resistance | Test Method |
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-45°C | Operational |
-55°C | Operational |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
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3.00 | @ 1MHz (JIS K 6249) |
Dielectric Strength Test Methods
Dielectric Strength | Test Method |
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Good | |
Durable | |
725 V/mil | JIS K 6249 |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
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0.00300 | @ 1MHZ (JIS K 6249) |
Volume Resistivity Test Methods
Volume Resistivity | Test Method |
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8.66 E+15 (ohm*cm) | JIS K 6249 |
Shore A Hardness Test Methods
Shore A Hardness | Shore Hardness Test Method |
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61 | Durometer (JIS) |
Specific Gravity Test Methods
Specific Gravity | Test Method |
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1.270 | Cured |