

-
Description for Dow Dowsil SE 1714 Beige or Black
A one-part, beige or black, flowable adhesive with high tensile strength sealing lids and housings for ECUs, power modules.Brand Dowsil Application Type Bond, Sealing, Gasketing 1 Part or 2 Part 1-Part Material Form Pre-Cure: Liquid, Post-Cure: Elastomer Substrate Aluminum, Ceramics, FR4, Glass, Reactive metals, Selected plastics, Selected resins Industry Electronic components, Fixturing PCB, Flyback transformer, Fixing parts of connectors, Sealing housings for ECUs, E-Mobility Solutions, Smart Home Devices, Reinforcing, Electronic modules, Electronics parts, Fixturing system(s) assembly to circuit boards, Condensers Manufacturer Dow Chemistry Silicone, No added solvents Cure Method Heat cure, Addition Cure Cure Temperature (°C) 150, 70 Cure Time (min) 30, 30 Viscosity (cPs) 58,800, Flowable Color Black, Beige High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Volume Resistivity (O) 5.0 E+15 (ohm*cm) -
Technical Data for Dow Dowsil SE 1714 Beige or Black
Overview
-
1 Part or 2 Part
- 1-Part
-
Material Form
- Elastomer - Post-Cure: Elastomer
- Liquid - Pre-Cure: Liquid
-
Industry
- Smart Home Devices
- Electronic Control Unit - Sealing housings for ECUs
- E-Mobility Solutions
- Electronics - Electronic components, Electronic modules, Electronics parts, Condensers, Fixturing system(s) assembly to circuit boards
- Printed Circuit Board (PCB) - Fixturing PCB
- Transformers - Flyback transformer
- Connectors - Fixing parts of connectors
- Power Supplies - Power modules
- Industrial - Sealing lids
- Reinforcement - Reinforcing
-
Chemistry
- Solvent-Free - No added solvents
- Silicone
-
Application Method
- Dispenser - Automated or manual needle dispense
-
Cure Method
- Addition cure
- Heat - Heat cure
-
Color
- Black
- Brown - Beige
-
Brand
- Dowsil
Specifications
Cure Specs
Cure Temperature (°C) 150, 70 Test Method Cure Time (min) 30, 30 Test Method Viscosity (cPs) 58,800, Flowable Tack Free Time (min) Fast Work / Pot Time (min) Long Bond Strength
General Bond Strength (psi) High Shear Strength (psi) 790, 810, 610, 500 Test Method Tensile Strength (psi) 1,030, High Material Resistance
Environmental Resistance Environmental resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture resistance, Humidity resistance Conductivity
Dissipation Factor 0.00280 Test Method Dielectric Strength (V/mil) Good, 750 Test Method Dielectric Constant 3.10 Test Method Thermal Conductivity (W/m°K) 0.90 Volume Resistivity (O) 5.0 E+15 (ohm*cm) Test Method Hardness
Shore A Hardness 66 Test Method Elongation (%) 230 Flexibility Flexible Modulus (psi) 450 Test Method Other Properties
Specific Gravity 1.300 Test Method Business Information
Shelf Life Details Dow heat-cure adhesives should be stored at or below 25°C (77°C). Containers should be kept tightly closed and kept in cold storage at all times to extend shelf life. Shelf life is indicated by the “Use Before” date found on the product label. Shelf Life Temperature (°F) 41 Shelf Life Type From date of manufacture Shelf Life (mon) 9 Not Good For
Don't Use For Acetone, Isopropyl alcohol (IPA) Don't Use With Non-reactive metal substrates, Non-reactive plastic surfaces, Teflon, Polyethylene, Polypropylene, Plastic substrates that are highly plasticized, Rubber substrates that are highly plasticized -
Best Practices for Dow Dowsil SE 1714 Beige or Black
-
Surface Preparation
All surfaces should be thoroughly cleaned and/or degreased with DOWSIL™ OS fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others
users should determine the best techniques for their particular applications.
-
Mixing
Upon standing, some filler may settle to the bottom of the liquid containers after several weeks. To ensure a uniform product mix, the material in the container should be thoroughly mixed prior to use.
-
Deairing/Degassing
Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of > 28 inches Hg for 10 minutes or until bubbling subsides.
-
Testing
Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is desired. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or can detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.
-
-
Comparable Materials for Dow Dowsil SE 1714 Beige or Black
Spec Engine® Results
Popular Articles
What Are the Differences Between Adhesives and Sealants?
Read ArticleInfographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation
Read ArticleSilicones in LED Lighting | Gluespec
Read ArticleTesting the effectiveness of surface treatments
Read ArticleSponsored Articles
Unique Advantages of Contact Adhesives
Read ArticleUsing LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials
Read ArticleSylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:
Read ArticleCase Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive
Read ArticleFeatured Ads

Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
---|---|
150°C | Heat cure |
70°C | Pre-cure |
Cure Time Test Methods
Cure Time | Test Method |
---|---|
30 min | Heat cure |
30 min | Pre-cure |
Shear Strength Test Methods
Shear Strength | Type | Substrate | Test Method |
---|---|---|---|
790 psi | Lap Shear | Aluminum | Unprimed Adhesion |
810 psi | Lap Shear | Glass | Unprimed Adhesion |
610 psi | Lap Shear | FR4 | Unprimed Adhesion |
500 psi | Lap Shear | PPS | Unprimed Adhesion |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
---|---|
3.10 | @ 1 MHz (JIS K 6249) |
Dielectric Strength Test Methods
Dielectric Strength | Test Method |
---|---|
Good | |
750 V/mil | JIS K 6249 |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
---|---|
0.00280 | @ 1 MHZ (JIS K 6249) |
Volume Resistivity Test Methods
Volume Resistivity | Test Method |
---|---|
5.0 E+15 (ohm*cm) | JIS K 6249 |
Modulus Test Methods
Modulus | Test Method |
---|---|
450 psi | Tensile Modulus |
Shore A Hardness Test Methods
Shore A Hardness | Shore Hardness Test Method |
---|---|
66 | Durometer, JIS |
Specific Gravity Test Methods
Specific Gravity | Test Method |
---|---|
1.300 | Cured |