Dow Dowsil SE 1714 Beige or Black Datasheet Dow Dowsil SE 1714 Beige or Black

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  • Description for Dow Dowsil SE 1714 Beige or Black

    A one-part, beige or black, flowable adhesive with high tensile strength sealing lids and housings for ECUs, power modules.

    *See Terms of Use Below

    Brand Dowsil
    Application Type Bond, Sealing, Gasketing
    1 Part or 2 Part 1-Part
    Material Form Pre-Cure: Liquid, Post-Cure: Elastomer
    Substrate Aluminum, Ceramics, FR4, Glass, Reactive metals, Selected plastics, Selected resins
    Industry Electronic components, Fixturing PCB, Flyback transformer, Fixing parts of connectors, Sealing housings for ECUs, E-Mobility Solutions, Smart Home Devices, Reinforcing, Electronic modules, Electronics parts, Fixturing system(s) assembly to circuit boards, Condensers
    Manufacturer Dow
    Chemistry Silicone, No added solvents
    Cure Method Heat cure, Addition Cure
    Cure Temperature (°C) 150, 70
    Cure Time (min) 30, 30
    Viscosity (cPs) 58,800, Flowable
    Color Black, Beige
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Volume Resistivity (O) 5.0 E+15 (ohm*cm)

  • Technical Data for Dow Dowsil SE 1714 Beige or Black

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Elastomer - Post-Cure: Elastomer
      • Liquid - Pre-Cure: Liquid
    • Substrate
    • Industry
      • Smart Home Devices
      • Electronic Control Unit - Sealing housings for ECUs
      • E-Mobility Solutions
      • Electronics - Electronic components, Electronic modules, Electronics parts, Condensers, Fixturing system(s) assembly to circuit boards
      • Printed Circuit Board (PCB) - Fixturing PCB
      • Transformers - Flyback transformer
      • Connectors - Fixing parts of connectors
      • Power Supplies - Power modules
      • Industrial - Sealing lids
      • Reinforcement - Reinforcing
    • Chemistry
    • Application Method
      • Dispenser - Automated or manual needle dispense
    • Cure Method
      • Addition cure
      • Heat - Heat cure
    • Color
      • Black
      • Brown - Beige
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 150, 70 Test Method
    Cure Time (min) 30, 30 Test Method
    Viscosity (cPs) 58,800, Flowable
    Tack Free Time (min) Fast
    Work / Pot Time (min) Long
    Bond Strength
    General Bond Strength (psi) High
    Shear Strength (psi) 790, 810, 610, 500 Test Method
    Tensile Strength (psi) 1,030, High
    Material Resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture resistance, Humidity resistance
    Conductivity
    Dissipation Factor 0.00280 Test Method
    Dielectric Strength (V/mil) Good, 750 Test Method
    Dielectric Constant 3.10 Test Method
    Thermal Conductivity (W/m°K) 0.90
    Volume Resistivity (O) 5.0 E+15 (ohm*cm) Test Method
    Hardness
    Shore A Hardness 66 Test Method
    Elongation (%) 230
    Flexibility Flexible
    Modulus (psi) 450 Test Method
    Other Properties
    Specific Gravity 1.300 Test Method
    Business Information
    Shelf Life Details Dow heat-cure adhesives should be stored at or below 25°C (77°C). Containers should be kept tightly closed and kept in cold storage at all times to extend shelf life. Shelf life is indicated by the “Use Before” date found on the product label.
    Shelf Life Temperature (°F) 41
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 9
    Not Good For
    Don't Use For Acetone, Isopropyl alcohol (IPA)
    Don't Use With Non-reactive metal substrates, Non-reactive plastic surfaces, Teflon, Polyethylene, Polypropylene, Plastic substrates that are highly plasticized, Rubber substrates that are highly plasticized

  • Best Practices for Dow Dowsil SE 1714 Beige or Black

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with DOWSIL™ OS fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others

      users should determine the best techniques for their particular applications.

    2. Mixing

      Upon standing, some filler may settle to the bottom of the liquid containers after several weeks. To ensure a uniform product mix, the material in the container should be thoroughly mixed prior to use.

    3. Deairing/Degassing

      Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of > 28 inches Hg for 10 minutes or until bubbling subsides.

    4. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is desired. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or can detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

  • Comparable Materials for Dow Dowsil SE 1714 Beige or Black

    *See Terms of Use Below

    Spec Engine® Results

    • Dow
      Dowsil SE 1750 Adhesive(Dow)

      One-part, flowable adhesive with high tensile strength, Heat Cure, No added solvents, These adhesives generally have long working times so users can enjoy the greatest manufacturing flexibility and reduce waste.

    • CHT
      AS1420-100(CHT)

      A heat cured, non-corrosive, neutral cure, 1-part, silicone adhesive sealant suitable for use with electronic components.

    • Compare All
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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
150°C Heat cure
70°C Pre-cure
Cure Time Test Methods
Cure Time Test Method
30 min Heat cure
30 min Pre-cure
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
790 psi Lap Shear Aluminum Unprimed Adhesion
810 psi Lap Shear Glass Unprimed Adhesion
610 psi Lap Shear FR4 Unprimed Adhesion
500 psi Lap Shear PPS Unprimed Adhesion
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.10 @ 1 MHz (JIS K 6249)
Dielectric Strength Test Methods
Dielectric Strength Test Method
Good
750 V/mil JIS K 6249
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00280 @ 1 MHZ (JIS K 6249)
Volume Resistivity Test Methods
Volume Resistivity Test Method
5.0 E+15 (ohm*cm) JIS K 6249
Modulus Test Methods
Modulus Test Method
450 psi Tensile Modulus
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
66 Durometer, JIS
Specific Gravity Test Methods
Specific Gravity Test Method
1.300 Cured